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Extract from the Register of European Patents

EP About this file: EP1635624

EP1635624 - Wired circuit board [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  10.07.2009
Database last updated on 18.11.2024
Most recent event   Tooltip10.07.2009Withdrawal of applicationpublished on 12.08.2009  [2009/33]
Applicant(s)For all designated states
NITTO DENKO CORPORATION
1-1-2, Shimohozumi
Ibaraki-shi, Osaka 567-8680 / JP
[2006/11]
Inventor(s)01 / Kanagawa, Hitoki
Nitto Denko Corporation 1-2 Shimo-hozumi 1-chome
Ibaraki-shi Osaka 567-8680 / JP
02 / Ohsawa, Tetsuya
Nitto Denko Corporation 1-2 Shimo-hozumi 1-chome
Ibaraki-shi Osaka 567-8680 / JP
03 / Ooyabu, Yasunari
Nitto Denko Corporation 1-2 Shimo-hozumi 1-chome
Ibaraki-shi Osaka 567-8680 / JP
 [2006/11]
Representative(s)SSM Sandmair
Patentanwälte Rechtsanwalt
Partnerschaft mbB
Joseph-Wild-Straße 20
81829 München / DE
[N/P]
Former [2008/40]Schwabe - Sandmair - Marx
Patentanwälte Stuntzstrasse 16
81677 München / DE
Former [2006/11]Schwabe - Sandmair - Marx
Stuntzstrasse 16
81677 München / DE
Application number, filing date05018498.525.08.2005
[2006/11]
Priority number, dateJP2004026727514.09.2004         Original published format: JP 2004267275
[2006/11]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1635624
Date:15.03.2006
Language:EN
[2006/11]
Type: A3 Search report 
No.:EP1635624
Date:01.08.2007
[2007/31]
Search report(s)(Supplementary) European search report - dispatched on:EP02.07.2007
ClassificationIPC:H05K1/11, H05K3/34, G11B5/48
[2006/11]
CPC:
G11B5/4853 (EP,US); G11B5/4846 (EP,US); G11B5/486 (EP,US);
H05K1/111 (EP,US); H01L2924/0002 (EP,US); H05K1/056 (EP,US);
H05K2201/09472 (EP,US); H05K2201/09745 (EP,US); H05K2203/041 (EP,US);
H05K3/3452 (EP,US); H05K3/3478 (EP,US); Y02P70/50 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR,   GB [2008/15]
Former [2006/11]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Leiterplatte[2006/11]
English:Wired circuit board[2006/11]
French:Panneau à circuit[2006/11]
Examination procedure01.02.2008Amendment by applicant (claims and/or description)
01.02.2008Examination requested  [2008/12]
02.02.2008Loss of particular rights, legal effect: designated state(s)
11.03.2008Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
29.06.2009Application withdrawn by applicant  [2009/33]
Fees paidRenewal fee
31.07.2007Renewal fee patent year 03
13.03.2008Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]US4940181  (JUSKEY JR FRANK J [US], et al) [X] 1* figure 2 *;
 [X]US5376584  (AGARWALA BIRENDRA N [US]) [X] 1 * figure 6 *;
 [X]US2002007961  (YAMATO TAKESHI [JP], et al) [X] 1,2 * paragraph [0051] - paragraph [0054]; figures 1,2 * * figures 4e,5a *;
 [X]US2002187585  (TSUKADA YUTAKA [JP], et al) [X] 1 * figure 2 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.