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Extract from the Register of European Patents

EP About this file: EP1791174

EP1791174 - Processes for regenerating layer transferred wafer [Right-click to bookmark this link]
Former [2007/22]A process for regenerating layer transferred wafer and layer transferred wafer regenerated by the process
[2018/23]
StatusNo opposition filed within time limit
Status updated on  10.01.2020
Database last updated on 14.09.2024
FormerThe patent has been granted
Status updated on  01.02.2019
FormerGrant of patent is intended
Status updated on  13.11.2018
FormerExamination is in progress
Status updated on  12.09.2018
FormerGrant of patent is intended
Status updated on  17.05.2018
Most recent event   Tooltip10.01.2020No opposition filed within time limitpublished on 12.02.2020  [2020/07]
Applicant(s)For all designated states
SUMCO CORPORATION
2-1, Shibaura 1-chome Minato-ku
Tokyo / JP
[2007/22]
Inventor(s)01 / Okuda, Hidehiko
c/o Sumco Corporation
2-1,Shibaura 1-chome
Minato-ku
Tokyo / JP
02 / Endo, Akihiko
c/o Sumco Corporation
2-1,Shibaura 1-chome
Minato-ku
Tokyo / JP
03 / Kusaba, Tatsumi
c/o Sumco Corporation
2-1,Shibaura 1-chome
Minato-ku
Tokyo / JP
 [2019/10]
Former [2007/22]01 / Okuda, Hidehiko
Sumco Corporation 2-1,Shibaura 1-chome Minato-ku
Tokyo / JP
02 / Endo, Akihiko
Sumco Corporation 2-1,Shibaura 1-chome Minato-ku
Tokyo / JP
03 / Kusaba, Tatsumi
Sumco Corporation 2-1,Shibaura 1-chome Minato-ku
Tokyo / JP
Representative(s)Adam, Holger, et al
Kraus & Weisert
Patentanwälte PartGmbB
Thomas-Wimmer-Ring 15
80539 München / DE
[2014/38]
Former [2007/22]Albrecht, Thomas
Kraus & Weisert Patent- und Rechtsanwälte Thomas-Wimmer-Ring 15
80539 München / DE
Application number, filing date06023455.610.11.2006
[2007/22]
Priority number, dateJP2005034139728.11.2005         Original published format: JP 2005341397
[2007/22]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1791174
Date:30.05.2007
Language:EN
[2007/22]
Type: A3 Search report 
No.:EP1791174
Date:28.05.2008
[2008/22]
Type: B1 Patent specification 
No.:EP1791174
Date:06.03.2019
Language:EN
[2019/10]
Search report(s)(Supplementary) European search report - dispatched on:EP29.04.2008
ClassificationIPC:H01L21/762, H01L21/324, H01L21/302, H01L21/322, H01L21/304, H01L21/306
[2018/23]
CPC:
H01L21/3247 (EP,US); H01L21/20 (KR); H01L21/3225 (EP,US);
H01L21/76254 (EP,US); H01L21/304 (EP,US); H01L21/30625 (EP,US)
Former IPC [2008/22]H01L21/762, H01L21/324, H01L21/302, H01L21/322
Former IPC [2007/22]H01L21/762, H01L21/324, H01L21/302, H01L21/304
Designated contracting statesFR [2019/10]
Former [2009/06]FR 
Former [2007/22]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Verfahren zur Regenerierung eines schichtübertragungswafers[2019/10]
English:Processes for regenerating layer transferred wafer[2018/23]
French:Procédés de régénération d'un substrat après transfert de couche[2018/23]
Former [2007/22]Verfahren zur Regenerierung eines Schichtübertragenen Substrats und mittels dieses Verfahrens hergestelltes Schichtübertragenes Substrats
Former [2007/22]A process for regenerating layer transferred wafer and layer transferred wafer regenerated by the process
Former [2007/22]Procédé de régénération d'un substrat après transfert de couche et substrat après transfert de couche obtenu par le procédé de régénération
Examination procedure10.11.2006Examination requested  [2007/22]
10.07.2008Despatch of a communication from the examining division (Time limit: M04)
31.07.2008Reply to a communication from the examining division
29.11.2008Loss of particular rights, legal effect: designated state(s)
14.01.2009Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
31.10.2014Despatch of a communication from the examining division (Time limit: M04)
23.01.2015Reply to a communication from the examining division
18.05.2018Communication of intention to grant the patent
12.09.2018Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
12.09.2018Fee for grant paid
12.09.2018Fee for publishing/printing paid
21.11.2018Communication of intention to grant the patent
21.01.2019Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  10.07.2008
Opposition(s)09.12.2019No opposition filed within time limit [2020/07]
Fees paidRenewal fee
17.11.2008Renewal fee patent year 03
24.11.2009Renewal fee patent year 04
23.11.2010Renewal fee patent year 05
23.11.2011Renewal fee patent year 06
23.11.2012Renewal fee patent year 07
28.11.2013Renewal fee patent year 08
25.11.2014Renewal fee patent year 09
24.11.2015Renewal fee patent year 10
23.11.2016Renewal fee patent year 11
24.11.2017Renewal fee patent year 12
22.11.2018Renewal fee patent year 13
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Documents cited:Search[A]EP0955671  (SHINETSU HANDOTAI KK [JP]) [A] 1-12 * column 10, paragraph 65 - column 11, paragraph 70 * * figure 2 *;
 [A]EP1087041  (SHINETSU HANDOTAI KK [JP]) [A] 1-12 * page 6, paragraph 49 * * page 7, paragraph 68 * * page 10, paragraphs 93-103 *;
 [A]US2001029072  (KUWAHARA SUSUMU [JP], et al) [A] 1-12* page 8, paragraph 128 *;
 [XA]EP1156531  (SHINETSU HANDOTAI KK [JP], et al) [X] 1,3-6,8-12 * column 7, paragraph 48 - column 8, paragraph 54 * * column 9, paragraph 57 - column 10, paragraph 68 * * figure 4 * [A] 2,7;
 [A]US2003054641  (BINNS MARTIN JEFFREY [US], et al) [A] 1-12 * page 9, paragraph 71 - page 10, paragraph 73 * * claims 11,17 *;
 [XA]US2005245048  (GRAF DIETER [DE], et al) [X] 12 * page 3, paragraph 40 - page 4, paragraph 46 * [A] 1-11
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.