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Extract from the Register of European Patents

EP About this file: EP1929524

EP1929524 - MICROELECTRONIC DEVICE PACKAGES, AND STACKED MICROLECETRONIC DEVICE PACKAGES [Right-click to bookmark this link]
Former [2008/24]MICROELECTRONIC DEVICE PACKAGES, STACKED MICROLECETRONIC DEVICE PACKAGES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES
[2018/19]
StatusNo opposition filed within time limit
Status updated on  13.09.2019
Database last updated on 20.09.2024
FormerThe patent has been granted
Status updated on  05.10.2018
FormerGrant of patent is intended
Status updated on  01.10.2018
FormerExamination is in progress
Status updated on  14.09.2018
FormerGrant of patent is intended
Status updated on  24.04.2018
Most recent event   Tooltip09.07.2021Lapse of the patent in a contracting state
New state(s): HU		published on 11.08.2021  [2021/32]
Applicant(s)For all designated states
Micron Technology, Inc.
8000 South Federal Way, P.O. Box 6
Boise, ID 93716-9632 / US
[2008/24]
Inventor(s)01 / YE, Seng Kim Dalson
Block 311C, 05-32, Anchorvale Lane
Singapore 543311 / SG
02 / CHONG, Chin, Hui
Block 10h, 07-29
Braddell View, Braddell Hill
Singapore 579727 / SG
 [2018/45]
Former [2008/24]01 / YE, Seng Kim Dalson
Block 311C, 05-32, Anchorvale Lane
Singapore 543311 / SG
02 / CHONG, Chin, Hui
Block 10h, 07-29 Braddell View, Braddell Hill
Singapore 579727 / SG
Representative(s)Tunstall, Christopher Stephen, et al
Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
[2018/45]
Former [2009/51]Tunstall, Christopher Stephen, et al
Carpmaels & Ransford 43-45 Bloomsbury Square
London WC1A 2RA / GB
Former [2008/24]Tunstall, Christopher Stephen, et al
Carpmaels & Ransford 43-45 Bloomsbury Square
London WC1A 2RA / GB
Application number, filing date06802317.525.08.2006
[2008/24]
WO2006US33219
Priority number, dateSG2005000552326.08.2005         Original published format: SG 200505523
US2005021802831.08.2005         Original published format: US 218028
[2008/24]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2007025127
Date:01.03.2007
Language:EN
[2007/09]
Type: A2 Application without search report 
No.:EP1929524
Date:11.06.2008
Language:EN
The application published by WIPO in one of the EPO official languages on 01.03.2007 takes the place of the publication of the European patent application.
[2008/24]
Type: B1 Patent specification 
No.:EP1929524
Date:07.11.2018
Language:EN
[2018/45]
Search report(s)International search report - published on:EP18.05.2007
ClassificationIPC:H01L25/065, H01L25/10
[2018/19]
CPC:
H01L25/0657 (EP,US); H01L25/065 (KR); H01L21/563 (US);
H01L23/13 (EP,US); H01L23/3114 (EP,US); H01L24/48 (EP,US);
H01L25/00 (US); H01L25/105 (EP,US); H01L25/50 (US);
H01L2224/06135 (EP,US); H01L2224/06136 (EP,US); H01L2224/32145 (EP,US);
H01L2224/32225 (EP); H01L2224/4382 (US); H01L2224/48227 (EP,US);
H01L2224/4824 (EP,US); H01L2224/73215 (EP,US); H01L2224/73265 (EP,US);
H01L2225/0651 (EP,US); H01L2225/0652 (US); H01L2225/06555 (EP,US);
H01L2225/06572 (EP,US); H01L2225/06575 (EP,US); H01L2225/1023 (EP,US);
H01L2225/1041 (EP); H01L2225/1058 (EP,US); H01L2225/1088 (EP,US);
H01L25/043 (US); H01L25/074 (US); H01L25/0756 (US);
H01L25/10 (US); H01L25/117 (US); H01L2924/00 (US);
H01L2924/00014 (EP,US); H01L2924/01078 (EP,US); H01L2924/14 (EP,US);
H01L2924/15311 (EP,US); H01L2924/1532 (EP,US); H01L2924/15331 (EP,US);
H01L2924/181 (EP,US); H01L2924/1815 (EP,US); H01L2924/19107 (EP,US) (-)
C-Set:
H01L2224/73215, H01L2224/32225, H01L2224/4824, H01L2924/00012 (US,EP);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/00014, H01L2224/85399 (US,EP);
H01L2924/15311, H01L2224/73215, H01L2224/32225, H01L2224/4824, H01L2924/00 (US,EP);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP,US);
H01L2924/181, H01L2924/00012 (EP,US)
(-)
Former IPC [2008/24]H01L25/065
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2018/45]
Former [2008/24]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
RSNot yet paid
TitleGerman:VERKAPSELTE MIKROELEKTRONISCHE BAUELEMENTE UND GESTAPELTE VERKAPSELTE MIKROELEKTRONISCHE BAUELEMENTE[2018/19]
English:MICROELECTRONIC DEVICE PACKAGES, AND STACKED MICROLECETRONIC DEVICE PACKAGES[2018/19]
French:BOITIERS DE DISPOSITIFS MICROELECTRONIQUES, ET EMPILAGES DE TELS BOITIERS[2018/19]
Former [2008/24]KAPSELUNGEN MIKROELEKTRONISCHER BAUELEMENTE, GESTAPELTE KAPSELUNGEN MIKROELEKTRONISCHER BAUELEMENTE UND VERFAHREN ZUM HERSTELLEN MIKROELEKTRONISCHER BAUELEMENTE
Former [2008/24]MICROELECTRONIC DEVICE PACKAGES, STACKED MICROLECETRONIC DEVICE PACKAGES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES
Former [2008/24]BOITIERS DE DISPOSITIFS MICROELECTRONIQUES, EMPILAGES DE TELS BOITIERS, ET PROCEDES DE FABRICATION DE CES DISPOSITIFS
Entry into regional phase26.03.2008National basic fee paid 
26.03.2008Designation fee(s) paid 
26.03.2008Examination fee paid 
Examination procedure26.03.2008Amendment by applicant (claims and/or description)
26.03.2008Examination requested  [2008/24]
30.03.2009Despatch of a communication from the examining division (Time limit: M06)
09.10.2009Reply to a communication from the examining division
31.03.2015Despatch of a communication from the examining division (Time limit: M04)
10.08.2015Reply to a communication from the examining division
25.04.2018Communication of intention to grant the patent
05.09.2018Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
05.09.2018Fee for grant paid
05.09.2018Fee for publishing/printing paid
01.10.2018Information about intention to grant a patent
01.10.2018Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  30.03.2009
Opposition(s)08.08.2019No opposition filed within time limit [2019/42]
Fees paidRenewal fee
26.03.2008Renewal fee patent year 03
10.08.2009Renewal fee patent year 04
02.07.2010Renewal fee patent year 05
11.08.2011Renewal fee patent year 06
10.08.2012Renewal fee patent year 07
19.08.2013Renewal fee patent year 08
13.08.2014Renewal fee patent year 09
10.08.2015Renewal fee patent year 10
11.08.2016Renewal fee patent year 11
14.08.2017Renewal fee patent year 12
10.08.2018Renewal fee patent year 13
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU25.08.2006
AT07.11.2018
CY07.11.2018
CZ07.11.2018
DK07.11.2018
EE07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
MC07.11.2018
NL07.11.2018
PL07.11.2018
RO07.11.2018
SE07.11.2018
SI07.11.2018
SK07.11.2018
TR07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
[2021/32]
Former [2021/26]AT07.11.2018
CY07.11.2018
CZ07.11.2018
DK07.11.2018
EE07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
MC07.11.2018
NL07.11.2018
PL07.11.2018
RO07.11.2018
SE07.11.2018
SI07.11.2018
SK07.11.2018
TR07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2020/25]AT07.11.2018
CZ07.11.2018
DK07.11.2018
EE07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
MC07.11.2018
NL07.11.2018
PL07.11.2018
RO07.11.2018
SE07.11.2018
SI07.11.2018
SK07.11.2018
TR07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2020/17]AT07.11.2018
CZ07.11.2018
DK07.11.2018
EE07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
PL07.11.2018
RO07.11.2018
SE07.11.2018
SI07.11.2018
SK07.11.2018
TR07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2019/50]AT07.11.2018
CZ07.11.2018
DK07.11.2018
EE07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
PL07.11.2018
RO07.11.2018
SE07.11.2018
SI07.11.2018
SK07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2019/40]AT07.11.2018
CZ07.11.2018
DK07.11.2018
EE07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
PL07.11.2018
RO07.11.2018
SE07.11.2018
SK07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2019/37]AT07.11.2018
CZ07.11.2018
DK07.11.2018
EE07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
PL07.11.2018
RO07.11.2018
SE07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2019/35]AT07.11.2018
CZ07.11.2018
DK07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
PL07.11.2018
SE07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2019/34]AT07.11.2018
DK07.11.2018
ES07.11.2018
FI07.11.2018
IT07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
SE07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2019/26]AT07.11.2018
ES07.11.2018
FI07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
SE07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
PT07.03.2019
Former [2019/24]AT07.11.2018
ES07.11.2018
FI07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
SE07.11.2018
BG07.02.2019
GR08.02.2019
IS07.03.2019
Former [2019/23]AT07.11.2018
ES07.11.2018
FI07.11.2018
LT07.11.2018
LV07.11.2018
NL07.11.2018
BG07.02.2019
IS07.03.2019
Former [2019/22]FI07.11.2018
LT07.11.2018
BG07.02.2019
IS07.03.2019
Former [2019/21]FI07.11.2018
LT07.11.2018
IS07.03.2019
Former [2019/20]LT07.11.2018
Cited inInternational search[Y]US2002171136  (HIRAOKA TETSUYA [JP], et al) [Y] 2 * figure 4 *;
 [A]US2002190391  (ICHIKAWA SUNJI [JP]) [A] 1-6,9-11,13* figures 1,3 *;
 [XY]DE10259221  (INFINEON TECHNOLOGIES AG [DE]) [X] 1,3-6,9-11,13 * figures 2,3 * [Y] 2
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.