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Extract from the Register of European Patents

EP About this file: EP1636828

EP1636828 - COMPOSITIONS AND METHODS FOR HIGH-EFFICIENCY CLEANING/POLISHING OF SEMICONDUCTOR WAFERS [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  24.04.2009
Database last updated on 02.11.2024
Most recent event   Tooltip24.04.2009Withdrawal of applicationpublished on 27.05.2009  [2009/22]
Applicant(s)For all designated states
ADVANCED TECHNOLOGY MATERIALS, INC.
7 Commerce Drive
Danbury, CT 06810 / US
[2006/12]
Inventor(s)01 / KORZENSKI, Michael, B.
110 Woodcrest Lane
Danbury, CT 06810 / US
02 / XU, Chongying
8 Heather Court
New Milford, CT 06776 / US
03 / BAUM, Thomas, H.
2 Handol Lane
New Fairfield, CT 06810 / US
04 / MINSEK, David
20 Skyline Drive
New Milford, CT 06776 / US
05 / GHENCIU, Eliodor, G.
638 Forege Spring Lane
King of Prussia, PA 19406 / US
 [2006/12]
Representative(s)Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte
Grillparzerstrasse 14
81675 München / DE
[N/P]
Former [2008/28]Viering, Jentschura & Partner
Postfach 22 14 43
80504 München / DE
Former [2006/12]Viering, Jentschura & Partner
Postfach 22 14 43
80504 München / DE
Application number, filing date04755330.015.06.2004
[2006/12]
WO2004US19088
Priority number, dateUS2003060217224.06.2003         Original published format: US 602172
[2006/12]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2005004199
Date:13.01.2005
Language:EN
[2005/02]
Type: A2 Application without search report 
No.:EP1636828
Date:22.03.2006
Language:EN
The application published by WIPO in one of the EPO official languages on 13.01.2005 takes the place of the publication of the European patent application.
[2006/12]
Search report(s)International search report - published on:US10.08.2006
ClassificationIPC:C11D1/00, C11D3/30, B08B3/08, B08B3/04
[2006/41]
CPC:
G03F7/425 (EP,US); H01L21/304 (KR); C11D7/261 (EP,US);
C11D7/28 (EP,US); C11D7/3209 (EP,US); C11D7/5013 (EP,US);
H01L21/02063 (EP,US); H01L21/31133 (EP,US); C11D2111/22 (EP,US);
Y10S134/902 (EP,US); Y10S438/906 (EP,US) (-)
Former IPC [2006/12]H01L21/00
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2006/12]
Extension statesALNot yet paid
HRNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:ZUSAMMENSETZUNGEN UND VERFAHREN ZUM HOCHEFFIZIENTEN REINIGEN/POLIEREN VON HALBLEITER-WAFERN[2006/12]
English:COMPOSITIONS AND METHODS FOR HIGH-EFFICIENCY CLEANING/POLISHING OF SEMICONDUCTOR WAFERS[2006/12]
French:COMPOSITIONS ET METHODES DESTINEES AU NETTOYAGE/POLISSAGE A HAUT RENDEMENT DE PLAQUETTES SEMI-CONDUCTRICES[2006/12]
Entry into regional phase23.12.2005National basic fee paid 
23.12.2005Search fee paid 
23.12.2005Designation fee(s) paid 
23.12.2005Examination fee paid 
Examination procedure04.01.2005Request for preliminary examination filed
International Preliminary Examining Authority: US
23.12.2005Amendment by applicant (claims and/or description)
23.12.2005Examination requested  [2006/12]
15.04.2009Application withdrawn by applicant  [2009/22]
Fees paidRenewal fee
23.12.2005Renewal fee patent year 03
02.07.2007Renewal fee patent year 04
28.03.2008Renewal fee patent year 05
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Cited inInternational search[A]US2003022800  (PETERS DARRYL W [US], et al);
 [A]US6554912  (SAHBARI JAVAD J [US])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.