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Extract from the Register of European Patents

EP About this file: EP1744359

EP1744359 - Interconnect structure having cavities in its dielectric portion [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  23.05.2008
Database last updated on 07.10.2024
Most recent event   Tooltip23.05.2008Application deemed to be withdrawnpublished on 25.06.2008  [2008/26]
Applicant(s)For all designated states
ST Microelectronics Crolles 2 SAS
850 Rue Jean Monnet
38920 Crolles / FR
For all designated states
Koninklijke Philips Electronics N.V.
Groenewoudseweg 1
5621 BA Eindhoven / NL
[N/P]
Former [2007/03]For all designated states
ST Microelectronics Crolles 2 SAS
850 Rue Jean Monnet
38920 Crolles / FR
For all designated states
Koninklijke Philips Electronics N.V.
Groenewoudseweg 1
5621 BA Eindhoven / NL
Inventor(s)01 / Torres, Joaquin
236 Chemin Fiancey
38950 St. Martin Le Vinoux / FR
02 / Gosset, Laurent-Georges
860 rue Jean Monnet
38920 Crolles / FR
 [2007/03]
Representative(s)Verdure, Stéphane, et al
Cabinet Plasseraud
ATTENTION : ADDRESS INACTIVE - USE ASS-NR - CDR
Paris / FR
[N/P]
Former [2007/03]Verdure, Stéphane, et al
Cabinet Plasseraud 52 rue de la Victoire
75440 Paris Cedex 09 / FR
Application number, filing date06291019.521.06.2006
[2007/03]
Priority number, dateEP2005029150512.07.2005         Original published format: EP 05291505
[2007/22]
Former [2007/03]EP2005029150513.07.2005
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1744359
Date:17.01.2007
Language:EN
[2007/03]
Search report(s)(Supplementary) European search report - dispatched on:EP14.11.2006
ClassificationIPC:H01L21/768
[2007/03]
CPC:
H01L23/5222 (EP); H01L21/7682 (EP); H01L21/76831 (EP);
H01L21/76849 (EP); H01L2924/0002 (EP)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Designated contracting statesDE,   FR,   GB [2007/38]
Former [2007/03]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Verbindungsstruktur mit Aushöhlungen in ihrem dielektrischen Bereich[2007/03]
English:Interconnect structure having cavities in its dielectric portion[2007/03]
French:Structure d'interconnexion ayant des cavités dans sa partie diélectrique[2007/03]
Examination procedure17.07.2007Examination requested  [2007/35]
23.08.2007Despatch of a communication from the examining division (Time limit: M04)
03.01.2008Application deemed to be withdrawn, date of legal effect  [2008/26]
08.02.2008Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2008/26]
Divisional application(s)EP07112163.6  / EP1837905
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Documents cited:Search[X]US2004102031  (KLOSTER GRANT M [US], et al) [X] 1,2 * the whole document *;
 [A]US2004099951  (PARK HYUN-MOG [US], et al) [A] * the whole document *;
 [A]US2004099952  (GOODNER MICHAEL D [US], et al) [A] * the whole document *;
 [A]US2005087875  (FURUKAWA TOSHIHARU [US], et al) [A] * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.