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EP1973152

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EP About this file: EP1973152

EP1973152 - SUBSTRATE CLEANING APPARATUS, METHOD OF SUBSTRATE CLEANING, SUBSTRATE TREATING SYSTEM AND RECORDING MEDIUM [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 11.01.2013 Database last updated on 11.09.2024
Most recent event Tooltip	11.01.2013	Application deemed to be withdrawn	published on 13.02.2013 [2013/07]
Applicant(s)	For all designated states TOKYO ELECTRON LIMITED 3-6 Akasaka 5-chome Minato-ku Tokyo 107-8481 / JP
	[2008/39]
Inventor(s)	01 / MATSUMOTO, Kazuhisa c/o Tokyo Electron Kyushu Limited 1-1, Fukuhara Koshi-shi Kumamoto 861-1116 / JP
	[2008/39]
Representative(s)	Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastrasse 30 81925 München / DE
	[N/P]
Former [2008/39]	HOFFMANN EITLE Patent- und Rechtsanwälte Arabellastrasse 4 81925 München / DE
Application number, filing date	06832964.8	20.11.2006
	[2008/39]
	WO2006JP323114
Priority number, date	JP20060002234	10.01.2006 Original published format: JP 2006002234
	[2008/39]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2007080707
	Date:	19.07.2007
	Language:	JA
	[2007/29]
	Type:	A1 Application with search report
	No.:	EP1973152
	Date:	24.09.2008
	Language:	EN
	[2008/39]
Search report(s)	International search report - published on:	JP	19.07.2007
	(Supplementary) European search report - dispatched on:	EP	26.08.2010
Classification	IPC:	H01L21/304, H01L21/00	[2010/39]
	CPC:	H01L21/67051 (EP,US); H01L21/304 (KR); H01L21/02087 (EP,US); H01L21/67046 (EP,US); H01L21/6708 (EP,US)
	Former IPC [2008/39]	H01L21/304
Designated contracting states	AT, DE [2009/09]
Former [2008/39]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
Title	German:	SUBSTRATREINIGUNGSVORRICHTUNG, SUBSTRATREINIGUNGSVERFAHREN, SUBSTRATBEHANDLUNGSSYSTEM UND AUFZEICHNUNGSMEDIUM	[2008/39]
	English:	SUBSTRATE CLEANING APPARATUS, METHOD OF SUBSTRATE CLEANING, SUBSTRATE TREATING SYSTEM AND RECORDING MEDIUM	[2008/39]
	French:	APPAREIL ET PROCEDE DE NETTOYAGE DE SUBSTRAT, SYSTEME DE TRAITEMENT DE SUBSTRAT ET SUPPORT D ENREGISTREMENT	[2008/39]
Entry into regional phase	19.12.2007	Translation filed
	19.12.2007	National basic fee paid
	19.12.2007	Search fee paid
	19.12.2007	Designation fee(s) paid
	19.12.2007	Examination fee paid
Examination procedure	19.12.2007	Examination requested [2008/39]
	12.08.2008	Loss of particular rights, legal effect: designated state(s)
	18.09.2008	Despatch of communication of loss of particular rights: designated state(s) BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
	10.03.2011	Amendment by applicant (claims and/or description)
	11.04.2012	Despatch of a communication from the examining division (Time limit: M04)
	22.08.2012	Application deemed to be withdrawn, date of legal effect [2013/07]
	27.09.2012	Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2013/07]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 11.04.2012
Fees paid	Renewal fee
	26.11.2008	Renewal fee patent year 03
	27.11.2009	Renewal fee patent year 04
	23.11.2010	Renewal fee patent year 05
	23.11.2011	Renewal fee patent year 06
	Penalty fee
	Additional fee for renewal fee
	30.11.2012	07 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[Y]US5705223 (BUNKOFSKE RAYMOND JAMES [US]) [Y] 1-14 * column 4, line 48 - column 6, line 31 *;
		[A]WO9940612 (SPEEDFAM CORP [US]) [A] 1,13 * abstract *;
		[A]US6015467 (NAGASAWA KOICHI [JP], et al) [A] 1,11,13 * abstract *;
		[A]US2001037858 (TANIYAMA HIROKI [JP], et al) [A] 1,11,14 * paragraph [0068]; figures 4,7 *;
		[Y]JP2003092278 (SHIBAURA MECHATRONICS CORP) [Y] 1-14 * abstract *;
		[A]JP2003309096 (HITACHI LTD, et al) [A] 1,11,13* abstract *

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