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Extract from the Register of European Patents

EP About this file: EP1921671

EP1921671 - WAFER LEVEL BURN-IN METHOD AND WAFER LEVEL BURN-IN SYSTEM [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  21.01.2011
Database last updated on 31.08.2024
Most recent event   Tooltip21.01.2011Withdrawal of applicationpublished on 23.02.2011  [2011/08]
Applicant(s)For all designated states
Panasonic Corporation
1006, Oaza Kadoma
Kadoma-shi
Osaka 571-8501 / JP
[N/P]
Former [2008/47]For all designated states
Panasonic Corporation
1006, Oaza Kadoma Kadoma-shi
Osaka 571-8501 / JP
Former [2008/20]For all designated states
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, Oaza Kadoma, Kadoma-shi
Osaka 571-8501 / JP
Inventor(s)01 / SEGAWA, Terutsugu, c/o Matsushita Electric Industrial Co., Ltd
IP Development Center, 7 F Twin 21 OBP Panasonic Tower
2-1-61 Shiromi, Chuo-ku, Osaka 540-6207 / JP
02 / SANADA, Minoru, c/o Matsushita Electric Industrial Co., Ltd
IP Development Center, 7 F Twin 21 OBP Panasonic Tower
2-1-61 Shiromi, Chuo-ku, Osaka 540-6207 / JP
 [2008/20]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[N/P]
Former [2008/20]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
80538 München / DE
Application number, filing date06746964.329.05.2006
[2008/20]
WO2006JP310686
Priority number, dateJP2005023019409.08.2005         Original published format: JP 2005230194
[2008/20]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2007017981
Date:15.02.2007
Language:JA
[2007/07]
Type: A1 Application with search report 
No.:EP1921671
Date:14.05.2008
Language:EN
[2008/20]
Search report(s)International search report - published on:JP15.02.2007
(Supplementary) European search report - dispatched on:EP02.07.2010
ClassificationIPC:H01L21/00, G01R31/28
[2010/31]
CPC:
H01L21/67248 (EP,US); H01L22/00 (KR); G01R31/2874 (EP,US);
H01L21/67103 (EP,US); H01L21/67242 (EP,US); H01L21/67288 (EP,US)
Former IPC [2008/20]H01L21/66
Designated contracting statesIT,   NL [2008/36]
Former [2008/20]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
YUNot yet paid
TitleGerman:VERFAHREN UND SYSTEM ZUM BURN-IN AUF WAFEREBENE[2008/20]
English:WAFER LEVEL BURN-IN METHOD AND WAFER LEVEL BURN-IN SYSTEM[2008/20]
French:PROCÉDÉ DE VITRIFICATION D UN NIVEAU DE GALETTE ET SYSTÈME DE VITRIFICATION DE NIVEAU DE GALETTE[2008/20]
Entry into regional phase29.02.2008Translation filed 
29.02.2008National basic fee paid 
29.02.2008Search fee paid 
29.02.2008Designation fee(s) paid 
29.02.2008Examination fee paid 
Examination procedure29.02.2008Examination requested  [2008/20]
10.03.2008Loss of particular rights, legal effect: designated state(s)
15.04.2008Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, LT, LU, LV, MC, PL, PT, RO, SE, SI, SK, TR
17.01.2011Application withdrawn by applicant  [2011/08]
Fees paidRenewal fee
29.02.2008Renewal fee patent year 03
29.05.2009Renewal fee patent year 04
28.05.2010Renewal fee patent year 05
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Documents cited:Search[X]JPH10256325  (ORION MACHINERY CO LTD) [X] 1-20 * abstract *;
 [X]EP0915499  (TOKYO ELECTRON LTD [JP]) [X] 1-20 * paragraph [0057] - paragraph [0077]; figures 7, 8a-8c *;
 [X]EP1174723  (TOKYO ELECTRON LTD [JP]) [X] 1-20* paragraph [0034] - paragraph [0041]; figures 1-3 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.