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EP1854760
European procedure
Extract from the Register of European Patents
EP About this file: EP1854760
| EP1854760 - Semiconductor device and method of manufacturing the same [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 11.07.2014 Database last updated on 31.08.2024 | Most recent event Tooltip | 11.07.2014 | No opposition filed within time limit | published on 13.08.2014 [2014/33] | Applicant(s) | For all designated states Olympus Corporation 43-2, Hatagaya 2-chome Shibuya-ku Tokyo 151-0072 / JP | [2007/46] | Inventor(s) | 01 /
Kojima, Kazuaki c/o Olympus Corporation 43-2, Hatagaya 2-chome Shibuya-ku Tokyo 151-0072 / JP | [2013/36] |
| Former [2007/46] | 01 /
Kojima, Kazuaki c/o Olympus Corporation 43-2, Hatagaya 2-chome Shibuya-ku Tokyo 151-0072 / JP | Representative(s) | Winter, Brandl - Partnerschaft mbB Alois-Steinecker-Straße 22 85354 Freising / DE | [N/P] |
| Former [2013/36] | Winter, Brandl, Fürniss, Hübner, Röss, Kaiser, Polte - Partnerschaft Alois-Steinecker-Strasse 22 85354 Freising / DE | ||
| Former [2007/46] | Winter, Brandl, Fürniss, Hübner Röss, Kaiser, Polte Partnerschaft Patent- und Rechtsanwaltskanzlei Alois-Steinecker-Strasse 22 85354 Freising / DE | Application number, filing date | 07008876.0 | 02.05.2007 | [2007/46] | Priority number, date | JP20060133060 | 11.05.2006 Original published format: JP 2006133060 | [2007/46] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1854760 | Date: | 14.11.2007 | Language: | EN | [2007/46] | Type: | A3 Search report | No.: | EP1854760 | Date: | 27.05.2009 | [2009/22] | Type: | B1 Patent specification | No.: | EP1854760 | Date: | 04.09.2013 | Language: | EN | [2013/36] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.04.2009 | Classification | IPC: | B81B7/00 | [2007/46] | CPC: |
B81B7/007 (EP,US);
H01L2224/02377 (EP);
H01L2224/05001 (EP,US);
H01L2224/05022 (EP,US);
H01L2224/05548 (EP,US);
H01L2224/11 (EP,US);
H01L2924/00014 (EP,US)
(-)
| C-Set: |
H01L2924/00014, H01L2224/05099 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US) | Designated contracting states | DE, FR, GB [2010/05] |
| Former [2007/46] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiterbauelement und Verfahren zu seiner Herstellung | [2007/46] | English: | Semiconductor device and method of manufacturing the same | [2007/46] | French: | Dispositif semi-conducteur et son procédé de fabrication | [2007/46] | Examination procedure | 21.08.2009 | Examination requested [2009/46] | 18.09.2009 | Despatch of a communication from the examining division (Time limit: M04) | 28.11.2009 | Loss of particular rights, legal effect: designated state(s) | 07.01.2010 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR | 18.01.2010 | Reply to a communication from the examining division | 27.03.2013 | Communication of intention to grant the patent | 24.07.2013 | Fee for grant paid | 24.07.2013 | Fee for publishing/printing paid | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 18.09.2009 | Opposition(s) | 05.06.2014 | No opposition filed within time limit [2014/33] | Fees paid | Renewal fee | 25.05.2009 | Renewal fee patent year 03 | 25.03.2010 | Renewal fee patent year 04 | 16.05.2011 | Renewal fee patent year 05 | 19.03.2012 | Renewal fee patent year 06 | 29.05.2013 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4773972 (MIKKOR MATI [US]) [A] * column 3, line 32 - line 51 *; | [X]WO2004035461 (UNIV MICHIGAN [US], et al) [X] 1-7,10,12,13 * page 7, line 14 * * page 7, line 18 - line 19 * * page 7, line 23 - line 24 * * page 8, line 7 - line 8 * * page 9, line 4 - line 20 * * figure 1 * | by applicant | WO2004035461 | JP2005019966 |