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EP1511070
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EP About this file: EP1511070
| EP1511070 - Integrated circuit capacitor in multi-level metallization [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 02.04.2010 Database last updated on 24.08.2024 | Most recent event Tooltip | 02.04.2010 | Application deemed to be withdrawn | published on 05.05.2010 [2010/18] | Applicant(s) | For all designated states Texas Instruments Incorporated 13500 North Central Expressway PO Box 655474 Dallas, Texas 75265 / US | [N/P] |
| Former [2005/09] | For all designated states TEXAS INSTRUMENTS INCORPORATED 13500 North Central Expressway , PO Box 655474 Dallas 75265 / US | Inventor(s) | 01 /
Hong, Qi-Zhong 4621 Deer Valley Lane Richardson, TX Texas 75082 / US | [2005/09] | Representative(s) | Holt, Michael, et al Texas Instruments Limited European Patent Department 3rd Floor 401 Grafton Gate Milton Keynes MK9 1AQ / GB | [N/P] |
| Former [2008/33] | Holt, Michael, et al Texas Instruments Limited European Patents Department 800 Pavilion Drive Northampton NN4 7YL / GB | ||
| Former [2005/09] | Holt, Michael, et al Texas Instruments Ltd., PO Box 5069 Northampton, Northamptonshire NN4 7ZE / GB | Application number, filing date | 04104015.5 | 20.08.2004 | [2005/09] | Priority number, date | US20030650100 | 26.08.2003 Original published format: US 650100 | [2005/09] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1511070 | Date: | 02.03.2005 | Language: | EN | [2005/09] | Type: | A3 Search report | No.: | EP1511070 | Date: | 01.10.2008 | [2008/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 01.09.2008 | Classification | IPC: | H01L21/02, H01L23/522, // H01L21/314, H01L21/316, H01L21/768 | [2008/40] | CPC: |
H01L28/75 (EP,US);
H01L23/5223 (EP,US);
H01L21/02164 (EP);
H01L21/0217 (EP);
H01L21/02178 (EP);
H01L21/02181 (EP);
H01L21/022 (EP);
H01L21/3144 (US);
H01L21/31612 (US);
H01L21/31616 (US);
H01L21/31645 (US);
H01L21/3185 (US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
| Former IPC [2005/09] | H01L21/02 | Designated contracting states | DE, FR, GB, NL [2009/36] |
| Former [2009/24] | DE, FR, GB | ||
| Former [2005/09] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Kondensator eines integrierten Schaltkreises in einer mehrschichtigen Metallisierung | [2005/09] | English: | Integrated circuit capacitor in multi-level metallization | [2005/09] | French: | Condensateur d'un circuit intégré dans une métallisation à niveaux multiples | [2005/09] | Examination procedure | 01.04.2009 | Examination requested [2009/20] | 02.04.2009 | Loss of particular rights, legal effect: designated state(s) | 06.05.2009 | Despatch of a communication from the examining division (Time limit: M06) | 12.05.2009 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, IT, LU, MC, PL, PT, RO, SE, SI, SK, TR | 12.05.2009 | Despatch of communication of loss of particular rights: designated state(s) NL | 17.11.2009 | Application deemed to be withdrawn, date of legal effect [2010/18] | 21.12.2009 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2010/18] | Fees paid | Renewal fee | 31.08.2006 | Renewal fee patent year 03 | 31.08.2007 | Renewal fee patent year 04 | 01.09.2008 | Renewal fee patent year 05 | 31.08.2009 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2003027385 (PARK BYUNG-LYUL [KR], et al) [X] 1-7 * paragraphs [0032] - [0036]; figures 3-6 *; | [X]US2003027386 (LEE KI-YOUNG [KR]) [X] 1-7* paragraphs [0025] - [0031]; figures 8-11 *; | [X]US2003102522 (LEE KI-YOUNG [KR]) [X] 1-7 * paragraphs [0041] - [0048]; figures 7-12 * |