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EP1521304
European procedure
Extract from the Register of European Patents
EP About this file: EP1521304
| EP1521304 - Process for producing resin-sealed type electronic device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 04.11.2011 Database last updated on 03.09.2024 | Most recent event Tooltip | 04.11.2011 | No opposition filed within time limit | published on 07.12.2011 [2011/49] | Applicant(s) | For all designated states Lintec Corporation Honcho 23-23, Itabashi-ku Tokyo 173-0001 / JP | [2010/52] |
| Former [2005/14] | For:AT
DE
LINTEC Corporation Honcho 23-23, Itabashi-ku Tokyo 173-0001 / JP | Inventor(s) | 01 /
Sugino, Takashi 13601 South 44 Street, 2119 Phoenix AZ 85044 / US | 02 /
Shinoda, Tomonori 7-7-3, Tsuji, Minami-ku, Saitama-shi Saitama / JP | [2007/32] |
| Former [2005/14] | 01 /
Sugino, Takashi 13601 South 44 Street, #2119 Phoenix AZ 85044 / US | ||
| 02 /
Shinoda, Tomonori 7-7-3, Tsuji, Minami-ku, Saitama-shi Saitama / JP | Representative(s) | Gille Hrabal Partnerschaftsgesellschaft mbB Patentanwälte Brucknerstraße 20 40593 Düsseldorf / DE | [N/P] |
| Former [2005/14] | Gille Hrabal Struck Neidlein Prop Roos Patentanwälte Brucknerstrasse 20 40593 Düsseldorf / DE | Application number, filing date | 04104575.8 | 21.09.2004 | [2005/14] | Priority number, date | JP20030342932 | 01.10.2003 Original published format: JP 2003342932 | [2005/14] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1521304 | Date: | 06.04.2005 | Language: | EN | [2005/14] | Type: | A3 Search report | No.: | EP1521304 | Date: | 11.10.2006 | [2006/41] | Type: | B1 Patent specification | No.: | EP1521304 | Date: | 29.12.2010 | Language: | EN | [2010/52] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.09.2006 | Classification | IPC: | H01L23/31, H01L21/56, H01L23/24 | [2010/29] | CPC: |
H01L23/24 (EP,US);
H01L24/97 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/48247 (EP,US);
H01L2224/97 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01075 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/14 (EP,US);
H01L2924/15787 (EP,US);
H01L2924/181 (EP,US)
(-)
| C-Set: |
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/97, H01L2224/85 (US,EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/14, H01L2924/00 (US,EP);
H01L2924/15787, H01L2924/00 (US,EP); |
| Former IPC [2005/14] | H01L23/31, H01L21/56 | Designated contracting states | AT, DE [2007/25] |
| Former [2005/14] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zur Herstellung einer in Harz eingebetteten elektronischen Vorrichtung | [2005/14] | English: | Process for producing resin-sealed type electronic device | [2005/14] | French: | Procédé pour produire un dispositif électronique du type à encapsulation en résine | [2005/14] | Examination procedure | 15.02.2007 | Examination requested [2007/14] | 13.11.2007 | Despatch of a communication from the examining division (Time limit: M06) | 13.05.2008 | Reply to a communication from the examining division | 12.05.2010 | Despatch of a communication from the examining division (Time limit: M02) | 21.05.2010 | Reply to a communication from the examining division | 21.07.2010 | Communication of intention to grant the patent | 19.11.2010 | Fee for grant paid | 19.11.2010 | Fee for publishing/printing paid | Opposition(s) | 30.09.2011 | No opposition filed within time limit [2011/49] | Fees paid | Renewal fee | 27.09.2006 | Renewal fee patent year 03 | 19.09.2007 | Renewal fee patent year 04 | 11.09.2008 | Renewal fee patent year 05 | 16.09.2009 | Renewal fee patent year 06 | 24.09.2010 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 29.12.2010 | [2011/32] | Documents cited: | Search | [X]US5907477 (TUTTLE MARK E [US], et al) [X] 1,2 * abstract * * column 6, line 4 - line 67 *; | [X]US6080602 (TANI TAKAYUKI [JP], et al) [X] 1-12 * abstract * * column 2, line 67 - column 4, line 67 *; | [XA]US6130473 (MOSTAFAZADEH SHAHRAM [US], et al) [X] 1,2,4,5,8,10,11 * abstract * * column 2, line 38 - column 424 * [A] 3,6,7,9,12; | [X]US2002053452 (QUAN SON KY [US], et al) [X] 1,2,4,5,8,10,11 * abstract * * paragraph [0008] - paragraph [0018] *; | [X]US6580159 (FUSARO JAMES M [US], et al) [X] 1,2* abstract * |