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Extract from the Register of European Patents

EP About this file: EP1701361

EP1701361 - Low stress conductive adhesive [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  25.02.2011
Database last updated on 24.08.2024
Most recent event   Tooltip04.10.2013Lapse of the patent in a contracting state
New state(s): HU		published on 06.11.2013  [2013/45]
Applicant(s)For all designated states
Henkel AG & Co. KGaA
Henkelstraße 67
40589 Düsseldorf / DE
[N/P]
Former [2009/20]For all designated states
Henkel AG & Co. KGaA
Henkelstrasse 67
40589 Düsseldorf / DE
Former [2006/37]For all designated states
National Starch and Chemical Investment Holding Corporation
1000 Uniqema Boulevard New Castle
Delaware 19720 / US
Inventor(s)01 / Cheng, Chih-Min
15 Vine Brook Road
Westford, Massachussetts 01886 / US
02 / Collins, Andrew
50 Old Farm Road
Bedford New Hampshire 03031 / US
 [2006/37]
Representative(s)(deleted)
[2010/02]
Former [2006/37]Held, Stephan, et al
Meissner, Bolte & Partner GbR Postfach 86 03 29
81630 München / DE
Application number, filing date06004488.006.03.2006
[2006/37]
Priority number, dateUS2005007377807.03.2005         Original published format: US 73778
[2006/37]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1701361
Date:13.09.2006
Language:EN
[2006/37]
Type: B1 Patent specification 
No.:EP1701361
Date:21.04.2010
Language:EN
[2010/16]
Search report(s)(Supplementary) European search report - dispatched on:EP11.04.2006
ClassificationIPC:H01B1/00
[2006/37]
CPC:
H01B1/22 (EP,US); A01C1/02 (KR); A01G31/06 (KR);
C08L63/00 (EP,US); C09J9/02 (EP,US); H01L24/29 (EP,US);
H01L24/83 (EP,US); H05K3/321 (EP,US); C08L33/00 (EP,US);
H01L2224/29111 (EP,US); H01L2224/2919 (EP,US); H01L2224/2929 (EP,US);
H01L2224/29311 (EP,US); H01L2224/29313 (EP,US); H01L2224/29324 (EP,US);
H01L2224/29339 (EP,US); H01L2224/29344 (EP,US); H01L2224/29347 (EP,US);
H01L2224/29364 (EP,US); H01L2224/29369 (EP,US); H01L2224/29386 (EP,US);
H01L2224/29388 (EP,US); H01L2224/29393 (EP,US); H01L2224/29439 (EP,US);
H01L2224/838 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US); H01L2924/01015 (EP,US); H01L2924/01027 (EP,US);
H01L2924/01029 (EP,US); H01L2924/01033 (EP,US); H01L2924/01046 (EP,US);
H01L2924/01047 (EP,US); H01L2924/01049 (EP,US); H01L2924/0105 (EP,US);
H01L2924/01051 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US); H01L2924/0132 (EP,US); H01L2924/01322 (EP,US);
H01L2924/014 (EP,US); H01L2924/0665 (EP,US); H01L2924/0781 (EP,US);
H01L2924/09701 (EP,US); H01L2924/14 (EP,US); H01L2924/3011 (EP,US) (-)
C-Set:
C08L63/00, C08L2666/04 (US,EP);
H01L2224/29111, H01L2924/01082, H01L2924/00015 (US,EP);
H01L2224/2929, H01L2924/0665, H01L2924/00014 (EP,US);
H01L2224/29311, H01L2924/00014 (EP,US);
H01L2224/29311, H01L2924/01083, H01L2924/00014 (US,EP);
H01L2224/29313, H01L2924/00014 (EP,US);
H01L2224/29324, H01L2924/00014 (US,EP);
H01L2224/29339, H01L2924/00014 (US,EP);
H01L2224/29344, H01L2924/00014 (US,EP);
H01L2224/29347, H01L2924/00014 (US,EP);
H01L2224/29364, H01L2924/00014 (US,EP);
H01L2224/29369, H01L2924/00014 (EP,US);
H01L2224/29386, H01L2924/00012 (US,EP);
H01L2224/29388, H01L2924/00014 (EP,US);
H01L2224/29393, H01L2924/00014 (US,EP);
H01L2224/29439, H01L2924/00014 (EP,US);
H01L2924/0132, H01L2924/0105, H01L2924/01082 (US,EP);
H01L2924/0132, H01L2924/0105, H01L2924/01083 (US,EP)
(-)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2006/37]
TitleGerman:Spannungsarmer leitfaehiger Klebstoff[2006/37]
English:Low stress conductive adhesive[2006/37]
French:Adhesif conducteur à faible contrainte[2006/37]
Examination procedure02.03.2007Examination requested  [2007/16]
03.04.2007Despatch of a communication from the examining division (Time limit: M06)
05.10.2007Reply to a communication from the examining division
26.10.2007Despatch of a communication from the examining division (Time limit: M06)
18.04.2008Reply to a communication from the examining division
08.05.2008Despatch of a communication from the examining division (Time limit: M06)
18.11.2008Reply to a communication from the examining division
12.03.2009Despatch of a communication from the examining division (Time limit: M06)
21.08.2009Reply to a communication from the examining division
21.09.2009Communication of intention to grant the patent
21.01.2010Fee for grant paid
21.01.2010Fee for publishing/printing paid
Opposition(s)24.01.2011No opposition filed within time limit [2011/13]
Fees paidRenewal fee
31.03.2008Renewal fee patent year 03
30.03.2009Renewal fee patent year 04
15.03.2010Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT21.04.2010
BE21.04.2010
CZ21.04.2010
DK21.04.2010
EE21.04.2010
FI21.04.2010
HU21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
PL21.04.2010
RO21.04.2010
SE21.04.2010
SI21.04.2010
SK21.04.2010
TR21.04.2010
CY05.05.2010
BG21.07.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
PT23.08.2010
[2013/45]
Former [2013/44]AT21.04.2010
BE21.04.2010
CZ21.04.2010
DK21.04.2010
EE21.04.2010
FI21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
PL21.04.2010
RO21.04.2010
SE21.04.2010
SI21.04.2010
SK21.04.2010
TR21.04.2010
CY05.05.2010
BG21.07.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
PT23.08.2010
Former [2013/42]AT21.04.2010
BE21.04.2010
CZ21.04.2010
DK21.04.2010
EE21.04.2010
FI21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
PL21.04.2010
RO21.04.2010
SE21.04.2010
SI21.04.2010
SK21.04.2010
CY05.05.2010
BG21.07.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
PT23.08.2010
Former [2011/16]AT21.04.2010
BE21.04.2010
CZ21.04.2010
DK21.04.2010
EE21.04.2010
FI21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
PL21.04.2010
RO21.04.2010
SE21.04.2010
SI21.04.2010
SK21.04.2010
CY05.05.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
PT23.08.2010
Former [2011/12]AT21.04.2010
CZ21.04.2010
DK21.04.2010
EE21.04.2010
FI21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
PL21.04.2010
RO21.04.2010
SE21.04.2010
SI21.04.2010
SK21.04.2010
CY05.05.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
PT23.08.2010
Former [2011/08]AT21.04.2010
DK21.04.2010
EE21.04.2010
FI21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
PL21.04.2010
SE21.04.2010
SI21.04.2010
CY05.05.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
PT23.08.2010
Former [2011/03]AT21.04.2010
FI21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
PL21.04.2010
SE21.04.2010
SI21.04.2010
CY05.05.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
Former [2011/02]AT21.04.2010
FI21.04.2010
LT21.04.2010
LV21.04.2010
NL21.04.2010
SE21.04.2010
SI21.04.2010
GR22.07.2010
ES01.08.2010
IS21.08.2010
Former [2010/45]NL21.04.2010
Documents cited:Search[X]US4695508  (KAGEYAMA KUNIO [JP], et al) [X] 1-16* the whole document *;
 [X]EP0325022  (TOSHIBA KK [JP], et al) [X] 1-16 * the whole document *;
 [X]US4999136  (SU WEI-FANG A [US], et al) [X] 1-16 * the whole document *;
 [X]EP0512546  (NEC CORP [JP]) [X] 1-16 * the whole document *;
 [X]US5250228  (BAIGRIE STEPHEN [US], et al) [X] 1-16 * the whole document *;
 [X]EP0892027  (RAYTHEON CO [US]) [X] 1-16 * the whole document *;
 [X]US5863988  (HASHIMOTO TAKESHI [JP], et al) [X] 1-16 * the whole document *;
 [X]WO9967324  (LOCTITE CORP [US], et al) [X] 1-16 * the whole document *;
 [X]US6246123  (LANDERS JR JAMES F [US], et al) [X] 1-16 * the whole document *;
 [X]US6344155  (KITAHARA HIROSHI [JP], et al) [X] 1-16 * the whole document *;
 [PX]WO2005056675  (LORD CORP [US]) [PX] 1-16 * the whole document *;
 [PX]EP1602674  (DAINIPPON INK & CHEMICALS [JP]) [PX] 1-16 * the whole document *
by applicantUS499136
 US4695508
 EP0325022
 EP0512546
 US5250228
 EP0892027
 US5863988
 WO9967324
 US6246123
 US6344155
 WO2005056675
 EP1602674
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.