blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP1740027

EP1740027 - Method for manufacturing an overmolded electronic assembly and electronic assembly [Right-click to bookmark this link]
Former [2007/01]Method for manufacturing an overmolded electronic assembly
[2018/37]
StatusNo opposition filed within time limit
Status updated on  05.12.2019
Database last updated on 02.11.2024
FormerThe patent has been granted
Status updated on  21.12.2018
FormerGrant of patent is intended
Status updated on  27.08.2018
Most recent event   Tooltip09.07.2021Lapse of the patent in a contracting state
New state(s): HU		published on 11.08.2021  [2021/32]
Applicant(s)For all designated states
Delphi Technologies, Inc.
P.O. Box 5052
Troy, MI 48007 / US
[2019/04]
Former [2007/01]For all designated states
Delphi Technologies, Inc.
P.O. Box 5052
Troy, Michigan 48007 / US
Inventor(s)01 / Brandenburg, Scott D.
4003 Hermitage Lane
Kokomo, IN 46902 / US
02 / Laudick, David A.
2886 E. 100 N.
Kokomo, IN 46901 / US
03 / Degenkolb, Thomas A.
1606 Chestnut Court
Noblesville, IN 46060 / US
04 / Walsh, Matthew R.
1888 West 500 South
Sharpsville, IN 46068 / US
05 / Tsai, Jeenhuei S.
858 Grace Drive
Carmel, IN 46032 / US
 [2007/01]
Representative(s)BorgWarner France SAS
Campus Saint Christophe
Bâtiment Galilée 2
10, avenue de l'Entreprise
95863 Cergy Pontoise Cedex / FR
[N/P]
Former [2019/04]Delphi France SAS
c/o Delphi Technologies
Campus Saint Christophe
Bâtiment Galilée 2
10, avenue de l'Entreprise
95863 Cergy Pontoise Cedex / FR
Former [2013/10]Robert, Vincent
Delphi France SAS
Bât. le Raspail - ZAC Paris Nord 2
22, avenue des Nations
CS 65059 Villepinte
95972 Roissy CDG Cedex / FR
Former [2008/34]Denton, Michael John, et al
Delphi European Headquarters 64 avenue de la Pleine de France Paris Nord II B.P. 65059, Tremblay en France
95972 Roissy Charles de Gaulle Cedex / FR
Former [2007/01]Denton, Michael John, et al
Delphi European Headquarters, 64 avenue de la Plaine de France, Paris Nord II, B.P. 65059, Tremblay en France
95972 Roissy Charles de Gaulle Cedex / FR
Application number, filing date06076193.908.06.2006
[2007/01]
Priority number, dateUS2005016747327.06.2005         Original published format: US 167473
[2007/01]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1740027
Date:03.01.2007
Language:EN
[2007/01]
Type: A3 Search report 
No.:EP1740027
Date:03.06.2009
[2009/23]
Type: B1 Patent specification 
No.:EP1740027
Date:23.01.2019
Language:EN
[2019/04]
Search report(s)(Supplementary) European search report - dispatched on:EP04.05.2009
ClassificationIPC:H05K3/28
[2007/01]
CPC:
H01L23/4334 (EP,US); B29C45/14467 (EP,US); B29C45/14655 (EP,US);
H01L23/3121 (EP,US); H05K3/284 (EP,US); B29C45/14065 (EP,US);
H01L2924/0002 (EP,US); H05K1/0203 (EP,US); H05K2201/10189 (EP,US);
H05K2201/1056 (EP,US); H05K2201/10674 (EP,US); H05K2203/1316 (EP,US);
H05K3/0061 (EP,US) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2019/04]
Former [2007/01]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Herstellungsverfahren einer umgossenen elektronischen Baugruppe und elektronische Baugruppe[2018/38]
English:Method for manufacturing an overmolded electronic assembly and electronic assembly[2018/37]
French:Procédé de fabrication d'un assemblage électronique surmoulé et assemblage électronique[2018/37]
Former [2007/01]Hertellungsverfahren einer umgossenen elektronischen Baugruppe
Former [2007/01]Method for manufacturing an overmolded electronic assembly
Former [2007/01]Procédé de fabrication d'un assemblage électronique surmoulé
Examination procedure03.12.2009Examination requested  [2010/02]
28.01.2010Despatch of a communication from the examining division (Time limit: M04)
26.05.2010Reply to a communication from the examining division
28.08.2018Communication of intention to grant the patent
13.12.2018Fee for grant paid
13.12.2018Fee for publishing/printing paid
13.12.2018Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  28.01.2010
Opposition(s)24.10.2019No opposition filed within time limit [2020/01]
Fees paidRenewal fee
30.06.2008Renewal fee patent year 03
30.06.2009Renewal fee patent year 04
30.06.2010Renewal fee patent year 05
30.06.2011Renewal fee patent year 06
02.07.2012Renewal fee patent year 07
01.07.2013Renewal fee patent year 08
30.06.2014Renewal fee patent year 09
30.06.2015Renewal fee patent year 10
30.06.2016Renewal fee patent year 11
30.06.2017Renewal fee patent year 12
02.07.2018Renewal fee patent year 13
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU08.06.2006
AT23.01.2019
CY23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
MC23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SI23.01.2019
SK23.01.2019
TR23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
IE08.06.2019
LU08.06.2019
BE30.06.2019
CH30.06.2019
LI30.06.2019
[2021/32]
Former [2021/26]AT23.01.2019
CY23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
MC23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SI23.01.2019
SK23.01.2019
TR23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
IE08.06.2019
LU08.06.2019
BE30.06.2019
CH30.06.2019
LI30.06.2019
Former [2020/25]AT23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
MC23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SI23.01.2019
SK23.01.2019
TR23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
IE08.06.2019
LU08.06.2019
BE30.06.2019
CH30.06.2019
LI30.06.2019
Former [2020/21]AT23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
MC23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SI23.01.2019
SK23.01.2019
TR23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
IE08.06.2019
Former [2020/17]AT23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
MC23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SI23.01.2019
SK23.01.2019
TR23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2020/13]AT23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
MC23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SI23.01.2019
SK23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2020/09]AT23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
MC23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SK23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2020/03]AT23.01.2019
CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SK23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2019/49]CZ23.01.2019
DK23.01.2019
EE23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
NL23.01.2019
PL23.01.2019
RO23.01.2019
SE23.01.2019
SK23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2019/48]DK23.01.2019
ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
NL23.01.2019
PL23.01.2019
SE23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2019/46]ES23.01.2019
FI23.01.2019
IT23.01.2019
LT23.01.2019
LV23.01.2019
NL23.01.2019
PL23.01.2019
SE23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2019/39]ES23.01.2019
FI23.01.2019
LT23.01.2019
LV23.01.2019
NL23.01.2019
PL23.01.2019
SE23.01.2019
BG23.04.2019
GR24.04.2019
IS23.05.2019
PT23.05.2019
Former [2019/38]ES23.01.2019
FI23.01.2019
LT23.01.2019
NL23.01.2019
PL23.01.2019
SE23.01.2019
BG23.04.2019
GR24.04.2019
PT23.05.2019
Former [2019/37]ES23.01.2019
FI23.01.2019
LT23.01.2019
NL23.01.2019
PL23.01.2019
SE23.01.2019
GR24.04.2019
PT23.05.2019
Former [2019/35]ES23.01.2019
FI23.01.2019
LT23.01.2019
NL23.01.2019
PL23.01.2019
SE23.01.2019
PT23.05.2019
Former [2019/34]FI23.01.2019
LT23.01.2019
NL23.01.2019
SE23.01.2019
PT23.05.2019
Former [2019/33]FI23.01.2019
LT23.01.2019
NL23.01.2019
PT23.05.2019
Former [2019/30]NL23.01.2019
Documents cited:Search[Y]US5367766  (BURNS CARMEN D [US], et al) [Y] 1-5,7-9 * column 8, lines 44-50; figure 6 *;
 [A]JPH10296738  (NGK SPARK PLUG CO) [A] 6 * abstract *;
 [A]EP0959650  (DELPHI TECH INC [US]) [A] 10-15,20-24 * the whole document *;
 [XA]EP1508915  (DELPHI TECH INC [US]) [X] 16-19 * paragraphs [0011] - [0013]; figure 1 * [A] 10-15,20-24;
 [A]JP2005142215  (JAPAN AVIATION ELECTRON) [A] 10-12,20-22* abstract *;
 [YA]US6905349  (BRANDENBURG SCOTT D [US], et al) [Y] 1-5,7-9 * column 4, lines 1-16; figure 4 * [A] 10-15,20-24;
 [E]EP1734800  (DELPHI TECH INC [US]) [E] 16-18 * paragraphs [0004] , [0005]; figures 2,2A *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.