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Extract from the Register of European Patents

EP About this file: EP1754571

EP1754571 - Retaining ring for a chemical mechanical polishing system [Right-click to bookmark this link]
Former [2007/08]Retaining ring in a carrier head for a chemical mechanical polishing system
[2009/10]
StatusNo opposition filed within time limit
Status updated on  04.06.2010
Database last updated on 20.09.2024
Most recent event   Tooltip18.03.2011Lapse of the patent in a contracting state
New state(s): IT
published on 20.04.2011  [2011/16]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054 / US
[N/P]
Former [2007/08]For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054 / US
Inventor(s)01 / Zunica, Steven M.
351 Los Robles Road
Soquel, CA 95073 / US
02 / Chen, Hung Chih
1530 Oyama Place
San Jose, CA 95131 / US
 [2007/08]
Representative(s)Frost, Alex John
Boult Wade Tennant
Verulam Gardens
70 Gray's Inn Road
London WC1X 8BT / GB
[N/P]
Former [2007/08]Frost, Alex John
Boult Wade Tennant, Verulam Gardens 70 Gray's Inn Road
London WC1X 8BT / GB
Application number, filing date06076591.405.11.1997
[2007/08]
Priority number, dateUS1996074567908.11.1996         Original published format: US 745679
US1997086126021.05.1997         Original published format: US 861260
[2007/08]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1754571
Date:21.02.2007
Language:EN
[2007/08]
Type: B1 Patent specification 
No.:EP1754571
Date:29.07.2009
Language:EN
[2009/31]
Search report(s)(Supplementary) European search report - dispatched on:EP18.01.2007
ClassificationIPC:B24B37/04, B24B41/06
[2007/08]
CPC:
B24B37/30 (EP,US); H01L21/304 (KR); B24B37/32 (EP,US)
Designated contracting statesDE,   FR,   GB,   IE,   IT,   NL [2007/08]
TitleGerman:Halterring für eine chemisch-mechanische Poliervorrichtung[2007/08]
English:Retaining ring for a chemical mechanical polishing system[2009/10]
French:Bague de maintien pour un dispositif de polissage mécano-chimique[2007/08]
Former [2007/08]Retaining ring in a carrier head for a chemical mechanical polishing system
Examination procedure24.07.2007Examination requested  [2007/36]
24.07.2008Despatch of a communication from the examining division (Time limit: M04)
01.09.2008Reply to a communication from the examining division
28.01.2009Date of oral proceedings
16.02.2009Minutes of oral proceedings despatched
18.02.2009Communication of intention to grant the patent
23.03.2009Minutes of oral proceedings despatched
16.06.2009Fee for grant paid
16.06.2009Fee for publishing/printing paid
Parent application(s)   TooltipEP02078260.3  / EP1258317
EP97308863.6  / EP0841123
Opposition(s)03.05.2010No opposition filed within time limit [2010/27]
Fees paidRenewal fee
17.08.2006Renewal fee patent year 03
17.08.2006Renewal fee patent year 04
17.08.2006Renewal fee patent year 05
17.08.2006Renewal fee patent year 06
17.08.2006Renewal fee patent year 07
17.08.2006Renewal fee patent year 08
17.08.2006Renewal fee patent year 09
19.02.2007Renewal fee patent year 10
06.11.2007Renewal fee patent year 11
07.11.2008Renewal fee patent year 12
Penalty fee
Additional fee for renewal fee
30.11.200610   M06   Fee paid on   19.02.2007
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Lapses during opposition  TooltipIT29.07.2009
NL29.07.2009
GB05.11.2009
IE05.11.2009
FR30.11.2009
[2011/16]
Former [2011/05]NL29.07.2009
GB05.11.2009
IE05.11.2009
FR30.11.2009
Former [2011/03]NL29.07.2009
IE05.11.2009
FR30.11.2009
Former [2010/13]NL29.07.2009
Documents cited:Search[A]JPH08229808  (MITSUBISHI MATERIALS CORP) [A] 1,6 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.