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Extract from the Register of European Patents

EP About this file: EP1592081

EP1592081 - Microstrip to waveguide transition for millimetric waves embodied in a multilayer printed circuit board [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  24.09.2010
Database last updated on 20.09.2024
Most recent event   Tooltip19.10.2012Lapse of the patent in a contracting state
New state(s): TR
published on 21.11.2012  [2012/47]
Applicant(s)For all designated states
Nokia Siemens Networks S.p.A.
S.S. 11 Padana Superiore Km 158
20060 Cassina de'Pecchi (MI) / IT
[2008/44]
Former [2006/25]For all designated states
Siemens S.p.A.
Viale Piero e Alberto Pirelli 10
20126 Milano / IT
Former [2005/44]For all designated states
Siemens Mobile Communications S.p.A.
Viale Piero e Alberto Pirelli, 10
20126 Milano / IT
Inventor(s)01 / Cifelli, Antonio
Via Campo del Ponte 4/2
20060 Gessate (MI) / IT
02 / Milani, Angelo Giuseppe
Via Manzoni, 3
20020 Magnago (MI) / IT
03 / Polini, Marco
Via XI Febbraio, 29
20090 Vimodrone (MI) / IT
 [2005/44]
Representative(s)Weidel, Gottfried, et al
Nokia Siemens Networks GmbH & Co. KG COO RTP IPR / Patent Administration
80240 München / DE
[2008/44]
Application number, filing date04425300.329.04.2004
[2005/44]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1592081
Date:02.11.2005
Language:EN
[2005/44]
Type: B1 Patent specification 
No.:EP1592081
Date:18.11.2009
Language:EN
[2009/47]
Search report(s)(Supplementary) European search report - dispatched on:EP03.11.2004
ClassificationIPC:H01P5/107
[2005/44]
CPC:
H01P5/107 (EP)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2005/44]
TitleGerman:Mikrostreifenleiter-Hohlleiterübergang für in einer Mehrschichtleiterplatte gebildete Millimeterplatte[2005/44]
English:Microstrip to waveguide transition for millimetric waves embodied in a multilayer printed circuit board[2005/44]
French:Transition entre ligne microruban et guide d'ondes pour ondes millimétriques realiseé en une carte de circuits imprimés multicouche[2005/44]
Examination procedure21.04.2006Examination requested  [2006/23]
28.06.2006Despatch of a communication from the examining division (Time limit: M04)
28.10.2006Reply to a communication from the examining division
08.05.2007Despatch of a communication from the examining division (Time limit: M04)
30.08.2007Reply to a communication from the examining division
29.02.2008Despatch of a communication from the examining division (Time limit: M06)
21.08.2008Reply to a communication from the examining division
14.07.2009Communication of intention to grant the patent
18.09.2009Fee for grant paid
18.09.2009Fee for publishing/printing paid
Opposition(s)19.08.2010No opposition filed within time limit [2010/43]
Fees paidRenewal fee
24.04.2006Renewal fee patent year 03
02.05.2007Renewal fee patent year 04
13.03.2008Renewal fee patent year 05
16.04.2009Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
SK18.11.2009
TR18.11.2009
BG18.02.2010
GR19.02.2010
PT18.03.2010
IE29.04.2010
LU29.04.2010
CH30.04.2010
LI30.04.2010
MC30.04.2010
HU19.05.2010
[2012/47]
Former [2012/43]AT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
SK18.11.2009
BG18.02.2010
GR19.02.2010
PT18.03.2010
IE29.04.2010
LU29.04.2010
CH30.04.2010
LI30.04.2010
MC30.04.2010
HU19.05.2010
Former [2012/42]AT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
SK18.11.2009
BG18.02.2010
GR19.02.2010
PT18.03.2010
IE29.04.2010
CH30.04.2010
LI30.04.2010
MC30.04.2010
HU19.05.2010
Former [2011/10]AT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
SK18.11.2009
BG18.02.2010
GR19.02.2010
PT18.03.2010
IE29.04.2010
CH30.04.2010
LI30.04.2010
MC30.04.2010
Former [2011/07]AT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
SK18.11.2009
BG18.02.2010
GR19.02.2010
PT18.03.2010
IE29.04.2010
MC30.04.2010
Former [2010/50]AT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
SK18.11.2009
BG18.02.2010
GR19.02.2010
PT18.03.2010
MC30.04.2010
Former [2010/39]AT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
SK18.11.2009
BG18.02.2010
PT18.03.2010
Former [2010/36]AT18.11.2009
BE18.11.2009
CY18.11.2009
CZ18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
BG18.02.2010
PT18.03.2010
Former [2010/35]AT18.11.2009
BE18.11.2009
CY18.11.2009
DK18.11.2009
EE18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
RO18.11.2009
SE18.11.2009
SI18.11.2009
BG18.02.2010
PT18.03.2010
Former [2010/33]AT18.11.2009
BE18.11.2009
CY18.11.2009
FI18.11.2009
NL18.11.2009
PL18.11.2009
SE18.11.2009
SI18.11.2009
PT18.03.2010
Former [2010/31]AT18.11.2009
BE18.11.2009
CY18.11.2009
FI18.11.2009
PL18.11.2009
SE18.11.2009
SI18.11.2009
PT18.03.2010
Former [2010/30]AT18.11.2009
CY18.11.2009
FI18.11.2009
PL18.11.2009
SE18.11.2009
SI18.11.2009
PT18.03.2010
Former [2010/25]CY18.11.2009
FI18.11.2009
PL18.11.2009
SE18.11.2009
SI18.11.2009
PT18.03.2010
Former [2010/23]FI18.11.2009
PL18.11.2009
SE18.11.2009
SI18.11.2009
PT18.03.2010
Former [2010/22]FI18.11.2009
SE18.11.2009
PT18.03.2010
Documents cited:Search[A]JP2001177312  ;
 [A]JPS592402  ;
 [A]JPH10126114  ;
 [XAY]EP0874415  (KYOCERA CORP [JP]);
 [YD]EP1367668  (SIEMENS INF & COMM NETWORKS [IT])
by applicantEP0874415
 EP1280392
 EP1367668
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