EP1753015 - Silicon wafer cleaning method [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 29.09.2017 Database last updated on 24.08.2024 | Most recent event Tooltip | 29.09.2017 | No opposition filed within time limit | published on 01.11.2017 [2017/44] | Applicant(s) | For all designated states SUMCO Corporation 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | [2007/07] | Inventor(s) | 01 /
Okuuchi, Shigeru Sumco Corporation 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | 02 /
Endou, Mitsuhiro Sumco Corporation 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | 03 /
Tanaka, Tomoya Sumco Corporation 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | [2016/47] |
Former [2007/07] | 01 /
Okuuchi, Shigeru Sumco Corporation 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | ||
02 /
Endou, Mitsuhiro Sumco Corporation 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | |||
03 /
Tanaka, Tomoya Sumco Corporation 2-1, Shibaura 1-chome Minato-ku Tokyo / JP | Representative(s) | Adam, Holger, et al Kraus & Weisert Patentanwälte PartGmbB Thomas-Wimmer-Ring 15 80539 München / DE | [2014/38] |
Former [2007/07] | Albrecht, Thomas, et al Kraus & Weisert Patent- und Rechtsanwälte Thomas-Wimmer-Ring 15 80539 München / DE | Application number, filing date | 06016243.5 | 03.08.2006 | [2007/07] | Priority number, date | JP20050231430 | 10.08.2005 Original published format: JP 2005231430 | [2007/07] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1753015 | Date: | 14.02.2007 | Language: | EN | [2007/07] | Type: | A3 Search report | No.: | EP1753015 | Date: | 20.08.2008 | [2008/34] | Type: | B1 Patent specification | No.: | EP1753015 | Date: | 23.11.2016 | Language: | EN | [2016/47] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.07.2008 | Classification | IPC: | H01L21/306, B08B3/08, C11D3/39, C11D11/00 | [2016/27] | CPC: |
B08B3/08 (EP,US);
C11D3/3947 (EP,US);
H01L21/02052 (EP,US);
C11D1/66 (EP,US);
C11D2111/22 (EP,US);
C11D2111/44 (EP,US)
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Former IPC [2007/07] | H01L21/02, B08B3/08 | Designated contracting states | DE, FR [2016/47] |
Former [2009/18] | DE, FR | ||
Former [2007/07] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zur Reinigung eines Siliziumwafers | [2007/07] | English: | Silicon wafer cleaning method | [2007/07] | French: | Méthode de nettoyage d'une plaquette de silicium | [2007/07] | Examination procedure | 03.08.2006 | Examination requested [2007/07] | 02.12.2008 | Despatch of a communication from the examining division (Time limit: M04) | 11.12.2008 | Invitation to provide information on prior art | 21.02.2009 | Loss of particular rights, legal effect: designated state(s) | 25.03.2009 | Reply to a communication from the examining division | 25.03.2009 | Reply to the invitation to provide information on prior art | 31.03.2009 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR | 11.07.2014 | Despatch of a communication from the examining division (Time limit: M04) | 10.10.2014 | Reply to a communication from the examining division | 16.06.2016 | Communication of intention to grant the patent | 10.10.2016 | Fee for grant paid | 10.10.2016 | Fee for publishing/printing paid | 10.10.2016 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 02.12.2008 | Opposition(s) | 24.08.2017 | No opposition filed within time limit [2017/44] | Fees paid | Renewal fee | 14.08.2008 | Renewal fee patent year 03 | 11.08.2009 | Renewal fee patent year 04 | 10.08.2010 | Renewal fee patent year 05 | 12.08.2011 | Renewal fee patent year 06 | 10.08.2012 | Renewal fee patent year 07 | 09.08.2013 | Renewal fee patent year 08 | 08.08.2014 | Renewal fee patent year 09 | 26.06.2015 | Renewal fee patent year 10 | 21.06.2016 | Renewal fee patent year 11 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]WO0113418 (MEMC ELECTRONIC MATERIALS [US]) [Y] 1-3 * pages 7-20; figure 1 *; | [Y] - LIU Y ET AL, "Study on the cleaning of silicon after CMP in ULSI", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, (20030401), vol. 66, no. 1-4, ISSN 0167-9317, pages 433 - 437, XP004421549 [Y] 1-3 * the whole document * DOI: http://dx.doi.org/10.1016/S0167-9317(02)00906-1 | Examination | JP2003282511 |