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EP About this file: EP1806769

EP1806769 - SOI WAFER MANUFACTURING METHOD [Right-click to bookmark this link]
Former [2007/28]	SOI WAFER MANUFACTURING METHOD AND SOI WAFER
	[2013/23]
Status	No opposition filed within time limit Status updated on 12.09.2014 Database last updated on 03.09.2024
Most recent event Tooltip	12.09.2014	No opposition filed within time limit	published on 15.10.2014 [2014/42]
Applicant(s)	For all designated states Shin-Etsu Handotai Co., Ltd. 6-2, Ohtemachi 2-chome Chiyoda-ku Tokyo / JP
	[2009/17]
Former [2007/28]	For all designated states SHIN-ETSU HANDOTAI COMPANY LIMITED 4-2, Marunouchi 1-Chome Chiyoda-ku Tokyo 100-0005 / JP
Inventor(s)	01 / AGA, Hiroji, SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	02 / KOBAYASHI, Norihiro SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	03 / IMAI, Masayuki SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	04 / ENOMOTO, Tatsuo SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	05 / TAKENO, Hiroshi, SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	[2013/45]
Former [2007/28]	01 / AGA, Hiroji, SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	02 / KOBAYASHI, Norihiro SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	03 / IMAI, Masayuki SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	04 / ENOMOTO, Tatsuo SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
	05 / TAKENO, Hiroshi, SHIN-ETSU HANDOTAI CO., LTD. Yokonodaira Plant 507, Aza Matsubara Nakanoya Annaka-shi, Gunma 379-0125 / JP
Representative(s)	Merkle, Gebhard Ter Meer Steinmeister & Partner Patentanwälte mbB Mauerkircherstrasse 45 81679 München / DE
	[N/P]
Former [2013/45]	Merkle, Gebhard Ter Meer Steinmeister & Partner Mauerkircherstrasse 45 81679 München / DE
Former [2007/28]	Merkle, Gebhard TER MEER STEINMEISTER & PARTNER GbR, Patentanwälte, Mauerkircherstrasse 45 81679 München / DE
Application number, filing date	05778598.2	09.09.2005
	[2007/28]
	WO2005JP16582
Priority number, date	JP20040265901	13.09.2004 Original published format: JP 2004265901
	JP20040268901	15.09.2004 Original published format: JP 2004268901
	[2007/28]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2006030699
	Date:	23.03.2006
	Language:	EN
	[2006/12]
	Type:	A1 Application with search report
	No.:	EP1806769
	Date:	11.07.2007
	Language:	EN
	The application published by WIPO in one of the EPO official languages on 23.03.2006 takes the place of the publication of the European patent application.
	[2007/28]
	Type:	B1 Patent specification
	No.:	EP1806769
	Date:	06.11.2013
	Language:	EN
	[2013/45]
Search report(s)	International search report - published on:	JP	23.03.2006
	(Supplementary) European search report - dispatched on:	EP	09.09.2010
Classification	IPC:	H01L21/762, H01L21/322	[2013/23]
	CPC:	H01L21/76254 (EP,US); H01L27/12 (KR); H01L21/02 (KR); H01L21/3226 (EP,US)
	Former IPC [2007/28]	H01L21/02, H01L27/12
Designated contracting states	DE, FR [2007/51]
Former [2007/28]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
Title	German:	HERSTELLUNGSVERFAHREN FÜR EINEN SOI-WAFER	[2013/23]
	English:	SOI WAFER MANUFACTURING METHOD	[2013/23]
	French:	PROCEDE DE FABRICATION D'UNE PLAQUETTE DE SOI	[2013/23]
	Former [2007/28]	HERSTELLUNGSVERFAHREN FÜR EINEN SOI-WAFER UND SOI-WAFER
	Former [2007/28]	SOI WAFER MANUFACTURING METHOD AND SOI WAFER
	Former [2007/28]	PROCEDE DE FABRICATION DE PLAQUETTE DE SOI ET PLAQUETTE DE SOI
Entry into regional phase	12.04.2007	Translation filed
	12.04.2007	National basic fee paid
	12.04.2007	Search fee paid
	12.04.2007	Designation fee(s) paid
	12.04.2007	Examination fee paid
Examination procedure	12.04.2007	Examination requested [2007/28]
	02.02.2011	Amendment by applicant (claims and/or description)
	20.06.2011	Despatch of a communication from the examining division (Time limit: M04)
	14.10.2011	Reply to a communication from the examining division
	05.06.2013	Communication of intention to grant the patent
	25.09.2013	Fee for grant paid
	25.09.2013	Fee for publishing/printing paid
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 20.06.2011
Opposition(s)	07.08.2014	No opposition filed within time limit [2014/42]
Fees paid	Renewal fee
	12.04.2007	Renewal fee patent year 03
	26.09.2008	Renewal fee patent year 04
	21.09.2009	Renewal fee patent year 05
	27.09.2010	Renewal fee patent year 06
	20.09.2011	Renewal fee patent year 07
	20.09.2012	Renewal fee patent year 08
	19.09.2013	Renewal fee patent year 09
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[Y]US2004063298 (AGA HIROJI [JP], et al) [Y] 1-4,9-17 * page 2, paragraph 16 - page 8, paragraph 113; figure 1 *;
		[Y] - SHIMIZU HIROFUMI ET AL, "WARPAGE OF CZOCHRALSKI-GROWN SILICON WAFERS AS AFFECTED BY OXYGEN PRECIPITATION.", JAPANESE JOURNAL OF APPLIED PHYSICS, PART 1: REGULAR PAPERS & SHORT NOTES, (198507), vol. 24, no. 7, pages 815 - 821, XP002595738 [Y] 1-4,9-17 * abstract * DOI: http://dx.doi.org/10.1143/JJAP.24.815
	International search	[Y]JPH06295912 (TOSHIBA CERAMICS CO);
		[A]JPH08107078 (NEC CORP);
		[A]JPH11330437 (NEC CORP);
		[Y]JP2002009081 (TOSHIBA CORP);
		[Y]WO03079447 (SHINETSU HANDOTAI KK [JP], et al)

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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