blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

News Flashes

Latvia joins the Federated Register
Click here for more information on the Federated Register.

2025-04-16

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP1923902

EP1923902 - Magnetron sputtering source, sputter coating system and method for coating a substrate [Right-click to bookmark this link]
StatusPatent maintained as amended
Status updated on  20.06.2014
Database last updated on 03.05.2025
Most recent event   Tooltip23.03.2018Lapse of the patent in a contracting statepublished on 25.04.2018  [2018/17]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054 / US
[2014/30]
Former [2008/21]For all designated states
Applied Materials, Inc.
a corporation of the State of Delaware 3050 Bowers Avenue
Santa Clara, CA 95054 / US
Inventor(s)01 / Krempel-Hesse, Jörg
Espenweg 10
63683, Eckartsborn / DE
 [2014/30]
Former [2008/21]01 / Krempel-Hesse, Jörg
Espenweg 10
63683, Eckartsborn / DE
Representative(s)Neuburger, Benedikt Maria, et al
Zimmermann & Partner Patentanwälte mbB
Postfach 330 920
80069 München / DE
[N/P]
Former [2012/45]Neuburger, Benedikt Maria, et al
Zimmermann & Partner
Josephspitalstraße 15
80331 München / DE
Former [2008/21]Lermer, Christoph, et al
LangRaible GbR Patent- und Rechtsanwälte Herzog-Wilhelm-Straße 22
80331 München / DE
Application number, filing date06124060.214.11.2006
[2008/21]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP1923902
Date:21.05.2008
Language:DE
[2008/21]
Type: B1 Patent specification 
No.:EP1923902
Date:23.02.2011
Language:DE
[2011/08]
Type: B2 New European patent specification 
No.:EP1923902
Date:23.07.2014
Language:DE
[2014/30]
Search report(s)(Supplementary) European search report - dispatched on:EP16.04.2007
ClassificationIPC:H01J37/34, C23C14/35
[2008/21]
CPC:
H01J37/3408 (EP,KR,US); C23C14/3407 (EP,KR,US); C23C14/3485 (KR);
C23C14/35 (EP,KR,US); H01J37/3423 (EP,KR,US); H01J37/3455 (EP,KR,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2008/21]
TitleGerman:Magnetron-Sputterquelle, Sputter-Beschichtungsanlage und Verfahren zur Beschichtung eines Substrats[2008/21]
English:Magnetron sputtering source, sputter coating system and method for coating a substrate[2008/21]
French:Source de pulvérisation magnétron, système de revêtement par pulvérisation et procédé pour revêtir un substrat[2008/21]
Examination procedure14.12.2006Examination requested  [2008/21]
23.08.2007Amendment by applicant (claims and/or description)
26.08.2010Communication of intention to grant the patent
03.01.2011Fee for grant paid
03.01.2011Fee for publishing/printing paid
Opposition(s)Opponent(s)01  23.11.2011  29.11.2011  ADMISSIBLE
von Ardenne Anlagentechnik GmbH
Plattleite 19/29
01324 Dresden / DE
Opponent's representative
Adler, Peter
Lippert Stachow Patentanwälte Rechtanwälte
Partnerschaft mbB
Krenkelstrasse 3
01309 Dresden / DE
 [N/P]
Former [2011/52]
Opponent(s)01  23.11.2011   
von Ardenne Anlagentechnik GmbH
Plattleite 19/29
01324 Dresden / DE
Opponent's representative
Adler, Peter
Lippert, Stachow & Partner Krenkelstrasse 3
01309 Dresden / DE
03.01.2012Invitation to proprietor to file observations on the notice of opposition
26.04.2012Reply of patent proprietor to notice(s) of opposition
08.05.2012Communication of observations of patent proprietor (Time limit: M06)
19.11.2012Reply of parties involved to observations of patent proprietor
05.11.2013Legal effect of interlocutory decision in opposition
05.11.2013Date of oral proceedings
27.11.2013Despatch of interlocutory decision in opposition
27.11.2013Despatch of minutes of oral proceedings
14.03.2014Despatch of communication that the patent will be maintained as amended
11.06.2014Fee for printing new specification paid
Fees paidRenewal fee
22.10.2008Renewal fee patent year 03
24.11.2009Renewal fee patent year 04
23.11.2010Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipCY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
HU23.02.2011
IE23.02.2011
IS23.02.2011
IT23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
PL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
TR23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
AT14.11.2011
GB14.11.2011
LU14.11.2011
BE30.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
[2018/17]
Former [2015/21]CY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
HU23.02.2011
IE23.02.2011
IS23.02.2011
IT23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
PL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
TR23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
AT14.11.2011
GB14.11.2011
LU14.11.2011
BE30.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2015/12]CY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
HU23.02.2011
IE23.02.2011
IS23.02.2011
IT23.02.2011
LT23.02.2011
NL23.02.2011
PL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
TR23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
AT14.11.2011
GB14.11.2011
LU14.11.2011
BE30.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2013/45]CY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
HU23.02.2011
IE23.02.2011
IS23.02.2011
IT23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
PL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
TR23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
AT14.11.2011
GB14.11.2011
LU14.11.2011
BE30.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2013/44]CY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
IE23.02.2011
IS23.02.2011
IT23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
PL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
TR23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
AT14.11.2011
GB14.11.2011
LU14.11.2011
BE30.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2013/33]CY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
IE23.02.2011
IS23.02.2011
IT23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
PL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
AT14.11.2011
GB14.11.2011
LU14.11.2011
BE30.11.2011
CH30.11.2011
FR30.11.2011
LI30.11.2011
MC30.11.2011
Former [2012/10]CY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
IE23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
Former [2011/50]CY23.02.2011
CZ23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
IE23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
RO23.02.2011
SE23.02.2011
SI23.02.2011
SK23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
PL20.07.2011
Former [2011/47]CY23.02.2011
DK23.02.2011
EE23.02.2011
FI23.02.2011
IE23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
SE23.02.2011
SI23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
Former [2011/39]CY23.02.2011
FI23.02.2011
LT23.02.2011
LV23.02.2011
NL23.02.2011
SE23.02.2011
SI23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
Former [2011/37]CY23.02.2011
FI23.02.2011
LT23.02.2011
LV23.02.2011
SE23.02.2011
SI23.02.2011
BG23.05.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
Former [2011/36]LT23.02.2011
LV23.02.2011
SE23.02.2011
GR24.05.2011
ES03.06.2011
PT23.06.2011
Documents cited:Search[X]US5106474  (DICKEY ERIC R [US], et al) [X] 1,10,11,16-18 * column 4, line 14 - line 54 *;
 [X]EP0858095  (INTEVAC INC [US]) [X] 1,8-10,16-18,22,24,25* column 6, line 50 - column 7, line 52; figures 1-4 *;
 [X]US6013159  (ADAMS BRET W [US], et al) [X] 1,7-10,16,17,23-25 * column 3, lines 34-40 * * column 4, lines 8-31; figures 1,2 *;
 [X]EP1076352  (APPLIED MATERIALS INC [US]) [X] 1,3,5-8,10,16-18,21-23,25 * column 5, lines 1-15 * * column 6, lines 26-35; figures 1,4 * * column 6, line 57 - column 7, line 15 * * column 13, line 27 - column 14, line 3 *;
 [X]WO0177402  (SURFACE ENGINEERED PRODUCTS CO [CA], et al) [X] 1,3,5,6,8,10,11,16-18,21,25 * page 6, lines 8-15 * * page 7, lines 3-13 * * page 13, line 4 - page 14, line 21; figure 1; table 1 * * page 22, lines 10-20 * * page 23, lines 1,2,12,13 *;
 [XAY]US2005061666  (GUPTA SUBHADRA [US], et al) [X] 1,2,4,8-10,16-20,22,24,25 * paragraphs [0007] , [0008] , [0015] , [0016] * * paragraphs [0021] , [0023] * * paragraphs [0130] - [0133] - [0135] , [0138]; figure 1 * * paragraphs [0143] , [0150] , [0151] * [A] 13 [Y] 12,14,15;
 [Y]US2005103620  (CHISTYAKOV ROMAN [US]) [Y] 12,14,15 * paragraph [0021] * * paragraphs [0023] - [0027]; figure 1 * * paragraph [0037]; figure 2A * * paragraph [0041] * * paragraphs [0062] , [0063]; figure 2D *;
 [X]DE102005019100  (STEAG HAMATECH AG [DE]) [X] 1,8,10,12,16-18,22,25 * paragraph [0015] * * paragraphs [0025] , [0027] , [0028]; figure 1 * * paragraphs [0034] , [0035] , [0041]; figures 2,3 * * paragraphs [0055] , [0057] * * paragraph [0062] * * paragraph [0064] *
OppositionDD217964
 US6093293
 US6217714
 DE10145201
 US6488824
 DE10213043
 US2004231973
 EP1626433
 WO2006063484
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.