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EP About this file: EP1610132

EP1610132 - Fabricating interconnects using sacrificial substrates [Right-click to bookmark this link]
Status	No opposition filed within time limit Status updated on 20.11.2009 Database last updated on 18.11.2024
Most recent event Tooltip	20.11.2009	No opposition filed within time limit	published on 23.12.2009 [2009/52]
Applicant(s)	For all designated states FormFactor, Inc. 7005 Southfront Road Livermore, CA 94551 / US
	[2005/52]
Inventor(s)	01 / Khandros, Igor Y. 25, Haciendas Road Orinda California 94563 / US
	02 / Eldridge, Benjamin N. 651 Sheri Lane Danville California 94526 / US
	03 / Mathieu, Gaetan L. 154 Chemin du Lac Varennes, QC JX 1P7 / CA
	[2009/03]
Former [2006/24]	01 / Khandros, Igor Y. 25, Haciendas Road Orinda California 94563 / US
	02 / Eldridge, Benjamin N. 651 Sheri Lane Danville California 95426 / US
	03 / Mathieu, Gaetan L. 154 Chemin du Lac Varennes, QC JX 1P7 / CA
Former [2006/11]	01 / Khandros, Igor Y. 25, Haciendas Road Orinda California 94563 / US
	02 / Eldridge, Benjamin N. 651 Sheri Lane Danville California 95426 / US
	03 / Mathieu, Gaetan L. 659 Orange Way Livermore California 94550 / US
Former [2005/52]	01 / Khandros, Igor Y. 25, Haciendas Road Orinda California 64563 / US
	02 / Eldridge, Benjamin N. 651 Sheri Lane Danville California 64526 / US
	03 / Mathieu, Gaetan L. 659 Orange Way Livermore California 94550 / US
Representative(s)	Harris, Ian Richard, et al D Young & Co LLP 120 Holborn London EC1N 2DY / GB
	[N/P]
Former [2009/28]	Harris, Ian Richard, et al D Young & Co 120 Holborn London EC1N 2DY / GB
Former [2005/52]	Mollekopf, Gerd Willi Kahler Käck Mollekopf, Vorderer Anger 239 86899 Landsberg a. Lech / DE
Application number, filing date	05014255.3	24.05.1996
	[2005/52]
Priority number, date	US19950452255	26.05.1995 Original published format: US 452255
	US19950526246	21.09.1995 Original published format: US 526246
	US19950533584	18.10.1995 Original published format: US 533584
	US19950554902	09.11.1995 Original published format: US 554902
	WO1995US14909	13.11.1995 Original published format: PCT/US95/14909
	US19950558332	15.11.1995 Original published format: US 558332
	US19960005189P	17.05.1996 Original published format: US 5189 P
	[2005/52]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP1610132
	Date:	28.12.2005
	Language:	EN
	[2005/52]
	Type:	A3 Search report
	No.:	EP1610132
	Date:	14.06.2006
	[2006/24]
	Type:	B1 Patent specification
	No.:	EP1610132
	Date:	14.01.2009
	Language:	EN
	[2009/03]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	17.05.2006
Classification	IPC:	G01R1/073	[2005/52]
	CPC:	H05K3/4015 (EP,US); B23K20/004 (EP); C23C18/1605 (EP); C25D7/123 (EP,US); G01R1/06727 (EP); G01R1/07357 (EP); (+) G01R3/00 (EP); H01L21/4853 (EP); H01L21/4889 (EP); H01L21/563 (EP); H01L22/20 (EP); H01L23/49811 (EP); H01L23/66 (EP); H01L24/06 (EP); H01L24/11 (EP); H01L24/13 (EP); H01L24/72 (EP); H01L24/81 (EP); H01L25/0652 (EP); H01L25/16 (EP); H05K3/326 (EP); B23K2101/40 (EP); C25D21/02 (EP); G01R1/06711 (EP); H01L2224/0401 (EP); H01L2224/04042 (EP); H01L2224/05644 (EP); H01L2224/05647 (EP); H01L2224/06136 (EP); H01L2224/11003 (EP); H01L2224/1147 (EP); H01L2224/13099 (EP); H01L2224/13111 (EP); H01L2224/16145 (EP); H01L2224/45014 (EP); H01L2224/45015 (EP); H01L2224/45124 (EP); H01L2224/45144 (EP); H01L2224/45147 (EP); H01L2224/48644 (EP); H01L2224/48647 (EP); H01L2224/48747 (EP); H01L2224/48844 (EP); H01L2224/48847 (EP); H01L2224/73203 (EP); H01L2224/81801 (EP); H01L2224/85201 (EP); H01L2224/85205 (EP); H01L2225/0651 (EP); H01L2225/06527 (EP); H01L2225/06555 (EP); H01L2225/06572 (EP); H01L24/45 (EP); H01L2924/0001 (EP); H01L2924/00014 (EP); H01L2924/01005 (EP); H01L2924/01006 (EP); H01L2924/01012 (EP); H01L2924/01013 (EP); H01L2924/01014 (EP); H01L2924/01015 (EP); H01L2924/01019 (EP); H01L2924/01022 (EP); H01L2924/01023 (EP); H01L2924/01027 (EP); H01L2924/01028 (EP); H01L2924/01029 (EP); H01L2924/01033 (EP); H01L2924/01039 (EP); H01L2924/01042 (EP); H01L2924/01045 (EP); H01L2924/01046 (EP); H01L2924/01047 (EP); H01L2924/01049 (EP); H01L2924/0105 (EP); H01L2924/01051 (EP); H01L2924/01057 (EP); H01L2924/01074 (EP); H01L2924/01075 (EP); H01L2924/01078 (EP); H01L2924/01079 (EP); H01L2924/01082 (EP); H01L2924/01322 (EP); H01L2924/014 (EP); H01L2924/10253 (EP); H01L2924/10329 (EP); H01L2924/14 (EP); H01L2924/1532 (EP); H01L2924/15787 (EP); H01L2924/19041 (EP); H01L2924/30107 (EP); H01L2924/3011 (EP); H01L2924/3025 (EP); H05K1/141 (EP); H05K2201/1031 (EP); H05K2201/10318 (EP); H05K2201/10757 (EP); H05K2201/10878 (EP); H05K3/20 (EP); H05K3/3421 (EP); H05K3/368 (EP); Y02P70/50 (EP) (-)
	C-Set:	H01L2224/05644, H01L2924/00014 (EP); H01L2224/13111, H01L2924/01079, H01L2924/00014 (EP); H01L2224/45015, H01L2924/00 (EP); H01L2224/45015, H01L2924/00014, H01L2924/20751 (EP); (+) H01L2224/45015, H01L2924/00014, H01L2924/20752 (EP); H01L2224/45015, H01L2924/00014, H01L2924/20753 (EP); H01L2224/45015, H01L2924/00014, H01L2924/20754 (EP); H01L2224/45015, H01L2924/00014, H01L2924/20755 (EP); H01L2224/45015, H01L2924/00014, H01L2924/20756 (EP); H01L2224/45015, H01L2924/00014, H01L2924/20757 (EP); H01L2224/45015, H01L2924/2075 (EP); H01L2224/45015, H01L2924/20751 (EP); H01L2224/45015, H01L2924/20752 (EP); H01L2224/45015, H01L2924/20753 (EP); H01L2224/45015, H01L2924/20754 (EP); H01L2224/45015, H01L2924/20755 (EP); H01L2224/45015, H01L2924/20756 (EP); H01L2224/45015, H01L2924/20757 (EP); H01L2224/45124, H01L2924/00014 (EP); H01L2224/45144, H01L2924/00014 (EP); H01L2224/45147, H01L2924/00014 (EP); H01L2224/48644, H01L2924/00 (EP); H01L2224/48647, H01L2924/00 (EP); H01L2224/48744, H01L2924/00 (EP); H01L2224/48747, H01L2924/00 (EP); H01L2224/48844, H01L2924/00 (EP); H01L2224/48847, H01L2924/00 (EP); H01L2224/85205, H01L2224/45124, H01L2924/00 (EP); H01L2224/85205, H01L2224/45144, H01L2924/00 (EP); H01L2224/85205, H01L2224/45147, H01L2924/00 (EP); H01L2924/00014, H01L2224/05599 (EP); H01L2924/00014, H01L2224/45014, H01L2924/206 (EP); H01L2924/0001, H01L2224/13099 (EP); H01L2924/10253, H01L2924/00 (EP); H01L2924/15787, H01L2924/00 (EP) (-)
Designated contracting states	DE, FR [2007/08]
Former [2005/52]	DE, FR, GB
Title	German:	Herstellung von Verbindungen unter Verwendung von Opfersubstraten	[2009/03]
	English:	Fabricating interconnects using sacrificial substrates	[2005/52]
	French:	Fabrication d'elements d'interconnexion utilisant des substacts sacrificiels	[2005/52]
	Former [2005/52]	Herstellung von Verbindungen unter Verwendung von Offersubstraten
Examination procedure	23.06.2006	Examination requested [2006/32]
	06.10.2006	Despatch of a communication from the examining division (Time limit: M04)
	15.12.2006	Loss of particular rights, legal effect: designated state(s)
	13.02.2007	Reply to a communication from the examining division
	10.04.2007	Despatch of communication of loss of particular rights: designated state(s) GB
	11.02.2008	Despatch of a communication from the examining division (Time limit: M01)
	14.03.2008	Reply to a communication from the examining division
	15.07.2008	Communication of intention to grant the patent
	13.11.2008	Fee for grant paid
	13.11.2008	Fee for publishing/printing paid
Parent application(s) Tooltip	EP96923204.0 / EP0859686
Divisional application(s)	EP09000368.2 / EP2063466
Opposition(s)	15.10.2009	No opposition filed within time limit [2009/52]
Fees paid	Renewal fee
	21.10.2005	Renewal fee patent year 03
	21.10.2005	Renewal fee patent year 04
	21.10.2005	Renewal fee patent year 05
	21.10.2005	Renewal fee patent year 06
	21.10.2005	Renewal fee patent year 07
	21.10.2005	Renewal fee patent year 08
	21.10.2005	Renewal fee patent year 09
	21.10.2005	Renewal fee patent year 10
	31.05.2006	Renewal fee patent year 11
	30.05.2007	Renewal fee patent year 12
	28.05.2008	Renewal fee patent year 13
	Penalty fee
	Penalty fee Rule 85a EPC 1973
	18.01.2007	GB M01 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[A]US5187020 (KWON OH-KYONG [US], et al) [A] 1,5,9,12-14,32* claims 1,2 *

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