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Extract from the Register of European Patents

EP About this file: EP1770785

EP1770785 - Semiconductor device and method of manifacturing a semiconductor device [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  19.06.2009
Database last updated on 02.11.2024
Most recent event   Tooltip19.06.2009Withdrawal of applicationpublished on 22.07.2009  [2009/30]
Applicant(s)For all designated states
ATMEL Germany GmbH
Theresienstrasse 2
74072 Heilbronn / DE
[2007/14]
Inventor(s)01 / Florian, Tobias, Dipl.-Ing.
Kaindlstrasse 32
70569 Stuttgart / DE
02 / Graf, Michael, Dr.
Im Seidenbäumle 35
71397 Leutenbach / DE
03 / Schwantes, Stefan, Dr.
Rombachstrasse 19
74080 Heilbronn / DE
 [2007/14]
Representative(s)Müller, Wolf-Christian
Koch Müller Patentanwaltsgesellschaft mbH Maassstrasse 32/1
69123 Heidelberg / DE
[2009/26]
Former [2007/14]Müller, Wolf-Christian
Patentanwalt Pilgramsroth 21E
96450 Coburg / DE
Application number, filing date06020196.927.09.2006
[2007/14]
Priority number, dateDE2005104662429.09.2005         Original published format: DE102005046624
[2007/14]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP1770785
Date:04.04.2007
Language:DE
[2007/14]
Search report(s)(Supplementary) European search report - dispatched on:EP29.12.2006
ClassificationIPC:H01L29/78, H01L27/12, H01L21/336, H01L21/84, H01L21/768, H01L21/74, H01L21/762, // H01L29/786
[2007/14]
CPC:
H01L29/7824 (EP,US); H01L21/743 (EP,US); H01L23/535 (EP,US);
H01L29/66681 (EP,US); H01L21/76205 (EP,US); H01L21/76251 (EP,US);
H01L21/76286 (EP,US); H01L27/1203 (EP,US); H01L29/78603 (EP,US);
H01L29/78639 (EP,US); H01L2924/0002 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR [2007/50]
Former [2007/14]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung[2007/14]
English:Semiconductor device and method of manifacturing a semiconductor device[2007/14]
French:Dispositif semiconducteur et méthode de fabrication d'un dispositif semiconducteur[2007/14]
Examination procedure27.09.2006Examination requested  [2007/14]
15.03.2007Amendment by applicant (claims and/or description)
15.06.2009Application withdrawn by applicant  [2009/30]
Fees paidRenewal fee
11.09.2008Renewal fee patent year 03
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Documents cited:Search[XD]US2003094654  (CHRISTENSEN TODD ALAN [US], et al) [XD] 1-3,7-12* paragraphs [0021] , [0022]; figure 4 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.