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EP1753091
European procedure
Extract from the Register of European Patents
EP About this file: EP1753091
| EP1753091 - A connector and a method of assembling it [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 30.01.2009 Database last updated on 13.11.2024 | Most recent event Tooltip | 30.01.2009 | No opposition filed within time limit | published on 04.03.2009 [2009/10] | Applicant(s) | For all designated states Sumitomo Wiring Systems, Ltd. 1-14, Nishisuehiro-cho Yokkaichi-city Mie 510-8503 / JP | [N/P] |
| Former [2007/07] | For all designated states Sumitomo Wiring Systems, Ltd. 1-14, Nishisuehiro-cho Yokkaichi-City Mie, 510-8503 / JP | Inventor(s) | 01 /
Nishide, Satoru Sumitomo Wiring Systems Ltd 1-14 Nishisuehiro-cho Yokkaichi-City Mie 510-8503 / JP | [2007/07] | Representative(s) | Müller-Boré & Partner Patentanwälte PartG mbB Friedenheimer Brücke 21 80639 München / DE | [N/P] |
| Former [2007/07] | Müller-Boré & Partner Patentanwälte Grafinger Strasse 2 81671 München / DE | Application number, filing date | 06012418.7 | 16.06.2006 | [2007/07] | Priority number, date | JP20050186878 | 27.06.2005 Original published format: JP 2005186878 | [2007/07] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1753091 | Date: | 14.02.2007 | Language: | EN | [2007/07] | Type: | B1 Patent specification | No.: | EP1753091 | Date: | 26.03.2008 | Language: | EN | [2008/13] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.01.2007 | Classification | IPC: | H01R13/447 | [2007/07] | CPC: |
H01R13/447 (EP,US);
H01R13/62938 (EP,US);
H01R2201/20 (EP,US)
| Designated contracting states | DE, FR [2007/42] |
| Former [2007/07] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verbinder und Montageverfahren | [2007/07] | English: | A connector and a method of assembling it | [2007/07] | French: | Connecteur et procédé de montage | [2007/07] | Examination procedure | 29.06.2006 | Examination requested [2007/07] | 13.06.2007 | Communication of intention to grant the patent | 23.10.2007 | Fee for grant paid | 23.10.2007 | Fee for publishing/printing paid | Opposition(s) | 30.12.2008 | No opposition filed within time limit [2009/10] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US2002086580 (KURIMOTO NAOYA [JP], et al) [A] 1-4,6,8 * paragraph [0066] - paragraph [0069]; figures 19-21 *; | [A]EP1137118 (YAZAKI CORP [JP]) [A] 1,10 * paragraph [0041] - paragraph [0043]; figures 4,5 * |