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EP1876871
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EP About this file: EP1876871
| EP1876871 - Surface mounting structure for electronic component [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 27.03.2009 Database last updated on 02.09.2024 | Most recent event Tooltip | 27.03.2009 | Withdrawal of application | published on 29.04.2009 [2009/18] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 416 Maetan-dong, Yeongtong-gu Suwon-si Gyeonggi-do 442-742 / KR | [N/P] |
| Former [2008/02] | For all designated states Samsung Electronics Co., Ltd. 416 Maetan-dong, Yeongtong-gu Suwon-si 442-742 Gyeonggi-do / KR | Inventor(s) | 01 /
Nagatani, Kaname 101-2003 Seokwang Apt., Geumgok-dong, Bundang-gu Seongnam-si, Gyeonggi-do / KR | [2008/02] | Representative(s) | Robinson, Ian Michael Appleyard Lees 15 Clare Road Halifax HX1 2HY / GB | [N/P] |
| Former [2008/02] | Robinson, Ian Michael Appleyard Lees 15 Clare Road Halifax, West Yorkshire HX1 2HY / GB | Application number, filing date | 06127357.9 | 29.12.2006 | [2008/02] | Priority number, date | KR20060062436 | 04.07.2006 Original published format: KR 20060062436 | [2008/02] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1876871 | Date: | 09.01.2008 | Language: | EN | [2008/02] | Classification | IPC: | H05K1/11 | [2008/02] | CPC: |
H05K1/111 (EP,US);
H05K3/30 (KR);
H05K3/3421 (EP,US);
H05K3/3442 (EP,US);
H05K2201/09381 (EP,US);
H05K2201/09727 (EP,US);
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR [2008/02] | Extension states | AL | Not yet paid | BA | Not yet paid | HR | Not yet paid | MK | Not yet paid | RS | Not yet paid | Title | German: | Oberflächenmontagestruktur für elektronische Bauteile | [2008/02] | English: | Surface mounting structure for electronic component | [2008/02] | French: | Structure de montage en surface pour des composants électroniques | [2008/02] | Examination procedure | 29.12.2006 | Examination requested [2008/02] | 29.01.2009 | Application withdrawn by applicant [2009/18] | Fees paid | Renewal fee | 24.11.2008 | Renewal fee patent year 03 |
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