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Extract from the Register of European Patents

EP About this file: EP1662849

EP1662849 - Method for manufacturing a three-dimensional interconnected support for light emitting diodes [Right-click to bookmark this link]
Former [2006/22]Method for manufacturing a three-dimensional interconnected support for light emmitting diodes
[2016/08]
StatusNo opposition filed within time limit
Status updated on  05.05.2017
Database last updated on 03.09.2024
Most recent event   Tooltip13.07.2018Lapse of the patent in a contracting state
New state(s): TR		published on 15.08.2018  [2018/33]
Applicant(s)For all designated states
VALEO VISION
34, rue Saint-André
93012 Bobigny Cedex / FR
[2016/26]
Former [2006/22]For all designated states
VALEO VISION
34, rue Saint-André
93012 Bobigny Cédex / FR
Inventor(s)01 / Richard, Stéphane
13 bis, rue Lavoisier
93700 Drancy / FR
02 / Nicolai, Jean-Marc
18, rue Blondel
92400 Courbevoie / FR
 [2006/22]
Application number, filing date05292453.718.11.2005
[2006/22]
Priority number, dateFR2004001239022.11.2004         Original published format: FR 0412390
[2006/22]
Filing languageFR
Procedural languageFR
PublicationType: A2 Application without search report 
No.:EP1662849
Date:31.05.2006
Language:FR
[2006/22]
Type: A3 Search report 
No.:EP1662849
Date:02.04.2008
[2008/14]
Type: B1 Patent specification 
No.:EP1662849
Date:29.06.2016
Language:FR
[2016/26]
Search report(s)(Supplementary) European search report - dispatched on:EP28.02.2008
ClassificationIPC:H05K1/00
[2006/22]
CPC:
H05K1/148 (EP,US); H05K1/0278 (EP,US); H05K1/0366 (EP,US);
H05K1/056 (EP,US); H05K1/181 (EP,US); H05K2201/09036 (EP,US);
H05K2201/09745 (EP,US); H05K2201/10106 (EP,US); H05K2203/302 (EP,US) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2016/26]
Former [2006/22]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Verfahren zur Herstellung einer verbundenen dreidimensionalen Trägerstruktur für Leuchtdioden[2006/22]
English:Method for manufacturing a three-dimensional interconnected support for light emitting diodes[2016/08]
French:Procédé de fabrication de support de diodes électroluminescentes interconnectées dans un environnement tridimensionnel[2006/22]
Former [2006/22]Method for manufacturing a three-dimensional interconnected support for light emmitting diodes
Examination procedure25.09.2008Examination requested  [2008/45]
18.12.2008Despatch of a communication from the examining division (Time limit: M06)
25.06.2009Reply to a communication from the examining division
10.12.2012Invitation to provide information on prior art
11.02.2013Reply to the invitation to provide information on prior art
03.02.2016Communication of intention to grant the patent
20.05.2016Fee for grant paid
20.05.2016Fee for publishing/printing paid
20.05.2016Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  18.12.2008
Opposition(s)30.03.2017No opposition filed within time limit [2017/23]
Fees paidRenewal fee
15.10.2007Renewal fee patent year 03
27.10.2008Renewal fee patent year 04
15.10.2009Renewal fee patent year 05
14.10.2010Renewal fee patent year 06
14.10.2011Renewal fee patent year 07
18.10.2012Renewal fee patent year 08
23.10.2013Renewal fee patent year 09
24.10.2014Renewal fee patent year 10
28.10.2015Renewal fee patent year 11
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU18.11.2005
AT29.06.2016
CY29.06.2016
CZ29.06.2016
DK29.06.2016
EE29.06.2016
ES29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
MC29.06.2016
NL29.06.2016
PL29.06.2016
RO29.06.2016
SE29.06.2016
SI29.06.2016
SK29.06.2016
TR29.06.2016
BG29.09.2016
GR30.09.2016
IS29.10.2016
PT31.10.2016
GB18.11.2016
IE18.11.2016
BE30.11.2016
CH30.11.2016
LI30.11.2016
LU30.11.2016
[2018/29]
Former [2018/28]HU18.11.2005
AT29.06.2016
CY29.06.2016
CZ29.06.2016
DK29.06.2016
EE29.06.2016
ES29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
MC29.06.2016
NL29.06.2016
PL29.06.2016
RO29.06.2016
SE29.06.2016
SI29.06.2016
SK29.06.2016
BG29.09.2016
GR30.09.2016
IS29.10.2016
PT31.10.2016
GB18.11.2016
IE18.11.2016
BE30.11.2016
CH30.11.2016
LI30.11.2016
LU30.11.2016
Former [2017/51]AT29.06.2016
CZ29.06.2016
DK29.06.2016
EE29.06.2016
ES29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
NL29.06.2016
PL29.06.2016
RO29.06.2016
SE29.06.2016
SI29.06.2016
SK29.06.2016
BG29.09.2016
GR30.09.2016
IS29.10.2016
PT31.10.2016
GB18.11.2016
IE18.11.2016
BE30.11.2016
CH30.11.2016
LI30.11.2016
LU30.11.2016
Former [2017/43]AT29.06.2016
CZ29.06.2016
DK29.06.2016
EE29.06.2016
ES29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
NL29.06.2016
PL29.06.2016
RO29.06.2016
SE29.06.2016
SI29.06.2016
SK29.06.2016
BG29.09.2016
GR30.09.2016
IS29.10.2016
PT31.10.2016
BE30.11.2016
CH30.11.2016
LI30.11.2016
LU30.11.2016
Former [2017/38]AT29.06.2016
CZ29.06.2016
DK29.06.2016
EE29.06.2016
ES29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
NL29.06.2016
PL29.06.2016
RO29.06.2016
SE29.06.2016
SI29.06.2016
SK29.06.2016
BG29.09.2016
GR30.09.2016
IS29.10.2016
PT31.10.2016
BE30.11.2016
CH30.11.2016
LI30.11.2016
Former [2017/11]AT29.06.2016
CZ29.06.2016
EE29.06.2016
ES29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
NL29.06.2016
PL29.06.2016
RO29.06.2016
SE29.06.2016
SK29.06.2016
GR30.09.2016
IS29.10.2016
PT31.10.2016
BE30.11.2016
Former [2017/10]CZ29.06.2016
EE29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
NL29.06.2016
PL29.06.2016
RO29.06.2016
SE29.06.2016
SK29.06.2016
GR30.09.2016
IS29.10.2016
BE30.11.2016
Former [2017/09]CZ29.06.2016
EE29.06.2016
FI29.06.2016
IT29.06.2016
LT29.06.2016
LV29.06.2016
NL29.06.2016
RO29.06.2016
SE29.06.2016
GR30.09.2016
Former [2016/52]FI29.06.2016
LT29.06.2016
LV29.06.2016
NL29.06.2016
SE29.06.2016
GR30.09.2016
Former [2016/51]FI29.06.2016
LT29.06.2016
LV29.06.2016
GR30.09.2016
Former [2016/49]FI29.06.2016
LT29.06.2016
Former [2016/46]LT29.06.2016
Documents cited:Search[X]GB2061623  (TEKTRONIX INC) [X] 7,8 * page 1, line 111 - page 2, line 76 * * figures 3,4 *;
 [X]DE3404644  (SIEMENS AG [DE]) [X] 1,3 * the whole document *;
 [XA]JPH04208588  (FUJITSU LTD, et al) [X] 1 * abstract *[A] 2-6;
 [X]DE19634371  (GRUNDIG AG [DE]) [X] 1,3 * the whole document *;
 [X]US2002068389  (GREEN PETER W [GB]) [X] 7,8 * abstract * * paragraphs [0011] - [0017] * * paragraph [0024] * * paragraphs [0041] - [0045] *;
 [X]US2003110627  (FERBER GOTTFRIED [DE], et al) [X] 1,2,4-6 * figures 2a-2c * * paragraphs [0046] - [0055] *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.