Extract from the Register of European Patents

EP About this file: EP1607749

EP1607749 - Test probe assembly for IC chips [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  20.03.2009
Database last updated on 21.03.2026
Most recent event   Tooltip20.03.2009No opposition filed within time limitpublished on 22.04.2009  [2009/17]
Applicant(s)For all designated states
Aries Electronics, Inc
Box 130, 62-A Trenton Avenue Frenchtown
New Jersey 08825 / US
[2008/20]
Former [2005/51]For all designated states
Aries Electronics, Inc
Box 130, 62-A Trenton Avenue Frenchtown
New Jersey 08825 / US
Inventor(s)01 / Sinclair, William Y.
26 Laurelton Trail
Flemington, New Jersey 08822 / US
 [2005/51]
Representative(s)Müller-Boré & Partner Patentanwälte PartG mbB
Friedenheimer Brücke 21
80639 München / DE
[N/P]
Former [2005/51]Müller-Boré & Partner Patentanwälte
Grafinger Strasse 2
81671 München / DE
Application number, filing date05013012.916.06.2005
[2005/51]
Priority number, dateUS2004087010817.06.2004         Original published format: US 870108
[2005/51]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1607749
Date:21.12.2005
Language:EN
[2005/51]
Type: A3 Search report 
No.:EP1607749
Date:31.05.2006
[2006/22]
Type: B1 Patent specification 
No.:EP1607749
Date:14.05.2008
Language:EN
[2008/20]
Search report(s)(Supplementary) European search report - dispatched on:EP19.04.2006
ClassificationIPC:G01R1/067, G01R1/073
[2006/22]
CPC:
G01R1/0466 (EP,US); G01R1/0483 (EP,US); G01R1/06722 (EP,US);
G01R1/07371 (EP,US)
Former IPC [2005/51]G01R1/067
Designated contracting statesDE,   FR,   GB,   IT [2007/07]
Former [2007/06]AT,  BE,  BG,  CH,  LI 
Former [2005/51]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Anordnung einer Testprobe für ein IC-Plättchen[2005/51]
English:Test probe assembly for IC chips[2005/51]
French:Assemblage de sonde pour plaques IC[2005/51]
Examination procedure16.11.2006Examination requested  [2006/52]
01.12.2006Loss of particular rights, legal effect: designated state(s)
30.03.2007Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, IS, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR
22.11.2007Communication of intention to grant the patent
27.03.2008Fee for grant paid
27.03.2008Fee for publishing/printing paid
Opposition(s)17.02.2009No opposition filed within time limit [2009/17]
Fees paidRenewal fee
26.06.2007Renewal fee patent year 03
Penalty fee
Penalty fee Rule 85a EPC 1973
11.01.2007AT   M01   Not yet paid
11.01.2007BE   M01   Not yet paid
11.01.2007BG   M01   Not yet paid
11.01.2007CH   M01   Not yet paid
11.01.2007CY   M01   Not yet paid
11.01.2007CZ   M01   Not yet paid
11.01.2007DK   M01   Not yet paid
11.01.2007EE   M01   Not yet paid
11.01.2007ES   M01   Not yet paid
11.01.2007FI   M01   Not yet paid
11.01.2007GR   M01   Not yet paid
11.01.2007HU   M01   Not yet paid
11.01.2007IE   M01   Not yet paid
11.01.2007IS   M01   Not yet paid
11.01.2007LT   M01   Not yet paid
11.01.2007LU   M01   Not yet paid
11.01.2007MC   M01   Not yet paid
11.01.2007NL   M01   Not yet paid
11.01.2007PL   M01   Not yet paid
11.01.2007PT   M01   Not yet paid
11.01.2007RO   M01   Not yet paid
11.01.2007SE   M01   Not yet paid
11.01.2007SI   M01   Not yet paid
11.01.2007SK   M01   Not yet paid
11.01.2007TR   M01   Not yet paid
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Documents cited:Search[A] CH676510  (FEINMETALL GMBH et al.) [A] 1 * figures 3,4; claim 1 *
 [A] DE3340431  (FEINMETALL GMBH et al.) [A] 1 * the whole document *
 [A] CH627282  (FEINMETALL GMBH et al.) [A] 1 * the whole document *
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