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Extract from the Register of European Patents

EP About this file: EP1729557

EP1729557 - Cooling device for electronic components [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  19.05.2017
Database last updated on 22.08.2024
FormerExamination is in progress
Status updated on  02.02.2017
Most recent event   Tooltip19.05.2017Application deemed to be withdrawnpublished on 21.06.2017  [2017/25]
Applicant(s)For all designated states
Behr Industry GmbH & Co. KG
Heilbronner Strasse 380
70469 Stuttgart / DE
[2006/49]
Inventor(s)01 / Flesch, Markus
Dinkelgarbe 13
70806 Kornwestheim / DE
02 / Siebrecht, Thomas
Stiergasse 15
71642 Ludwigsburg / DE
 [2006/49]
Representative(s)BRP Renaud & Partner mbB Rechtsanwälte Patentanwälte Steuerberater
Königstraße 28
70173 Stuttgart / DE
[N/P]
Former [2011/26]BRP Renaud & Partner
Rechtsanwälte Notare Patentanwälte Königstrasse 28
70173 Stuttgart / DE
Former [2011/21]Grauel, Andreas, et al
Behr GmbH & Co. KG Intellectual Property, G-IP Mauserstrasse 3
70469 Stuttgart / DE
Former [2006/49]Mantel, Berthold Friedrich, et al
Behr GmbH & Co. KG Intellectual Property, G-IP Mauserstrasse 3
70469 Stuttgart / DE
Application number, filing date06010568.123.05.2006
[2006/49]
Priority number, dateDE2005102538131.05.2005         Original published format: DE102005025381
[2006/49]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP1729557
Date:06.12.2006
Language:DE
[2006/49]
Type: A3 Search report 
No.:EP1729557
Date:02.07.2008
[2008/27]
Search report(s)(Supplementary) European search report - dispatched on:EP02.06.2008
ClassificationIPC:H05K7/20, H01L23/473
[2006/49]
CPC:
H01L23/473 (EP,US); H01L2924/0002 (EP,US)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2006/49]
TitleGerman:Vorrichtung zur Kühlung von elektronischen Bauelementen[2006/49]
English:Cooling device for electronic components[2006/49]
French:Dispositif pour refroidir des composants électroniques[2006/49]
Examination procedure05.01.2009Examination requested  [2009/09]
15.04.2009Despatch of a communication from the examining division (Time limit: M04)
20.08.2009Reply to a communication from the examining division
02.12.2011Despatch of a communication from the examining division (Time limit: M06)
08.06.2012Reply to a communication from the examining division
31.08.2016Despatch of a communication from the examining division (Time limit: M04)
10.01.2017Application deemed to be withdrawn, date of legal effect  [2017/25]
02.02.2017Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2017/25]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  15.04.2009
Fees paidRenewal fee
02.06.2008Renewal fee patent year 03
02.06.2009Renewal fee patent year 04
31.05.2010Renewal fee patent year 05
24.05.2011Renewal fee patent year 06
25.05.2012Renewal fee patent year 07
31.05.2013Renewal fee patent year 08
02.06.2014Renewal fee patent year 09
29.05.2015Renewal fee patent year 10
31.03.2016Renewal fee patent year 11
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]GB1349920  (SIEMENS AG) [X] 1-4,6,8 * page 2, line 17 - line 73; figures 1,2 *;
 [A]EP0516280  (MINNESOTA MINING & MFG [US]) [A] * the whole document *;
 [X]EP1175135  (MITSUBISHI MATERIALS CORP [JP]) [X] 1-8 * paragraph [0028] - paragraph [0033]; figures 1,2 *;
 [X]DE20121168U  (AGILENT TECHNOLOGIES INC [US]) [X] 1-4,6,8 * page 8, line 6 - line 22; figure 3 *;
 [X]DE20208106U  (DANFOSS SILICON POWER GMBH [DE]) [X] 1-4,8 * page 5, line 12 - line 18 * * page 6, line 29 - page 7, line 16 *;
 [PX]EP1564809  (HITACHI LTD [JP]) [PX] 1-4,6-8 * page 4, paragraph 16 - page 5, paragraph 19; figure 1 *
ExaminationBE844721
 JP2001358270
by applicantEP0278240
 DE4131739
 DE19806978
 DE19911205
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.