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Extract from the Register of European Patents

EP About this file: EP1833285

EP1833285 - ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING STRUCTURE [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  23.03.2012
Database last updated on 28.06.2024
Most recent event   Tooltip23.03.2012Withdrawal of applicationpublished on 25.04.2012  [2012/17]
Applicant(s)For all designated states
Panasonic Corporation
1006, Oaza Kadoma
Kadoma-shi
Osaka 571-8501 / JP
[N/P]
Former [2008/47]For all designated states
Panasonic Corporation
1006, Oaza Kadoma Kadoma-shi
Osaka 571-8501 / JP
Former [2007/37]For all designated states
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, Oaza Kadoma, Kadoma-shi
Osaka 571-8501 / JP
Inventor(s)01 / WADA, Yoshiyuki c/o Mat.Elec.Ind.Co., Ltd. IPROC
19F Matsushita IMP Bldg., 3-7, Shiromi 1-chome
Chuo-ku, Osaka-shi, Osaka 540-6319 / JP
02 / SAKAI, Tadahiko c/o Mat.Elec.Ind.Co., Ltd. IPROC
19F Matsushita IMP Bldg., 3-7, Shiromi 1-chome
Chuo-ku, Osaka-shi, Osaka 540-6319 / JP
 [2007/37]
Representative(s)Pautex Schneider, Nicole Véronique, et al
Novagraaf International SA
Chemin de l'Echo 3
1213 Onex / CH
[N/P]
Former [N/P]Pautex Schneider, Nicole Véronique, et al
Novagraaf International SA 25, Avenue du Pailly
1220 Les Avanchets - Geneva / CH
Former [2007/37]Pautex Schneider, Nicole Véronique, et al
Novagraaf International SA 25, avenue du Pailly
1220 Les Avanchets - Geneva / CH
Application number, filing date05820159.121.12.2005
[2007/37]
WO2005JP23465
Priority number, dateJP2004037607127.12.2004         Original published format: JP 2004376071
[2007/37]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2006070658
Date:06.07.2006
Language:EN
[2006/27]
Type: A1 Application with search report 
No.:EP1833285
Date:12.09.2007
Language:EN
The application published by WIPO in one of the EPO official languages on 06.07.2006 takes the place of the publication of the European patent application.
[2007/37]
Search report(s)International search report - published on:JP06.07.2006
ClassificationIPC:H05K3/34, H05K1/18
[2007/37]
CPC:
H05K1/18 (KR); H05K3/305 (EP,US); H05K3/3485 (EP,US);
H05K2201/10636 (EP,US); H05K2201/10977 (EP,US); Y02P70/50 (EP,US);
Y10T29/4913 (EP,US); Y10T29/49144 (EP,US); Y10T29/49146 (EP,US) (-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2007/37]
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
YUNot yet paid
TitleGerman:ANBRINGVERFAHREN UND ANBRINGSTRUKTUR FÜR ELEKTRONISCHE KOMPONENTEN[2007/37]
English:ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING STRUCTURE[2007/37]
French:PROCEDE DE MONTAGE DE COMPOSANT ELECTRONIQUE ET STRUCTURE DE MONTAGE DE COMPOSANT ELECTRONIQUE[2007/37]
Entry into regional phase11.08.2006Translation filed 
11.08.2006National basic fee paid 
11.08.2006Search fee paid 
11.08.2006Designation fee(s) paid 
11.08.2006Examination fee paid 
Examination procedure11.08.2006Examination requested  [2007/37]
19.03.2012Application withdrawn by applicant  [2012/17]
Fees paidRenewal fee
10.12.2007Renewal fee patent year 03
20.03.2008Renewal fee patent year 04
22.12.2009Renewal fee patent year 05
28.12.2010Renewal fee patent year 06
21.12.2011Renewal fee patent year 07
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Cited inInternational search[Y]JPH0745927  (IBIDEN CO LTD);
 [Y]JPH09167890  (MATSUSHITA ELECTRIC IND CO LTD);
 [Y]JPS58166070U
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.