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EP About this file: EP1609575

EP1609575 - LENS MOLDING DIE ASSEMBLING DEVICE, LENS MOLDING DIE WASHING METHOD, AND LENS MOLDING DIE ASSEMBLING METHOD [Right-click to bookmark this link]
Status	The application has been withdrawn Status updated on 15.06.2007 Database last updated on 24.08.2024
Most recent event Tooltip	05.02.2010	Change - representative	published on 10.03.2010 [2010/10]
Applicant(s)	For all designated states Seiko Epson Corporation 4-1, Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0811 / JP
	[N/P]
Former [2005/52]	For all designated states SEIKO EPSON CORPORATION 4-1, Nishi-shinjuku 2-chome Shinjuku-ku Tokyo 163-0811 / JP
Inventor(s)	01 / SANO, Yoshio c/o Seiko Epson Corporation 3-5, Owa 3-Chome Suwa-Shi, Nagano 3928502 / JP
	[2005/52]
Representative(s)	MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB Paul-Heyse-Strasse 29 80336 München / DE
	[N/P]
Former [2010/10]	MERH-IP Matias Erny Reichl Hoffmann Paul-Heyse-Strasse 29 80336 München / DE
Former [2005/52]	Hoffmann, Eckart Patentanwalt, Bahnhofstrasse 103 82166 Gräfelfing / DE
Application number, filing date	04724384.5	30.03.2004
	[2005/52]
	WO2004JP04558
Priority number, date	JP20030095979	31.03.2003 Original published format: JP 2003095979
	[2005/52]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2004087396
	Date:	14.10.2004
	Language:	EN
	[2004/42]
	Type:	A1 Application with search report
	No.:	EP1609575
	Date:	28.12.2005
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 14.10.2004 takes the place of the publication of the European patent application.
	[2005/52]
Search report(s)	International search report - published on:	JP	14.10.2004
	(Supplementary) European search report - dispatched on:	EP	19.02.2007
Classification	IPC:	B29C33/72	[2007/12]
	CPC:	B29C39/22 (EP,US); B29C39/26 (KR); B29C33/72 (EP,KR,US); B29C39/02 (KR); B29D11/00 (KR); B29L2011/0016 (EP,US)
	Former IPC [2005/52]	B29C39/26, B29C39/02, B29C33/72, G02C13/00, G02C7/02, // B29L11/00
Designated contracting states	DE, FR, GB [2006/27]
Former [2005/52]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR
Extension states	AL	Not yet paid
	LT	Not yet paid
	LV	Not yet paid
	MK	Not yet paid
Title	German:	LINSENGIESSFORMMONTAGEVORRICHTUNG, LINSENGIESSFORMWASCHVERFAHREN UND LINSENGIESSFORMMONTAGEVERFAHREN	[2005/52]
	English:	LENS MOLDING DIE ASSEMBLING DEVICE, LENS MOLDING DIE WASHING METHOD, AND LENS MOLDING DIE ASSEMBLING METHOD	[2005/52]
	French:	DISPOSITIF ET PROCEDE SERVANT A ASSEMBLER UNE MATRICE DE MOULAGE DE LENTILLE ET PROCEDE DE LAVAGE DE CETTE MATRICE	[2005/52]
Entry into regional phase	08.06.2005	Translation filed
	08.06.2005	National basic fee paid
	08.06.2005	Search fee paid
	08.06.2005	Designation fee(s) paid
	08.06.2005	Examination fee paid
Examination procedure	08.06.2005	Amendment by applicant (claims and/or description)
	08.06.2005	Examination requested [2005/52]
	02.05.2007	Despatch of a communication from the examining division (Time limit: M04)
	03.05.2007	Reply to a communication from the examining division
	24.05.2007	Despatch of a communication from the examining division (Time limit: M04)
	08.06.2007	Application withdrawn by applicant [2007/29]
Fees paid	Renewal fee
	29.03.2006	Renewal fee patent year 03
	29.03.2007	Renewal fee patent year 04
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	JP2000246741 [ ];
		[YA]JPS61261011 (TORAY INDUSTRIES) [Y] 5,6 * figure 4 * [A] 10;
		[A]JPH02281932 (SEIKO EPSON CORP) [A] 7 * abstract *;
		[DX]JPH0519212 (SEIKO EPSON CORP) [DX] 1,2 * paragraph [0016] *;
		[A]JPH06270042 (SEIKO EPSON CORP) [A] 1 * abstract *;
		[Y]JPH07328886 (SEIKO EPSON CORP) [Y] 3,4 * paragraph [0043] *;
		[XY]JPH08294977 (SEIKO EPSON CORP) [X] 1,2 * paragraph [0020] * [Y] 3-6;
		[Y]WO9842497 (NOVARTIS AG [CH], et al) [Y] 3,4 * page 25, paragraph 1 - paragraph 2 *;
		[A]JPH11254459 (SEIKO EPSON CORP) [A] 5,6,9,10 * abstract *;
		[X]JP2000246741 (KUREHA CHEMICAL IND CO LTD) [X] 7-10 * paragraphs [0002] , [0055] *;
		[X]JP2001232647 (TOSOH CORP) [X] 7,9,10 * paragraph [0003] *;
		[PYA]JP2003112325 (SEIKO EPSON CORP) [PY] 5,6 * abstract * [PA] 10;
		[E]JP2004216867 (SEIKO EPSON CORP) [E] 1-10* the whole document *;
		[T]JP2004299290 (SEIKO EPSON CORP) [T] 1-10 * the whole document *;
		[E]EP1566250 (SEIKO EPSON CORP [JP]) [E] 1-10 * the whole document *;
		[ ] - DATABASE WPI, 0, Derwent World Patents Index, vol. 2000, no. 65, Database accession no. 2000-667357, XP002418964 & JP2000246741 A 20000912 (KUREHA CHEM IND CO LTD) [ ] * abstract *
	International search	[Y]JPH08294977 (SEIKO EPSON CORP);
		[Y]JP2001232647 (TOSOH CORP);
		[Y]JP2000246741 (KUREHA CHEMICAL IND CO LTD);
		[Y]JPH07328886 (SEIKO EPSON CORP);
		[Y]JPH11254459 (SEIKO EPSON CORP);
		[Y]JPS61261011 (TORAY INDUSTRIES);
		[AP]JP2003112325 (SEIKO EPSON CORP)

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