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Extract from the Register of European Patents

EP About this file: EP1463105

EP1463105 - Semiconductor device and method of manufacturing the same by a transfer technique [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  03.02.2017
Database last updated on 01.02.2025
Most recent event   Tooltip03.02.2017Application deemed to be withdrawnpublished on 08.03.2017  [2017/10]
Applicant(s)For:AT  BE  BG 
Sharp Kabushiki Kaisha
22-22, Nagaike-cho
Abeno-ku
Osaka
Osaka 545-8522 / JP
[N/P]
Former [2004/40]For:AT  BE  BG 
Sharp Kabushiki Kaisha
22-22, Nagaike-cho, Abeno-ku
Osaka, Osaka 545-8522 / JP
Inventor(s)01 / Takafuji, Yutaka
13-8 3-chome Jingu Nara-shi
631-0804, Nara / JP
02 / Itoga, Takashi
303-1-301 4-chome Omiya-cho Nara-shi
630-8115, Nara / JP
 [2004/40]
Representative(s)Suckling, Andrew Michael
Marks & Clerk LLP
2nd Floor, Wytham Court
11 West Way
Oxford OX2 0JB / GB
[N/P]
Former [2004/40]Suckling, Andrew Michael
Marks & Clerk, 4220 Nash Court, Oxford Business Park South
Oxford, Oxfordshire OX4 2RU / GB
Application number, filing date04101161.019.03.2004
[2004/40]
Priority number, dateJP2003007728320.03.2003         Original published format: JP 2003077283
[2004/40]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1463105
Date:29.09.2004
Language:EN
[2004/40]
Type: A3 Search report 
No.:EP1463105
Date:03.10.2012
Language:EN
[2012/40]
Search report(s)(Supplementary) European search report - dispatched on:EP04.09.2012
ClassificationIPC:H01L21/60, H01L21/68, H01L21/762
[2004/40]
CPC:
H10D86/0214 (EP,US); H01L21/6835 (EP,US); H01L21/76254 (EP,US);
H01L21/76259 (EP,US); H01L24/24 (EP,US); H01L24/26 (EP,US);
H01L24/82 (EP,US); H01L24/83 (EP,US); H10D86/40 (EP,US);
H10D86/411 (EP,US); H10D86/60 (EP,US); H01L2221/68359 (EP,US);
H01L2221/68363 (EP,US); H01L2224/24226 (EP,US); H01L2224/8319 (EP,US);
H01L2224/8385 (EP,US); H01L2224/83894 (EP,US); H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01019 (EP,US); H01L2924/01021 (EP,US);
H01L2924/01023 (EP,US); H01L2924/01029 (EP,US); H01L2924/0103 (EP,US);
H01L2924/01033 (EP,US); H01L2924/01039 (EP,US); H01L2924/01046 (EP,US);
H01L2924/0105 (EP,US); H01L2924/01056 (EP,US); H01L2924/01074 (EP,US);
H01L2924/01078 (EP,US); H01L2924/01082 (EP,US); H01L2924/0132 (EP,US);
H01L2924/04953 (EP,US); H01L2924/07802 (EP,US); H01L2924/09701 (EP,US);
H01L2924/12041 (EP,US); H01L2924/12042 (EP,US); H01L2924/12044 (EP,US);
H01L2924/1305 (EP,US); H01L2924/1306 (EP,US); H01L2924/13091 (EP,US);
H01L2924/14 (EP,US); H01L2924/15788 (EP,US); H01L2924/3025 (EP,US) (-)
C-Set:
H01L2924/0132, H01L2924/01013, H01L2924/01014 (US,EP);
H01L2924/0132, H01L2924/01013, H01L2924/01029 (US,EP);
H01L2924/0132, H01L2924/01022, H01L2924/01074 (US,EP);
H01L2924/12042, H01L2924/00 (EP,US);
H01L2924/12044, H01L2924/00 (US,EP);
H01L2924/1305, H01L2924/00 (EP,US);
H01L2924/1306, H01L2924/00 (EP,US);
H01L2924/13091, H01L2924/00 (EP,US);
H01L2924/15788, H01L2924/00 (EP,US);
H01L2924/3512, H01L2924/00 (US,EP)
(-)
Designated contracting statesDE,   NL [2013/24]
Former [2004/40]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Halbleiteranordnung und Verfahren zur dessen Herstellung durch Transfertechnik[2004/40]
English:Semiconductor device and method of manufacturing the same by a transfer technique[2004/40]
French:Dispositif à semi-conducteur et procede de fabrication associe par la technique de transfert[2004/40]
Examination procedure14.11.2012Examination requested  [2012/52]
04.04.2013Loss of particular rights, legal effect: designated state(s)
10.05.2013Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, PL, PT, RO, SE, SI, SK, TR
01.10.2016Application deemed to be withdrawn, date of legal effect  [2017/10]
31.10.2016Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2017/10]
Fees paidRenewal fee
09.03.2006Renewal fee patent year 03
14.03.2007Renewal fee patent year 04
14.03.2008Renewal fee patent year 05
13.03.2009Renewal fee patent year 06
15.03.2010Renewal fee patent year 07
15.03.2011Renewal fee patent year 08
14.03.2012Renewal fee patent year 09
11.03.2013Renewal fee patent year 10
12.03.2014Renewal fee patent year 11
24.03.2015Renewal fee patent year 12
Penalty fee
Additional fee for renewal fee
31.03.201613   M06   Not yet paid
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Documents cited:Search[A]EP0209173  (PHILIPS NV [NL]);
 [Y]EP1039513  (CANON KK [JP]);
 [A]WO0193325  (COMMISSARIAT ENERGIE ATOMIQUE [FR], et al);
 [XYI]WO0243124  (SOITEC SILICON ON INSULATOR [FR], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.