Deutsch English Français

Contact

EP1635396

European procedure

Quick help

Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...

News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...

Extract from the Register of European Patents

EP About this file: EP1635396

EP1635396 - LAMINATED SEMICONDUCTOR SUBSTRATE AND PROCESS FOR PRODUCING THE SAME [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 18.07.2014 Database last updated on 03.10.2024
Most recent event Tooltip	18.07.2014	No opposition filed within time limit	published on 20.08.2014 [2014/34]
Applicant(s)	For all designated states SUMCO Corporation 2-1, Shibaura 1-chome, Minato-ku Tokyo 105-8634 / JP
	For all designated states Industry University Cooperation Foundation Hanyang University 17 Haengdang-dong Seongdong-gu Seoul 133-791 / KR
	[2013/37]
Former [2006/17]	For all designated states Sumco Corporation 2-1, Shibaura 1-chome, Minato-ku Tokyo 105-8634 / JP
	For all designated states Industry University Cooperation Foundation Hanyang University 17 Haengdang-dong Sungdong-gu Seoul 133-791 / KR
Former [2006/11]	For all designated states Sumco Corporation 2-1, Shibaura 1-chome, Minato-ku Tokyo 105-8634 / JP
	For all designated states Hanyang Hak Won Co., Ltd. 17, Hangdang-1-Dong, Sungdong-ku Seoul 133-070 / KR
Inventor(s)	01 / KAMIYAMA, Eiji, Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP
	02 / KATOH, Takeo, Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP
	03 / PARK, Jea Gun, Hanyang Hak Won Co., Ltd. 17, Haengdang 1-dong Seongdong-gu, Seoul / KR
	[2013/37]
Former [2006/11]	01 / KAMIYAMA, Eiji, Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome, Minato-ku Tokyo 105-8634 / JP
	02 / KATOH, Takeo, Sumitomo Mitsubishi Silicon Corp. 2-1, Shibaura 1-chome, Minato-ku Tokyo 105-8634 / JP
	03 / PARK, Jea Gun, Hanyang Hak Won Co., Ltd. 17, Haengdang 1-dong Seongdong-gu, Seoul / KR
Representative(s)	Hössle Patentanwälte Partnerschaft Postfach 10 23 38 70019 Stuttgart / DE
	[2013/37]
Former [2006/11]	Hössle Kudlek & Partner Patentanwälte, Postfach 10 23 38 70019 Stuttgart / DE
Application number, filing date	04725535.1	02.04.2004
	[2006/11]
	WO2004JP04886
Priority number, date	JP20030099541	02.04.2003 Original published format: JP 2003099541
	[2006/11]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2004090986
	Date:	21.10.2004
	Language:	EN
	[2004/43]
	Type:	A1 Application with search report
	No.:	EP1635396
	Date:	15.03.2006
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 21.10.2004 takes the place of the publication of the European patent application.
	[2006/11]
	Type:	B1 Patent specification
	No.:	EP1635396
	Date:	11.09.2013
	Language:	EN
	[2013/37]
Search report(s)	International search report - published on:	JP	21.10.2004
	(Supplementary) European search report - dispatched on:	EP	30.05.2007
Classification	IPC:	H01L21/762, H01L21/306	[2013/20]
	CPC:	H01L21/30608 (EP,US); H01L21/20 (KR); H01L21/76254 (EP,US); H01L27/12 (KR)
	Former IPC [2006/11]	H01L27/12, H01L21/02
Designated contracting states	DE [2006/28]
Former [2006/11]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR
Title	German:	LAMINIERTES HALBLEITERSUBSTRAT UND PROZESS ZU SEINER HERSTELLUNG	[2006/11]
	English:	LAMINATED SEMICONDUCTOR SUBSTRATE AND PROCESS FOR PRODUCING THE SAME	[2006/11]
	French:	SUBSTRAT SEMI-CONDUCTEUR STRATIFIE ET PROCEDE DE PRODUCTION ASSOCIE	[2006/11]
Entry into regional phase	28.10.2005	Translation filed
	28.10.2005	National basic fee paid
	28.10.2005	Search fee paid
	28.10.2005	Designation fee(s) paid
	28.10.2005	Examination fee paid
Examination procedure	28.10.2005	Examination requested [2006/11]
	11.03.2008	Despatch of a communication from the examining division (Time limit: M06)
	19.09.2008	Reply to a communication from the examining division
	04.04.2012	Despatch of a communication from the examining division (Time limit: M04)
	30.07.2012	Reply to a communication from the examining division
	05.06.2013	Communication of intention to grant the patent
	30.07.2013	Fee for grant paid
	30.07.2013	Fee for publishing/printing paid
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 11.03.2008
Opposition(s)	12.06.2014	No opposition filed within time limit [2014/34]
Fees paid	Renewal fee
	22.04.2006	Renewal fee patent year 03
	24.04.2007	Renewal fee patent year 04
	27.03.2008	Renewal fee patent year 05
	29.04.2009	Renewal fee patent year 06
	29.03.2010	Renewal fee patent year 07
	28.04.2011	Renewal fee patent year 08
	29.03.2012	Renewal fee patent year 09
	29.04.2013	Renewal fee patent year 10
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[XA]US5882987 (SRIKRISHNAN KRIS V [US]) [X] 1-7,14-16 * column 4, line 7 - column 6, line 55; figure 6 * [A] 8-13;
		[X]EP0905767 (SHINETSU HANDOTAI KK [JP]) [X] 1 * column 7, paragraph 41 - column 8, paragraph 46; figure 1; example 1 *;
		[XA]EP1045448 (SHINETSU HANDOTAI KK [JP], et al) [X] 1,2 * column 5, paragraph 30 - column 11, paragraph 71 * [A] 3-16;
		[A]EP1085562 (APPLIED MATERIALS INC [US]) [A] 1-16* column 10, paragraph 50 - column 11, paragraph 53; figure 4 *;
		[X]US6323108 (KUB FRANCIS J [US], et al) [X] 1-7,14-16 * column 8, line 39 - column 9, line 44; figure 1 *
	International search	[X]JPH11121377 (IBM);
		[X]JPH11102848 (SHINETSU HANDOTAI KK);
		[Y]JP2000124092 (SHINETSU HANDOTAI KK, et al);
		[Y]JP2003017723 (SHINETSU HANDOTAI KK);
		[XP]JP2004080035 (PARK JEA-GUN, et al)
	by applicant	US5374564
		US6020252
		JP2000124092
		US5882987
		US6323108
		- IEICE TRANS, ELECTRON, (1997), vol. E80C, no. 3, page 358

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

Legal notice
Terms of use
24.2.25; 34p