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Extract from the Register of European Patents

EP About this file: EP1541284

EP1541284 - Planarization method [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  11.01.2008
Database last updated on 12.07.2024
Most recent event   Tooltip11.01.2008No opposition filed within time limitpublished on 13.02.2008  [2008/07]
Applicant(s)For all designated states
TOKYO SEIMITSU CO., LTD.
7-1, Shimorenjaku 9-chome Mitaka-shi
Tokyo / JP
[N/P]
Former [2007/10]For all designated states
TOKYO SEIMITSU CO., LTD.
7-1, Shimorenjaku 9-chome Mitaka-shi
Tokyo / JP
Former [2005/24]For all designated states
TOKYO SEIMITSU CO., LTD.
7-1, Shimorenjaku 9-chome
Mitaka-shi Tokyo / JP
Inventor(s)01 / Ishikawa, Toshihiko
7-1, Shimorenjaku 9-chome
Mitaka-shi Tokyo / JP
02 / Katagiri, Yasushi
7-1, Shimorenjaku 9-chome
Mitaka-shi Tokyo / JP
 [2005/24]
Representative(s)Hering, Hartmut
Patentanwälte
Berendt, Leyh & Hering
Innere Wiener Strasse 20
81667 München / DE
[N/P]
Former [2005/24]Hering, Hartmut, Dipl.-Ing.
Patentanwälte Berendt, Leyh & Hering Innere Wiener Strasse 20
81667 München / DE
Application number, filing date05005154.903.01.2000
[2005/24]
Priority number, dateJP1999000131706.01.1999         Original published format: JP 131799
JP1999032143211.11.1999         Original published format: JP 32143299
[2005/24]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1541284
Date:15.06.2005
Language:EN
[2005/24]
Type: B1 Patent specification 
No.:EP1541284
Date:07.03.2007
Language:EN
[2007/10]
Search report(s)(Supplementary) European search report - dispatched on:EP03.05.2005
ClassificationIPC:B24B7/22, B24B37/04, B24B53/007, H01L21/304, H01L21/306
[2005/24]
CPC:
B24B37/345 (EP,US); H01L21/304 (KR); B24B49/04 (EP,US);
B24B7/228 (EP,US); H01L21/30625 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT,   NL [2005/24]
TitleGerman:Vorrichtung und Verfahren zur Planarisierung[2005/24]
English:Planarization method[2005/24]
French:Procédé et dispositif de planarisation[2005/24]
Examination procedure13.12.2005Examination requested  [2006/06]
07.02.2006Despatch of a communication from the examining division (Time limit: M04)
07.06.2006Reply to a communication from the examining division
11.08.2006Communication of intention to grant the patent
13.11.2006Fee for grant paid
13.11.2006Fee for publishing/printing paid
Parent application(s)   TooltipEP00100004.1  / EP1018400
Opposition(s)10.12.2007No opposition filed within time limit [2008/07]
Fees paidRenewal fee
09.03.2005Renewal fee patent year 03
09.03.2005Renewal fee patent year 04
09.03.2005Renewal fee patent year 05
15.03.2005Renewal fee patent year 06
13.01.2006Renewal fee patent year 07
20.01.2007Renewal fee patent year 08
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Documents cited:Search[Y]JPH0740239  ;
 [Y]DE19641534  (GENAUIGKEITS & MASCHINENBAU NU [DE]) [Y] 1-4 * column 3, line 18 - column 5, line 26 * * figure 1 *;
 [Y]US5851924  (NAKAZAWA ATSUO [JP], et al) [Y] 1,2 * abstract * * column 2, line 1 - line 13 * * column 2, line 36 - line 54 *
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19950630), vol. 1995, no. 05, & JP07040239 A 19950210 (SONY CORP) [Y] 3,4 * abstract * * paragraph [0002] * * paragraph [0007] * * paragraph [0009] * * paragraph [0015] * * paragraph [0038] * * paragraph [0050] - paragraph [0052] * * paragraph [0058] - paragraph [0062] * * figures 1,10 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.