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EP1596210
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EP About this file: EP1596210
| EP1596210 - Method for lifetime determination of submicron metal interconnects [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 03.02.2006 Database last updated on 03.09.2024 | Most recent event Tooltip | 10.07.2009 | Change - applicant | published on 12.08.2009 [2009/33] | Applicant(s) | For all designated states IMEC Kapeldreef 75 3001 Leuven / BE | [2009/33] |
| Former [2005/46] | For all designated states Interuniversitair Micro-Elektronica Centrum (IMEC) Kapeldreef 75 3001 Heverlee / BE | Representative(s) | Van Malderen, Joëlle, et al pronovem - Office Van Malderen Avenue Josse Goffin 158 1082 Bruxelles / BE | [N/P] |
| Former [2005/46] | Van Malderen, Joelle, et al pronovem - Office Van Malderen Avenue Josse Goffin 158 1082 Bruxelles / BE | Application number, filing date | 04447117.5 | 11.05.2004 | [2005/46] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1596210 | Date: | 16.11.2005 | Language: | EN | [2005/46] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 24.11.2004 | Classification | IPC: | G01R31/316 | [2005/46] | CPC: |
G01R31/2884 (EP,US);
G01R31/2856 (EP,US);
G01R31/2858 (EP,US);
G01R31/287 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR [2005/46] | Extension states | AL | Not yet paid | HR | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | Title | German: | Verfahren zur Lebensdauererfassung von Verbindungsstrukturen des Submikrometerbereichs | [2005/46] | English: | Method for lifetime determination of submicron metal interconnects | [2005/46] | French: | Procédé de détermination de la durée de vie des interconnexions submicrométrique | [2005/46] | Examination procedure | 13.09.2005 | Application deemed to be withdrawn, date of legal effect [2006/12] | 20.10.2005 | Despatch of communication that the application is deemed to be withdrawn, reason: A.91(5) [2006/12] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]GB2176653 (GEN ELECTRIC PLC) [X] 1 * page 1, line 73 - line 120; figures 1,2 *; | [X]EP0395149 (IMEC INTER UNI MICRO ELECTR [BE], et al) [X] 33 * column 1, lines 10-12 * * column 3, line 3 * * column 3 * * column 3, line 34; figure 1 *; | [X]US6037795 (FILIPPI RONALD G [US], et al) [X] 1 * column A; figure 3 *; | [XY]US2002017906 (HO PAUL S [US], et al) [X] 1-3,5-11,14,16,20,24,26-28 * paragraph [0007] * * paragraph [0012] * * paragraph [0015] * * paragraphs [0029] - [0036]; figures 1-7 * [Y] 17,18,25; | [A]US2004051553 (MANNA INDRAJIT [SG], et al); | [Y] - AUBEL ET AL., "highly accelerated electromigration lifetime test (halt) of copper", IEEE TRANS. DEVICE AND MATERIAL RELIABILITY, (200312), vol. 3, no. 4, pages 213 - 217, XP002303343 [Y] 17,18,25 * page 213, column L; figure 4 * DOI: http://dx.doi.org/10.1109/TDMR.2003.820055 | [A] - KNOWLTON ET AL., "Simulation of the temperature and current density scaling of the electromigration-limited reliability...", J. MATERIALS RESEARCH, (199805), vol. 13, no. 5, pages 1164 - 1170, XP002303344 | [A] - CLEMENS LASANCE, "Thermal resistance: an oxymoron?", ELECTRONICS COOLING, (199705), URL: http://www.electronics-cooling.com7resources/ec-articles/may97/article2.htm, (20041028), XP002303345 [A] 29 | [A] - "Thermal resistance calculation", INFINEON APPLICATION NOTE NO. 077, SILICON DISCRETES, (20020423), pages 1 - 6, XP002303346 [A] 29 * page 1 * |