EP1781741 - CURABLE ORGANOPOLYSILOXANE COMPOSITION, METHOD OF CURING THEREOF, SEMICONDUCTOR DEVICE, AND ADHESION PROMOTER [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.07.2009 Database last updated on 09.09.2024 | Most recent event Tooltip | 30.09.2011 | Lapse of the patent in a contracting state New state(s): CY, TR | published on 02.11.2011 [2011/44] | Applicant(s) | For all designated states Dow Corning Toray Co., Ltd. 1-3, Marunouchi 1-chome Chiyoda-ku Tokyo 100-0005 / JP | [2007/19] | Inventor(s) | 01 /
MORITA, Yoshitsugu, DOW CORNING TORAY CO., LTD. 2-2, Chigusakaigan Ichihara-shi, Chiba 299-0108 / JP | 02 /
KATO, Tomoko, DOW CORNING TORAY CO., LTD. 2-2, Chigusakaigan Ichihara-shi, Chiba 299-0108 / JP | 03 /
UEKI, Hiroshi, DOW CORNING TORAY CO., LTD. 2-2, Chigusakaigan Ichihara-shi, Chiba 299-0108 / JP | [2007/19] | Representative(s) | polypatent Braunsberger Feld 29 51429 Bergisch Gladbach / DE | [N/P] |
Former [2007/19] | polypatent Braunsberger Feld 29 51429 Bergisch Gladbach / DE | Application number, filing date | 05768714.7 | 28.07.2005 | [2007/19] | WO2005JP14354 | Priority number, date | JP20040222072 | 29.07.2004 Original published format: JP 2004222072 | JP20040237719 | 17.08.2004 Original published format: JP 2004237719 | [2007/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2006011676 | Date: | 02.02.2006 | Language: | EN | [2006/05] | Type: | A1 Application with search report | No.: | EP1781741 | Date: | 09.05.2007 | Language: | EN | The application published by WIPO in one of the EPO official languages on 02.02.2006 takes the place of the publication of the European patent application. | [2007/19] | Type: | B1 Patent specification | No.: | EP1781741 | Date: | 27.08.2008 | Language: | EN | [2008/35] | Search report(s) | International search report - published on: | EP | 02.02.2006 | Classification | IPC: | C08L83/04, C08F230/08, H01L23/29, H01L33/00 | [2007/19] | CPC: |
C08L83/04 (EP,KR,US);
C09J183/04 (KR);
H01L23/296 (EP,US);
C08G77/12 (EP,US);
C08G77/14 (EP,US);
C08G77/18 (EP,US);
C08G77/20 (EP,US);
C08G77/70 (EP,US);
C08L2205/03 (EP,US);
C08L43/04 (EP,US);
H01L2224/48091 (EP,US);
H01L2924/09701 (EP,US);
| C-Set: |
C08L83/04, C08L2666/02 (US,EP);
C08L83/04, C08L2666/04 (US,EP);
C08L83/04, C08L83/00 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP) | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR [2007/19] | Extension states | AL | Not yet paid | BA | Not yet paid | HR | Not yet paid | MK | Not yet paid | YU | Not yet paid | Title | German: | HÄRTBARE ORGANOPOLYSILOXANZUSAMMENSETZUNG, HÄRTUNGSVERFAHREN DAFÜR, HALBLEITERVORRICHTUNG UND HAFTVERMITTLER | [2007/19] | English: | CURABLE ORGANOPOLYSILOXANE COMPOSITION, METHOD OF CURING THEREOF, SEMICONDUCTOR DEVICE, AND ADHESION PROMOTER | [2007/19] | French: | COMPOSITION D"ORGANOPOLYSILOXANE DURCISSABLE, SON PROCEDE DE DURCISSEMENT, DISPOSITIF A SEMICONDUCTEUR ET ACCELERATEUR D"ADHESION | [2007/19] | Entry into regional phase | 02.02.2007 | National basic fee paid | 02.02.2007 | Designation fee(s) paid | 02.02.2007 | Examination fee paid | Examination procedure | 02.02.2007 | Examination requested [2007/19] | 08.06.2007 | Despatch of a communication from the examining division (Time limit: M04) | 05.10.2007 | Reply to a communication from the examining division | 30.11.2007 | Communication of intention to grant the patent | 08.05.2008 | Fee for grant paid | 08.05.2008 | Fee for publishing/printing paid | Opposition(s) | 28.05.2009 | No opposition filed within time limit [2009/32] | Request for further processing for: | The application is deemed to be withdrawn due to failure to fulfill actions required for granting the patent | 08.05.2008 | Request for further processing filed | 08.05.2008 | Full payment received (date of receipt of payment) Request granted | 30.05.2008 | Decision despatched | Fees paid | Renewal fee | 13.07.2007 | Renewal fee patent year 03 | 14.07.2008 | Renewal fee patent year 04 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 27.08.2008 | BE | 27.08.2008 | CY | 27.08.2008 | CZ | 27.08.2008 | DK | 27.08.2008 | EE | 27.08.2008 | FI | 27.08.2008 | LT | 27.08.2008 | LV | 27.08.2008 | NL | 27.08.2008 | PL | 27.08.2008 | RO | 27.08.2008 | SI | 27.08.2008 | SK | 27.08.2008 | TR | 27.08.2008 | BG | 27.11.2008 | SE | 27.11.2008 | GR | 28.11.2008 | ES | 08.12.2008 | IS | 27.12.2008 | PT | 27.01.2009 | HU | 28.02.2009 | [2011/43] |
Former [2011/32] | AT | 27.08.2008 | |
BE | 27.08.2008 | ||
CZ | 27.08.2008 | ||
DK | 27.08.2008 | ||
EE | 27.08.2008 | ||
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
PL | 27.08.2008 | ||
RO | 27.08.2008 | ||
SI | 27.08.2008 | ||
SK | 27.08.2008 | ||
BG | 27.11.2008 | ||
SE | 27.11.2008 | ||
GR | 28.11.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
PT | 27.01.2009 | ||
HU | 28.02.2009 | ||
Former [2011/01] | AT | 27.08.2008 | |
BE | 27.08.2008 | ||
CZ | 27.08.2008 | ||
DK | 27.08.2008 | ||
EE | 27.08.2008 | ||
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
PL | 27.08.2008 | ||
RO | 27.08.2008 | ||
SI | 27.08.2008 | ||
SK | 27.08.2008 | ||
BG | 27.11.2008 | ||
SE | 27.11.2008 | ||
GR | 28.11.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
PT | 27.01.2009 | ||
Former [2010/24] | AT | 27.08.2008 | |
BE | 27.08.2008 | ||
CZ | 27.08.2008 | ||
DK | 27.08.2008 | ||
EE | 27.08.2008 | ||
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
PL | 27.08.2008 | ||
RO | 27.08.2008 | ||
SI | 27.08.2008 | ||
SK | 27.08.2008 | ||
BG | 27.11.2008 | ||
SE | 27.11.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
PT | 27.01.2009 | ||
Former [2010/12] | AT | 27.08.2008 | |
BE | 27.08.2008 | ||
CZ | 27.08.2008 | ||
DK | 27.08.2008 | ||
EE | 27.08.2008 | ||
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
RO | 27.08.2008 | ||
SI | 27.08.2008 | ||
SK | 27.08.2008 | ||
BG | 27.11.2008 | ||
SE | 27.11.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
PT | 27.01.2009 | ||
Former [2009/52] | AT | 27.08.2008 | |
BE | 27.08.2008 | ||
CZ | 27.08.2008 | ||
DK | 27.08.2008 | ||
EE | 27.08.2008 | ||
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
RO | 27.08.2008 | ||
SI | 27.08.2008 | ||
SK | 27.08.2008 | ||
BG | 27.11.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
PT | 27.01.2009 | ||
Former [2009/27] | AT | 27.08.2008 | |
BE | 27.08.2008 | ||
CZ | 27.08.2008 | ||
DK | 27.08.2008 | ||
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
RO | 27.08.2008 | ||
SI | 27.08.2008 | ||
SK | 27.08.2008 | ||
BG | 27.11.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
PT | 27.01.2009 | ||
Former [2009/19] | AT | 27.08.2008 | |
BE | 27.08.2008 | ||
DK | 27.08.2008 | ||
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
SI | 27.08.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
Former [2009/14] | AT | 27.08.2008 | |
FI | 27.08.2008 | ||
LT | 27.08.2008 | ||
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
SI | 27.08.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
Former [2009/12] | LT | 27.08.2008 | |
LV | 27.08.2008 | ||
NL | 27.08.2008 | ||
ES | 08.12.2008 | ||
IS | 27.12.2008 | ||
Former [2009/10] | LT | 27.08.2008 | |
NL | 27.08.2008 | ||
IS | 27.12.2008 | Cited in | International search | [ADY]JPH08291254 ; | [ADY]JP2001240750 ; | [AY]JP2000191914 ; | [A]JP2003147214 ; | [AY]WO2004037927 (DOW CORNING TORAY SILICONE [JP], et al) [A] 1-10 * paragraphs [0001] , [0020] , [0040]; claim - * [Y] 11-13 | [ADY] - PATENT ABSTRACTS OF JAPAN, (19970331), vol. 1997, no. 03, & JP08291254 A 19961105 (SHIN ETSU CHEM CO LTD) [AD] 1-10 * abstract * * paragraphs [0012], [0024], [0028]; * * claim - * [Y] 11-13 | [ADY] - PATENT ABSTRACTS OF JAPAN, (20020701), vol. 2000, no. 26, & JP2001240750 A 20010904 (DOW CORNING TORAY SILICONE CO LTD) [AD] 1-10 * abstract * * paragraphs [0009] , [0015] , [0018] * * Reference Examples 2, 3, 5 * * example 2 * * claims 1-12 * [Y] 11-13 | [AY] - PATENT ABSTRACTS OF JAPAN, (20001117), vol. 2000, no. 10, & JP2000191914 A 20000711 (DOW CORNING TORAY SILICONE CO LTD) [A] 1-10 * abstract * * paragraphs [0018] , [0024] , [0026] , [0027]; example 5 * * claims 1-9 * [Y] 11-13 | [A] - PATENT ABSTRACTS OF JAPAN, (20030903), vol. 2003, no. 09, & JP2003147214 A 20030521 (DOW CORNING TORAY SILICONE CO LTD) [A] 1-13 * abstract * * paragraphs [0024] , [0026] , [0027] * * examples 4,5,7; table 1 * * claims 1-9 * |