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Extract from the Register of European Patents

EP About this file: EP1843079

EP1843079 - Semiconductor light source and light curing apparatus [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  22.12.2017
Database last updated on 18.11.2024
FormerThe patent has been granted
Status updated on  13.01.2017
FormerGrant of patent is intended
Status updated on  03.01.2017
Most recent event   Tooltip10.07.2020Lapse of the patent in a contracting state
New state(s): IS		published on 12.08.2020  [2020/33]
Applicant(s)For all designated states
Ivoclar Vivadent AG
Bendererstrasse 2
9494 Schaan / LI
[2007/41]
Inventor(s)01 / Plank, Wolfgang
Hopfengarten 16
A-6830 Rankweil / AT
02 / Senn, Bruno
Wetti 41
CH-9470 Buchs / CH
 [2007/41]
Representative(s)Baronetzky, Klaus, et al
Splanemann
Patentanwälte Partnerschaft
Rumfordstrasse 7
80469 München / DE
[2017/07]
Former [2007/41]Baronetzky, Klaus, et al
Splanemann Reitzner Baronetzky Westendorp Patentanwälte Rumfordstrasse 7
80469 München / DE
Application number, filing date07003444.219.02.2007
[2007/41]
Priority number, dateDE2006101537703.04.2006         Original published format: DE102006015377
[2007/41]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP1843079
Date:10.10.2007
Language:DE
[2007/41]
Type: A3 Search report 
No.:EP1843079
Date:09.07.2008
[2008/28]
Type: B1 Patent specification 
No.:EP1843079
Date:15.02.2017
Language:DE
[2017/07]
Search report(s)(Supplementary) European search report - dispatched on:EP05.06.2008
ClassificationIPC:H01L25/075, // H01L33/60, H01L33/64, A61C13/15
[2016/40]
CPC:
H01L25/0753 (EP,US); A61C19/003 (EP,US); H01L2224/48091 (EP,US);
H01L2924/3025 (EP,US); H01L33/60 (EP,US); H01L33/64 (EP,US);
H01L33/648 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2924/3025, H01L2924/00 (US,EP)
Former IPC [2007/41]F21K7/00, A61C13/15
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2017/07]
Former [2007/41]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Halbleiter-Strahlungsquelle sowie Lichthärtgerät[2007/41]
English:Semiconductor light source and light curing apparatus[2007/41]
French:Source semi-conductrice de lumière et appareil de photo-durcissement[2007/41]
Examination procedure10.09.2008Examination requested  [2008/43]
23.10.2008Despatch of a communication from the examining division (Time limit: M06)
01.05.2009Reply to a communication from the examining division
23.03.2015Despatch of a communication from the examining division (Time limit: M06)
07.08.2015Reply to a communication from the examining division
22.12.2015Despatch of a communication from the examining division (Time limit: M06)
08.06.2016Reply to a communication from the examining division
15.09.2016Communication of intention to grant the patent
21.12.2016Fee for grant paid
21.12.2016Fee for publishing/printing paid
21.12.2016Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  23.10.2008
Opposition(s)16.11.2017No opposition filed within time limit [2018/04]
Fees paidRenewal fee
26.02.2009Renewal fee patent year 03
25.02.2010Renewal fee patent year 04
24.02.2011Renewal fee patent year 05
28.02.2012Renewal fee patent year 06
27.02.2013Renewal fee patent year 07
27.02.2014Renewal fee patent year 08
26.02.2015Renewal fee patent year 09
26.02.2016Renewal fee patent year 10
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU19.02.2007
CY15.02.2017
CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SI15.02.2017
SK15.02.2017
TR15.02.2017
IE19.02.2017
LU19.02.2017
BE28.02.2017
BG15.05.2017
GR16.05.2017
IS15.06.2017
PT15.06.2017
[2020/33]
Former [2020/15]HU19.02.2007
CY15.02.2017
CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SI15.02.2017
SK15.02.2017
TR15.02.2017
IE19.02.2017
LU19.02.2017
BE28.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2019/46]HU19.02.2007
CY15.02.2017
CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SI15.02.2017
SK15.02.2017
IE19.02.2017
LU19.02.2017
BE28.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2019/31]HU19.02.2007
CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SI15.02.2017
SK15.02.2017
IE19.02.2017
LU19.02.2017
BE28.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2018/24]CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SI15.02.2017
SK15.02.2017
IE19.02.2017
LU19.02.2017
BE28.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2018/13]CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SI15.02.2017
SK15.02.2017
IE19.02.2017
LU19.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2018/04]CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SK15.02.2017
LU19.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2017/50]CZ15.02.2017
DK15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
MC15.02.2017
NL15.02.2017
PL15.02.2017
RO15.02.2017
SK15.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2017/49]CZ15.02.2017
EE15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
NL15.02.2017
RO15.02.2017
SK15.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2017/48]CZ15.02.2017
FI15.02.2017
LT15.02.2017
LV15.02.2017
NL15.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Former [2017/41]FI15.02.2017
LT15.02.2017
LV15.02.2017
NL15.02.2017
BG15.05.2017
GR16.05.2017
PT15.06.2017
Documents cited:Search[Y]US5130761  (TANAKA TOSHIAKI [JP]) [Y] 36 * column 1, lines 10-38; figure 7ab *;
 [Y]EP0509389  (MILES INC [US]) [Y] 20-22 * column 4, lines 33-46; figure 2 *;
 [X]DE20007730U  (LITE ON ELECTRONICS INC [TW]) [X] 1-7,9-11,23,24,29 * page 3, line 24 - page 5, line 29; figures 2A,2D *;
 [A]US6331111  (CAO DENSEN [US]) [A] 32-34 * column 3, lines 53-59 *;
 [A]JP2002336275  (YOSHIDA SEISAKUSHO KK) [A] 13-19,32-34 * abstract * * paragraph [0034]; figure 7 ** corresponding to (in the amended version):; paragraph [0020]; figure 15 *;
 [Y]US2002177099  (CAO DENSEN [US]) [Y] 27,30,32-35 * abstract * * paragraphs [0029] , [0030] , [0043] , [0044] , [0091] - [0094] - [0111] , [0114] , [0130] , [0131] , [0135] , [0136] , [0146] - [0149]; figures 13,14,27a-b,30a-b,37-40 *;
 [Y]US2004218390  (HOLMAN ROBERT L [US], et al) [Y] 13-19 * abstract * * paragraphs [0010] , [0035] - [0037] - [0054] , [0133]; figures 3A-B,4A,15B *;
 [Y]WO2005067063  (ASETRONICS AG [CH], et al) [Y] 23,25,26 * abstract * * page 1, lines 1-27 * * page 4, line 12 - page 8, line 10 * * page 12, line 1 - page 16, line 27; figures 3-7 *;
 [XY]DE102005028176  (CITIZEN ELECTRONICS [JP]) [X] 1-12,24,28,29,31 * abstract * * paragraphs [0010] - [0013] - [0024] - [0028] - [0034] - [0037] - [0039] , [0040]; figures 1,2,5,7 * [Y] 13-23,25-27,30,32-36
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.