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EP1599902

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EP About this file: EP1599902

EP1599902 - FLIP-CHIP COMPONENT PACKAGING PROCESS [Right-click to bookmark this link]
Former [2005/48]	FLIP-CHIP COMPONENT PACKAGING PROCESS AND FLIP-CHIP COMPONENT
	[2014/09]
Status	No opposition filed within time limit Status updated on 29.05.2015 Database last updated on 07.10.2024
Most recent event Tooltip	16.10.2015	Lapse of the patent in a contracting state New state(s): CH, LI	published on 18.11.2015 [2015/47]
Applicant(s)	For all designated states Medtronic, Inc. 710 Medtronic Parkway Minneapolis, MN 55432-5604 / US
	[2014/30]
Former [2008/41]	For all designated states MEDTRONIC, INC. 710 Medtronic Parkway Minneapolis MN 55432-5604 / US
Former [2005/48]	For all designated states Medtronic Inc. 710 Medtronic Parkway NE, LC 340 Minneapolis, MN 55432 / US
Inventor(s)	01 / BOONE, Mark, R. 202 E. Avenida Sierra Madre Gilbert, AZ 85296 / US
	02 / FENNER, Andreas, A. 877 East Nolan Place Chandler, AZ 85249 / US
	03 / MILLA, Juan, G. 3429 East Jasmine Circle Mesa, AZ 85213 / US
	04 / LARSON, Lary, R. 10132 East Daybreak Place Gold Canyon, AZ 85218 / US
	[2006/01]
Former [2005/48]	01 / BOONE, Mark, R. 518 San Remo Street Gilbert, AZ 85233 / US
	02 / FENNER, Andreas, A. 877 East Nolan Place Chandler, AZ 85249 / US
	03 / MILLA, Juan, G. 3429 East Jasmine Circle Mesa, AZ 85213 / US
	04 / LARSON, Lary, R. 10132 East Daybreak Place Gold Canyon, AZ 85218 / US
Representative(s)	Hughes, Andrea Michelle Dehns St Bride's House 10 Salisbury Square London EC4Y 8JD / GB
	[2014/30]
Former [2005/48]	Hughes, Andrea Michelle Frank B. Dehn & Co., European Patent Attorneys, 179 Queen Victoria Street London EC4V 4EL / GB
Application number, filing date	04710614.1	12.02.2004
	[2005/48]
	WO2004US04040
Priority number, date	US20030365765	13.02.2003 Original published format: US 365765
	[2005/48]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	WO2004075294
	Date:	02.09.2004
	Language:	EN
	[2004/36]
	Type:	A2 Application without search report
	No.:	EP1599902
	Date:	30.11.2005
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 02.09.2004 takes the place of the publication of the European patent application.
	[2005/48]
	Type:	B1 Patent specification
	No.:	EP1599902
	Date:	23.07.2014
	Language:	EN
	[2014/30]
Search report(s)	International search report - published on:	EP	10.02.2005
Classification	IPC:	H01L23/552, H01L23/58, H01L21/56, // H01L29/06	[2014/09]
	CPC:	H01L23/552 (EP,US); H01L23/585 (EP,US); H01L29/0619 (EP,US); H01L21/563 (EP,US); H01L2224/16 (EP,US); H01L2224/83102 (EP,US); (+) H01L2224/92125 (EP,US); H01L2924/00014 (EP,US); H01L2924/1301 (EP,US); H01L2924/1305 (EP,US); H01L2924/13091 (EP,US); H01L2924/3025 (EP,US) (-)
	C-Set:	H01L2924/00014, H01L2224/0401 (US,EP); H01L2924/1301, H01L2924/00 (EP,US); H01L2924/1305, H01L2924/00 (US,EP)
	Former IPC [2005/48]	H01L23/552, H01L23/58, H01L21/56
Designated contracting states	CH, DE, FR, LI, NL, SE [2006/22]
Former [2005/48]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR
Title	German:	VERPACKUNGSMETHODE EINES FLIP-CHIP BAUELEMENTS	[2014/09]
	English:	FLIP-CHIP COMPONENT PACKAGING PROCESS	[2014/09]
	French:	PROCEDE DE CONDITIONNEMENT DE COMPOSANT RETOURNE	[2014/09]
	Former [2005/48]	FLIP-CHIP BAUELEMENT UND SEINE VERPACKUNGSMETHODE
	Former [2005/48]	FLIP-CHIP COMPONENT PACKAGING PROCESS AND FLIP-CHIP COMPONENT
	Former [2005/48]	PROCEDE DE CONDITIONNEMENT DE COMPOSANT RETOURNE ET COMPOSANT RETOURNE
Entry into regional phase	12.09.2005	National basic fee paid
	12.09.2005	Designation fee(s) paid
	12.09.2005	Examination fee paid
Examination procedure	12.09.2005	Examination requested [2005/48]
	01.07.2008	Despatch of a communication from the examining division (Time limit: M06)
	08.01.2009	Reply to a communication from the examining division
	03.02.2011	Despatch of a communication from the examining division (Time limit: M06)
	18.07.2011	Reply to a communication from the examining division
	12.02.2014	Communication of intention to grant the patent
	13.06.2014	Fee for grant paid
	13.06.2014	Fee for publishing/printing paid
	13.06.2014	Receipt of the translation of the claim(s)
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 01.07.2008
Opposition(s)	24.04.2015	No opposition filed within time limit [2015/27]
Fees paid	Renewal fee
	06.02.2006	Renewal fee patent year 03
	05.02.2007	Renewal fee patent year 04
	08.02.2008	Renewal fee patent year 05
	09.02.2009	Renewal fee patent year 06
	08.02.2010	Renewal fee patent year 07
	08.02.2011	Renewal fee patent year 08
	24.02.2012	Renewal fee patent year 09
	27.02.2013	Renewal fee patent year 10
	27.02.2014	Renewal fee patent year 11
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition Tooltip	NL	23.07.2014
	SE	23.07.2014
	CH	28.02.2015
	LI	28.02.2015
	[2015/47]
Former [2015/12]	NL	23.07.2014
	SE	23.07.2014
Former [2015/09]	SE	23.07.2014
Cited in	International search	[A]US3763550 (OAKES J) [A] 1-10 * column 1, lines 15-48 * * column 5, line 35 - column 7, line 7; figures 3,4 *;
		[A]EP0453424 (ERICSSON TELEFON AB L M [SE]) [A] 1-10 * column 1, line 25 - column 2, line 51 * * column 3, line 31 - column 5, line 12; figures 1,2 *;
		[A]US5087577 (STRACK HELMUT [DE]) [A] 1-10 * column 1, line 60 - column 3, line 10; figures 1-5 *;
		[A]US5686754 (CHOI CHONGWOOK CHRIS [US], et al) [A] 1-10 * column 1, line 5 - column 2, line 27 * * column 3, line 51 - column 4, line 63; figures 2,3 *;
		[A]DE10060828 (INFINEON TECHNOLOGIES AG [DE]) [A] 1-10 * paragraphs [0005] , [0006] ** paragraphs [0024] - [0038]; figures 1,2 *;
		[X]US6420208 (POZDER SCOTT K [US], et al) [X] 1-10 * column 1, line 10 - column 2, line 26 * * column 3, line 5 - column 4, line 63; figures 1-9 *

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