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Extract from the Register of European Patents

EP About this file: EP1962231

EP1962231 - Production method of electronic apparatus, production method of electronic equipment in which electronic apparatus is packaged, and production method of article in which electronic apparatus is mounted [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  22.01.2010
Database last updated on 20.09.2024
Most recent event   Tooltip22.01.2010Application deemed to be withdrawnpublished on 24.02.2010  [2010/08]
Applicant(s)For all designated states
Fujitsu Ltd.
1-1, Kamikodanaka 4-chome, Nakahara-ku
Kawasaki-shi, Kanagawa 211-8588 / JP
[2008/35]
Inventor(s)01 / Kobayashi, Hiroshi Fujitsu Limited
1-1, Kamikodanaka 4-chome, Nakahara-ku
Kawasaki-shi, Kanagawa 211-8588 / JP
02 / Kobae, Kenji Fujitsu Limited
1-1, Kamikodanaka 4-chome, Nakahara-ku
Kawasaki-shi, Kanagawa 211-8588 / JP
03 / Takeuchi, Shuichi Fujitsu Limited
1-1, Kamikodanaka 4-chome, Nakahara-ku
Kawasaki-shi, Kanagawa 211-8588 / JP
 [2008/35]
Representative(s)Wilding, Frances Ward
Haseltine Lake LLP
Lincoln House, 5th Floor
300 High Holborn
London WC1V 7JH / GB
[N/P]
Former [2008/35]Wilding, Frances Ward
Haseltine Lake Lincoln House 300 High Holborn
London WC1V 7JH / GB
Application number, filing date07124166.528.12.2007
[2008/35]
Priority number, dateJP2007004318323.02.2007         Original published format: JP 2007043183
[2008/35]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1962231
Date:27.08.2008
Language:EN
[2008/35]
Type: A3 Search report 
No.:EP1962231
Date:25.02.2009
[2009/09]
Search report(s)(Supplementary) European search report - dispatched on:EP27.01.2009
ClassificationIPC:G06K19/077
[2008/35]
CPC:
G06K19/07749 (EP,US); G06K19/077 (KR); G06K19/0775 (EP,US);
H01L24/75 (EP,US); H01L24/83 (EP,US); H01L24/90 (EP,US);
H01L24/97 (EP,US); H01L2223/6677 (EP,US); H01L2224/16225 (EP,US);
H01L2224/2919 (EP,US); H01L2224/32225 (EP,US); H01L2224/73204 (EP,US);
H01L2224/75252 (EP,US); H01L2224/83096 (EP,US); H01L2224/83192 (EP,US);
H01L2224/83855 (EP,US); H01L2224/97 (EP,US); H01L2924/00011 (EP,US);
H01L2924/00014 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01033 (EP,US); H01L2924/01082 (EP,US);
H01L2924/0665 (EP,US); H01L2924/14 (EP,US); Y10T156/10 (EP,US) (-)
C-Set:
H01L2224/2919, H01L2924/0665, H01L2924/00 (US,EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00012 (US,EP);
H01L2224/83192, H01L2224/32225, H01L2924/00 (EP,US);
H01L2224/83192, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP,US);
H01L2224/97, H01L2224/73204 (US,EP);
H01L2924/00011, H01L2224/0401 (EP,US);
H01L2924/00014, H01L2224/0401 (EP,US);
H01L2924/0665, H01L2924/00 (US,EP)
(-)
Designated contracting states(deleted) [2009/44]
Former [2008/35]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Herstellungsverfahren für eine elektronische Vorrichtung, Herstellungsverfahren für elektronische Geräte mit der darin enthaltenen elektronischen Vorrichtung und Herstellungsverfahren für einen Gegenstand mit der darin montierten elektronischen Vorrichtung[2008/35]
English:Production method of electronic apparatus, production method of electronic equipment in which electronic apparatus is packaged, and production method of article in which electronic apparatus is mounted[2008/35]
French:Procédé de production d'appareil électronique, procédé de production d'équipement électronique dans lequel l'appareil électronique est emballé, et procédé de production d'article sur lequel l'appareil électronique est assemblé[2008/35]
Examination procedure26.08.2009Application deemed to be withdrawn, date of legal effect  [2010/08]
01.10.2009Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time  [2010/08]
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Documents cited:Search[XA]EP0951064  (NITTO DENKO CORP [JP]) [X] 1,3 * paragraphs [0100] , [0105] , [0264] , [0265]; figures 19a-19d * [A] 5,7,9,11;
 [XA]JP2001338946  (TORAY ENG CO LTD) [X] 1,2 [A] 5,9,10;
 [XA]JP2003209138  (SONY CHEMICALS) [X] 1-3 * paragraphs [0009] - [0040] * [A] 5-7,9-11;
 [XY]EP1742171  (DAINIPPON PRINTING CO LTD [JP]) [X] 1-4 * paragraphs [0004] , [0072] , [0088] , [95140] , [0225] - [0231] - [0274]; figures 23-25,30 * [Y] 5-12;
 [Y]  - WANT R, "An introduction to RFID technology", IEEE PERVASIVE COMPUTING, (200601), vol. 5, no. 1, pages 25 - 33, XP002510139 [Y] 5-12 * the whole document *

DOI:   http://dx.doi.org/10.1109/MPRV.2006.2
by applicantJP2001156110
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