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EP1582294
European procedure
Extract from the Register of European Patents
EP About this file: EP1582294
| EP1582294 - Wafer polishing method. [Right-click to bookmark this link] | |||
| Former [2005/40] | Method of sucking water and water sucking device | ||
| [2011/42] | Status | No opposition filed within time limit Status updated on 25.01.2013 Database last updated on 31.08.2024 | Most recent event Tooltip | 25.01.2013 | No opposition filed within time limit | published on 27.02.2013 [2013/09] | Applicant(s) | For all designated states Fujikoshi Machinery Corporation 1650 Kiyono Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | [N/P] |
| Former [2012/12] | For all designated states Fujikoshi Machinery Corporation 1650 Kiyono, Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | ||
| Former [2005/40] | For all designated states Fujikoshi Machinery Corporation 1650 Kiyono, Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | Inventor(s) | 01 /
Nakamura, Yoshio Fujikoshi Machinery Corp. 1650 Kiyono Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | 02 /
Hashizume, Kenji Fujikoshi Machinery Corp. 1650 Kiyono Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | 03 /
Ogawa, Mitsue Fujikoshi Machinery Corp. 1650 Kiyono Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | [2012/12] |
| Former [2005/40] | 01 /
Nakamura, Yoshio Fujikoshi Machinery Corp. 1650 Kiyono Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | ||
| 02 /
Hashizume, Kenji Fujikoshi Machinery Corp. 1650 Kiyono Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | |||
| 03 /
Ogawa, Mitsue Fujikoshi Machinery Corp. 1650 Kiyono Matsushiro-machi Nagano-shi Nagano 381-1233 / JP | Representative(s) | Stuart, Ian Alexander, et al Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE / GB | [N/P] |
| Former [2012/12] | Stuart, Ian Alexander, et al Mewburn Ellis LLP 33 Gutter Lane London EC2V 8AS / GB | ||
| Former [2008/35] | Stuart, Ian Alexander, et al Mewburn Ellis LLP York House 23 Kingsway London WC2B 6HP / GB | ||
| Former [2005/40] | Stuart, Ian Alexander, et al Mewburn Ellis LLP York House 23 Kingsway London WC2B 6HP / GB | Application number, filing date | 05252050.9 | 31.03.2005 | [2005/40] | Priority number, date | JP20040104535 | 31.03.2004 Original published format: JP 2004104535 | JP20050053148 | 28.02.2005 Original published format: JP 2005053148 | [2005/40] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1582294 | Date: | 05.10.2005 | Language: | EN | [2005/40] | Type: | A3 Search report | No.: | EP1582294 | Date: | 12.04.2006 | [2006/15] | Type: | B1 Patent specification | No.: | EP1582294 | Date: | 21.03.2012 | Language: | EN | [2012/12] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.02.2006 | Classification | IPC: | B24B37/04, B24B55/12, B24B55/02 | [2006/15] | CPC: |
B24B37/30 (EP,US);
H01L21/304 (KR)
|
| Former IPC [2005/40] | B24B37/04, B24B55/12 | Designated contracting states | DE, FR, GB [2006/51] |
| Former [2005/40] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zum Polieren von Halbleitern | [2011/42] | English: | Wafer polishing method. | [2011/42] | French: | Procédé de polissage pour plaquette. | [2011/42] |
| Former [2005/40] | Verfahren und Vorrichtung zum Absaugen von Wasser | ||
| Former [2005/40] | Method of sucking water and water sucking device | ||
| Former [2005/40] | Procédé et dispositif d'aspiration d'eau | Examination procedure | 10.10.2006 | Examination requested [2006/47] | 24.03.2010 | Amendment by applicant (claims and/or description) | 09.05.2011 | Despatch of a communication from the examining division (Time limit: M04) | 09.09.2011 | Reply to a communication from the examining division | 06.10.2011 | Communication of intention to grant the patent | 30.01.2012 | Fee for grant paid | 30.01.2012 | Fee for publishing/printing paid | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 09.05.2011 | Opposition(s) | 02.01.2013 | No opposition filed within time limit [2013/09] | Fees paid | Renewal fee | 22.03.2007 | Renewal fee patent year 03 | 14.03.2008 | Renewal fee patent year 04 | 23.03.2009 | Renewal fee patent year 05 | 22.03.2010 | Renewal fee patent year 06 | 21.03.2011 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPS56164549 ; | [DA]JP2003011056 ; | [X]US4521995 (SEKIYA SHINJI [JP]) [X] 1-13 * column 4, lines 33-49; figure 9 *; | [A]US6193586 (PARK BAE-SEUNG [KR], et al) [A] 1,7 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19820407), vol. 006, no. 052, Database accession no. (E - 100), & JP56164549 A 19811217 (DISCO ABRASIVE SYS LTD) [A] 1,7 * abstract * | [DA] - PATENT ABSTRACTS OF JAPAN, (20030512), vol. 2003, no. 05, & JP2003011056 A 20030115 (SHIN ETSU HANDOTAI CO LTD) [DA] 1,7 * abstract * | Examination | US5558111 | by applicant | JP2003011056 |