EP1701361 - Low stress conductive adhesive [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.02.2011 Database last updated on 24.08.2024 | Most recent event Tooltip | 04.10.2013 | Lapse of the patent in a contracting state New state(s): HU | published on 06.11.2013 [2013/45] | Applicant(s) | For all designated states Henkel AG & Co. KGaA Henkelstraße 67 40589 Düsseldorf / DE | [N/P] |
Former [2009/20] | For all designated states Henkel AG & Co. KGaA Henkelstrasse 67 40589 Düsseldorf / DE | ||
Former [2006/37] | For all designated states National Starch and Chemical Investment Holding Corporation 1000 Uniqema Boulevard New Castle Delaware 19720 / US | Inventor(s) | 01 /
Cheng, Chih-Min 15 Vine Brook Road Westford, Massachussetts 01886 / US | 02 /
Collins, Andrew 50 Old Farm Road Bedford New Hampshire 03031 / US | [2006/37] | Representative(s) | (deleted) | [2010/02] |
Former [2006/37] | Held, Stephan, et al Meissner, Bolte & Partner GbR Postfach 86 03 29 81630 München / DE | Application number, filing date | 06004488.0 | 06.03.2006 | [2006/37] | Priority number, date | US20050073778 | 07.03.2005 Original published format: US 73778 | [2006/37] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1701361 | Date: | 13.09.2006 | Language: | EN | [2006/37] | Type: | B1 Patent specification | No.: | EP1701361 | Date: | 21.04.2010 | Language: | EN | [2010/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.04.2006 | Classification | IPC: | H01B1/00 | [2006/37] | CPC: |
H01B1/22 (EP,US);
A01C1/02 (KR);
A01G31/06 (KR);
C08L63/00 (EP,US);
C09J9/02 (EP,US);
H01L24/29 (EP,US);
H01L24/83 (EP,US);
H05K3/321 (EP,US);
C08L33/00 (EP,US);
H01L2224/29111 (EP,US);
H01L2224/2919 (EP,US);
H01L2224/2929 (EP,US);
H01L2224/29311 (EP,US);
H01L2224/29313 (EP,US);
H01L2224/29324 (EP,US);
H01L2224/29339 (EP,US);
H01L2224/29344 (EP,US);
H01L2224/29347 (EP,US);
H01L2224/29364 (EP,US);
H01L2224/29369 (EP,US);
H01L2224/29386 (EP,US);
H01L2224/29388 (EP,US);
H01L2224/29393 (EP,US);
H01L2224/29439 (EP,US);
H01L2224/838 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/01027 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01046 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/01049 (EP,US);
H01L2924/0105 (EP,US);
H01L2924/01051 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/0132 (EP,US);
H01L2924/01322 (EP,US);
H01L2924/014 (EP,US);
H01L2924/0665 (EP,US);
H01L2924/0781 (EP,US);
| C-Set: |
C08L63/00, C08L2666/04 (US,EP);
H01L2224/29111, H01L2924/01082, H01L2924/00015 (US,EP);
H01L2224/2929, H01L2924/0665, H01L2924/00014 (EP,US);
H01L2224/29311, H01L2924/00014 (EP,US);
H01L2224/29311, H01L2924/01083, H01L2924/00014 (US,EP);
H01L2224/29313, H01L2924/00014 (EP,US);
H01L2224/29324, H01L2924/00014 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/29344, H01L2924/00014 (US,EP);
H01L2224/29347, H01L2924/00014 (US,EP);
H01L2224/29364, H01L2924/00014 (US,EP);
H01L2224/29369, H01L2924/00014 (EP,US);
H01L2224/29386, H01L2924/00012 (US,EP);
H01L2224/29388, H01L2924/00014 (EP,US);
H01L2224/29393, H01L2924/00014 (US,EP);
H01L2224/29439, H01L2924/00014 (EP,US);
H01L2924/0132, H01L2924/0105, H01L2924/01082 (US,EP);
H01L2924/0132, H01L2924/0105, H01L2924/01083 (US,EP) (-) | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR [2006/37] | Title | German: | Spannungsarmer leitfaehiger Klebstoff | [2006/37] | English: | Low stress conductive adhesive | [2006/37] | French: | Adhesif conducteur à faible contrainte | [2006/37] | Examination procedure | 02.03.2007 | Examination requested [2007/16] | 03.04.2007 | Despatch of a communication from the examining division (Time limit: M06) | 05.10.2007 | Reply to a communication from the examining division | 26.10.2007 | Despatch of a communication from the examining division (Time limit: M06) | 18.04.2008 | Reply to a communication from the examining division | 08.05.2008 | Despatch of a communication from the examining division (Time limit: M06) | 18.11.2008 | Reply to a communication from the examining division | 12.03.2009 | Despatch of a communication from the examining division (Time limit: M06) | 21.08.2009 | Reply to a communication from the examining division | 21.09.2009 | Communication of intention to grant the patent | 21.01.2010 | Fee for grant paid | 21.01.2010 | Fee for publishing/printing paid | Opposition(s) | 24.01.2011 | No opposition filed within time limit [2011/13] | Fees paid | Renewal fee | 31.03.2008 | Renewal fee patent year 03 | 30.03.2009 | Renewal fee patent year 04 | 15.03.2010 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 21.04.2010 | BE | 21.04.2010 | CZ | 21.04.2010 | DK | 21.04.2010 | EE | 21.04.2010 | FI | 21.04.2010 | HU | 21.04.2010 | LT | 21.04.2010 | LV | 21.04.2010 | NL | 21.04.2010 | PL | 21.04.2010 | RO | 21.04.2010 | SE | 21.04.2010 | SI | 21.04.2010 | SK | 21.04.2010 | TR | 21.04.2010 | CY | 05.05.2010 | BG | 21.07.2010 | GR | 22.07.2010 | ES | 01.08.2010 | IS | 21.08.2010 | PT | 23.08.2010 | [2013/45] |
Former [2013/44] | AT | 21.04.2010 | |
BE | 21.04.2010 | ||
CZ | 21.04.2010 | ||
DK | 21.04.2010 | ||
EE | 21.04.2010 | ||
FI | 21.04.2010 | ||
LT | 21.04.2010 | ||
LV | 21.04.2010 | ||
NL | 21.04.2010 | ||
PL | 21.04.2010 | ||
RO | 21.04.2010 | ||
SE | 21.04.2010 | ||
SI | 21.04.2010 | ||
SK | 21.04.2010 | ||
TR | 21.04.2010 | ||
CY | 05.05.2010 | ||
BG | 21.07.2010 | ||
GR | 22.07.2010 | ||
ES | 01.08.2010 | ||
IS | 21.08.2010 | ||
PT | 23.08.2010 | ||
Former [2013/42] | AT | 21.04.2010 | |
BE | 21.04.2010 | ||
CZ | 21.04.2010 | ||
DK | 21.04.2010 | ||
EE | 21.04.2010 | ||
FI | 21.04.2010 | ||
LT | 21.04.2010 | ||
LV | 21.04.2010 | ||
NL | 21.04.2010 | ||
PL | 21.04.2010 | ||
RO | 21.04.2010 | ||
SE | 21.04.2010 | ||
SI | 21.04.2010 | ||
SK | 21.04.2010 | ||
CY | 05.05.2010 | ||
BG | 21.07.2010 | ||
GR | 22.07.2010 | ||
ES | 01.08.2010 | ||
IS | 21.08.2010 | ||
PT | 23.08.2010 | ||
Former [2011/16] | AT | 21.04.2010 | |
BE | 21.04.2010 | ||
CZ | 21.04.2010 | ||
DK | 21.04.2010 | ||
EE | 21.04.2010 | ||
FI | 21.04.2010 | ||
LT | 21.04.2010 | ||
LV | 21.04.2010 | ||
NL | 21.04.2010 | ||
PL | 21.04.2010 | ||
RO | 21.04.2010 | ||
SE | 21.04.2010 | ||
SI | 21.04.2010 | ||
SK | 21.04.2010 | ||
CY | 05.05.2010 | ||
GR | 22.07.2010 | ||
ES | 01.08.2010 | ||
IS | 21.08.2010 | ||
PT | 23.08.2010 | ||
Former [2011/12] | AT | 21.04.2010 | |
CZ | 21.04.2010 | ||
DK | 21.04.2010 | ||
EE | 21.04.2010 | ||
FI | 21.04.2010 | ||
LT | 21.04.2010 | ||
LV | 21.04.2010 | ||
NL | 21.04.2010 | ||
PL | 21.04.2010 | ||
RO | 21.04.2010 | ||
SE | 21.04.2010 | ||
SI | 21.04.2010 | ||
SK | 21.04.2010 | ||
CY | 05.05.2010 | ||
GR | 22.07.2010 | ||
ES | 01.08.2010 | ||
IS | 21.08.2010 | ||
PT | 23.08.2010 | ||
Former [2011/08] | AT | 21.04.2010 | |
DK | 21.04.2010 | ||
EE | 21.04.2010 | ||
FI | 21.04.2010 | ||
LT | 21.04.2010 | ||
LV | 21.04.2010 | ||
NL | 21.04.2010 | ||
PL | 21.04.2010 | ||
SE | 21.04.2010 | ||
SI | 21.04.2010 | ||
CY | 05.05.2010 | ||
GR | 22.07.2010 | ||
ES | 01.08.2010 | ||
IS | 21.08.2010 | ||
PT | 23.08.2010 | ||
Former [2011/03] | AT | 21.04.2010 | |
FI | 21.04.2010 | ||
LT | 21.04.2010 | ||
LV | 21.04.2010 | ||
NL | 21.04.2010 | ||
PL | 21.04.2010 | ||
SE | 21.04.2010 | ||
SI | 21.04.2010 | ||
CY | 05.05.2010 | ||
GR | 22.07.2010 | ||
ES | 01.08.2010 | ||
IS | 21.08.2010 | ||
Former [2011/02] | AT | 21.04.2010 | |
FI | 21.04.2010 | ||
LT | 21.04.2010 | ||
LV | 21.04.2010 | ||
NL | 21.04.2010 | ||
SE | 21.04.2010 | ||
SI | 21.04.2010 | ||
GR | 22.07.2010 | ||
ES | 01.08.2010 | ||
IS | 21.08.2010 | ||
Former [2010/45] | NL | 21.04.2010 | Documents cited: | Search | [X]US4695508 (KAGEYAMA KUNIO [JP], et al) [X] 1-16* the whole document *; | [X]EP0325022 (TOSHIBA KK [JP], et al) [X] 1-16 * the whole document *; | [X]US4999136 (SU WEI-FANG A [US], et al) [X] 1-16 * the whole document *; | [X]EP0512546 (NEC CORP [JP]) [X] 1-16 * the whole document *; | [X]US5250228 (BAIGRIE STEPHEN [US], et al) [X] 1-16 * the whole document *; | [X]EP0892027 (RAYTHEON CO [US]) [X] 1-16 * the whole document *; | [X]US5863988 (HASHIMOTO TAKESHI [JP], et al) [X] 1-16 * the whole document *; | [X]WO9967324 (LOCTITE CORP [US], et al) [X] 1-16 * the whole document *; | [X]US6246123 (LANDERS JR JAMES F [US], et al) [X] 1-16 * the whole document *; | [X]US6344155 (KITAHARA HIROSHI [JP], et al) [X] 1-16 * the whole document *; | [PX]WO2005056675 (LORD CORP [US]) [PX] 1-16 * the whole document *; | [PX]EP1602674 (DAINIPPON INK & CHEMICALS [JP]) [PX] 1-16 * the whole document * | by applicant | US499136 | US4695508 | EP0325022 | EP0512546 | US5250228 | EP0892027 | US5863988 | WO9967324 | US6246123 | US6344155 | WO2005056675 | EP1602674 |