EP1662849 - Method for manufacturing a three-dimensional interconnected support for light emitting diodes [Right-click to bookmark this link] | |||
Former [2006/22] | Method for manufacturing a three-dimensional interconnected support for light emmitting diodes | ||
[2016/08] | Status | No opposition filed within time limit Status updated on 05.05.2017 Database last updated on 03.09.2024 | Most recent event Tooltip | 13.07.2018 | Lapse of the patent in a contracting state New state(s): TR | published on 15.08.2018 [2018/33] | Applicant(s) | For all designated states VALEO VISION 34, rue Saint-André 93012 Bobigny Cedex / FR | [2016/26] |
Former [2006/22] | For all designated states VALEO VISION 34, rue Saint-André 93012 Bobigny Cédex / FR | Inventor(s) | 01 /
Richard, Stéphane 13 bis, rue Lavoisier 93700 Drancy / FR | 02 /
Nicolai, Jean-Marc 18, rue Blondel 92400 Courbevoie / FR | [2006/22] | Application number, filing date | 05292453.7 | 18.11.2005 | [2006/22] | Priority number, date | FR20040012390 | 22.11.2004 Original published format: FR 0412390 | [2006/22] | Filing language | FR | Procedural language | FR | Publication | Type: | A2 Application without search report | No.: | EP1662849 | Date: | 31.05.2006 | Language: | FR | [2006/22] | Type: | A3 Search report | No.: | EP1662849 | Date: | 02.04.2008 | [2008/14] | Type: | B1 Patent specification | No.: | EP1662849 | Date: | 29.06.2016 | Language: | FR | [2016/26] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.02.2008 | Classification | IPC: | H05K1/00 | [2006/22] | CPC: |
H05K1/148 (EP,US);
H05K1/0278 (EP,US);
H05K1/0366 (EP,US);
H05K1/056 (EP,US);
H05K1/181 (EP,US);
H05K2201/09036 (EP,US);
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR [2016/26] |
Former [2006/22] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zur Herstellung einer verbundenen dreidimensionalen Trägerstruktur für Leuchtdioden | [2006/22] | English: | Method for manufacturing a three-dimensional interconnected support for light emitting diodes | [2016/08] | French: | Procédé de fabrication de support de diodes électroluminescentes interconnectées dans un environnement tridimensionnel | [2006/22] |
Former [2006/22] | Method for manufacturing a three-dimensional interconnected support for light emmitting diodes | Examination procedure | 25.09.2008 | Examination requested [2008/45] | 18.12.2008 | Despatch of a communication from the examining division (Time limit: M06) | 25.06.2009 | Reply to a communication from the examining division | 10.12.2012 | Invitation to provide information on prior art | 11.02.2013 | Reply to the invitation to provide information on prior art | 03.02.2016 | Communication of intention to grant the patent | 20.05.2016 | Fee for grant paid | 20.05.2016 | Fee for publishing/printing paid | 20.05.2016 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 18.12.2008 | Opposition(s) | 30.03.2017 | No opposition filed within time limit [2017/23] | Fees paid | Renewal fee | 15.10.2007 | Renewal fee patent year 03 | 27.10.2008 | Renewal fee patent year 04 | 15.10.2009 | Renewal fee patent year 05 | 14.10.2010 | Renewal fee patent year 06 | 14.10.2011 | Renewal fee patent year 07 | 18.10.2012 | Renewal fee patent year 08 | 23.10.2013 | Renewal fee patent year 09 | 24.10.2014 | Renewal fee patent year 10 | 28.10.2015 | Renewal fee patent year 11 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 18.11.2005 | AT | 29.06.2016 | CY | 29.06.2016 | CZ | 29.06.2016 | DK | 29.06.2016 | EE | 29.06.2016 | ES | 29.06.2016 | FI | 29.06.2016 | IT | 29.06.2016 | LT | 29.06.2016 | LV | 29.06.2016 | MC | 29.06.2016 | NL | 29.06.2016 | PL | 29.06.2016 | RO | 29.06.2016 | SE | 29.06.2016 | SI | 29.06.2016 | SK | 29.06.2016 | TR | 29.06.2016 | BG | 29.09.2016 | GR | 30.09.2016 | IS | 29.10.2016 | PT | 31.10.2016 | GB | 18.11.2016 | IE | 18.11.2016 | BE | 30.11.2016 | CH | 30.11.2016 | LI | 30.11.2016 | LU | 30.11.2016 | [2018/29] |
Former [2018/28] | HU | 18.11.2005 | |
AT | 29.06.2016 | ||
CY | 29.06.2016 | ||
CZ | 29.06.2016 | ||
DK | 29.06.2016 | ||
EE | 29.06.2016 | ||
ES | 29.06.2016 | ||
FI | 29.06.2016 | ||
IT | 29.06.2016 | ||
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
MC | 29.06.2016 | ||
NL | 29.06.2016 | ||
PL | 29.06.2016 | ||
RO | 29.06.2016 | ||
SE | 29.06.2016 | ||
SI | 29.06.2016 | ||
SK | 29.06.2016 | ||
BG | 29.09.2016 | ||
GR | 30.09.2016 | ||
IS | 29.10.2016 | ||
PT | 31.10.2016 | ||
GB | 18.11.2016 | ||
IE | 18.11.2016 | ||
BE | 30.11.2016 | ||
CH | 30.11.2016 | ||
LI | 30.11.2016 | ||
LU | 30.11.2016 | ||
Former [2017/51] | AT | 29.06.2016 | |
CZ | 29.06.2016 | ||
DK | 29.06.2016 | ||
EE | 29.06.2016 | ||
ES | 29.06.2016 | ||
FI | 29.06.2016 | ||
IT | 29.06.2016 | ||
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
NL | 29.06.2016 | ||
PL | 29.06.2016 | ||
RO | 29.06.2016 | ||
SE | 29.06.2016 | ||
SI | 29.06.2016 | ||
SK | 29.06.2016 | ||
BG | 29.09.2016 | ||
GR | 30.09.2016 | ||
IS | 29.10.2016 | ||
PT | 31.10.2016 | ||
GB | 18.11.2016 | ||
IE | 18.11.2016 | ||
BE | 30.11.2016 | ||
CH | 30.11.2016 | ||
LI | 30.11.2016 | ||
LU | 30.11.2016 | ||
Former [2017/43] | AT | 29.06.2016 | |
CZ | 29.06.2016 | ||
DK | 29.06.2016 | ||
EE | 29.06.2016 | ||
ES | 29.06.2016 | ||
FI | 29.06.2016 | ||
IT | 29.06.2016 | ||
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
NL | 29.06.2016 | ||
PL | 29.06.2016 | ||
RO | 29.06.2016 | ||
SE | 29.06.2016 | ||
SI | 29.06.2016 | ||
SK | 29.06.2016 | ||
BG | 29.09.2016 | ||
GR | 30.09.2016 | ||
IS | 29.10.2016 | ||
PT | 31.10.2016 | ||
BE | 30.11.2016 | ||
CH | 30.11.2016 | ||
LI | 30.11.2016 | ||
LU | 30.11.2016 | ||
Former [2017/38] | AT | 29.06.2016 | |
CZ | 29.06.2016 | ||
DK | 29.06.2016 | ||
EE | 29.06.2016 | ||
ES | 29.06.2016 | ||
FI | 29.06.2016 | ||
IT | 29.06.2016 | ||
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
NL | 29.06.2016 | ||
PL | 29.06.2016 | ||
RO | 29.06.2016 | ||
SE | 29.06.2016 | ||
SI | 29.06.2016 | ||
SK | 29.06.2016 | ||
BG | 29.09.2016 | ||
GR | 30.09.2016 | ||
IS | 29.10.2016 | ||
PT | 31.10.2016 | ||
BE | 30.11.2016 | ||
CH | 30.11.2016 | ||
LI | 30.11.2016 | ||
Former [2017/11] | AT | 29.06.2016 | |
CZ | 29.06.2016 | ||
EE | 29.06.2016 | ||
ES | 29.06.2016 | ||
FI | 29.06.2016 | ||
IT | 29.06.2016 | ||
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
NL | 29.06.2016 | ||
PL | 29.06.2016 | ||
RO | 29.06.2016 | ||
SE | 29.06.2016 | ||
SK | 29.06.2016 | ||
GR | 30.09.2016 | ||
IS | 29.10.2016 | ||
PT | 31.10.2016 | ||
BE | 30.11.2016 | ||
Former [2017/10] | CZ | 29.06.2016 | |
EE | 29.06.2016 | ||
FI | 29.06.2016 | ||
IT | 29.06.2016 | ||
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
NL | 29.06.2016 | ||
PL | 29.06.2016 | ||
RO | 29.06.2016 | ||
SE | 29.06.2016 | ||
SK | 29.06.2016 | ||
GR | 30.09.2016 | ||
IS | 29.10.2016 | ||
BE | 30.11.2016 | ||
Former [2017/09] | CZ | 29.06.2016 | |
EE | 29.06.2016 | ||
FI | 29.06.2016 | ||
IT | 29.06.2016 | ||
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
NL | 29.06.2016 | ||
RO | 29.06.2016 | ||
SE | 29.06.2016 | ||
GR | 30.09.2016 | ||
Former [2016/52] | FI | 29.06.2016 | |
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
NL | 29.06.2016 | ||
SE | 29.06.2016 | ||
GR | 30.09.2016 | ||
Former [2016/51] | FI | 29.06.2016 | |
LT | 29.06.2016 | ||
LV | 29.06.2016 | ||
GR | 30.09.2016 | ||
Former [2016/49] | FI | 29.06.2016 | |
LT | 29.06.2016 | ||
Former [2016/46] | LT | 29.06.2016 | Documents cited: | Search | [X]GB2061623 (TEKTRONIX INC) [X] 7,8 * page 1, line 111 - page 2, line 76 * * figures 3,4 *; | [X]DE3404644 (SIEMENS AG [DE]) [X] 1,3 * the whole document *; | [XA]JPH04208588 (FUJITSU LTD, et al) [X] 1 * abstract *[A] 2-6; | [X]DE19634371 (GRUNDIG AG [DE]) [X] 1,3 * the whole document *; | [X]US2002068389 (GREEN PETER W [GB]) [X] 7,8 * abstract * * paragraphs [0011] - [0017] * * paragraph [0024] * * paragraphs [0041] - [0045] *; | [X]US2003110627 (FERBER GOTTFRIED [DE], et al) [X] 1,2,4-6 * figures 2a-2c * * paragraphs [0046] - [0055] * |