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EP1905871
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EP About this file: EP1905871
| EP1905871 - Plating solution of palladium alloy and method for plating using the same [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 20.07.2012 Database last updated on 18.11.2024 | Most recent event Tooltip | 20.07.2012 | Application deemed to be withdrawn | published on 22.08.2012 [2012/34] | Applicant(s) | For all designated states Tanaka Kikinzoku Kogyo K.K. 7-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 / JP | [N/P] |
| Former [2008/14] | For all designated states Tanaka Kikinzoku Kogyo K.K. 7-3, Marunouchi 2-chone, Chiyoda-ku Tokyo 100-6422 / JP | Inventor(s) | 01 /
Ishikawa, Tomoko c/o Tanaka Kikinzoku Kogyo K.K. Technical Center 2-73, Shin-Machi, Hiratsuka-shi Kanagawa 254-0076 / JP | 02 /
Kitada, Katsutsugu c/o Tanaka Kikinzoku K.K. Technical Center 2-73, Shin-Machi, Hiratsuka-shi Kanagawa 254-0076 / JP | [2008/14] | Representative(s) | Setna, Rohan P. Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | [N/P] |
| Former [2008/14] | Setna, Rohan P. Boult Wade Tennant Verulam Gardens 70 Gray's Inn Road London WC1X 8BT / GB | Application number, filing date | 07253736.8 | 21.09.2007 | [2008/14] | Priority number, date | JP20060260829 | 26.09.2006 Original published format: JP 2006260829 | [2008/14] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1905871 | Date: | 02.04.2008 | Language: | EN | [2008/14] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.01.2008 | Classification | IPC: | C25D3/52, C25D3/56, B01D71/02, C01B3/50 | [2008/14] | CPC: |
C25D3/567 (EP,US);
B01D53/228 (EP,US);
B01D67/0069 (EP,US);
C01B3/505 (EP,US);
C25D3/52 (EP,US);
B01D2323/48 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR [2008/14] | Title | German: | Plattierungslösung einer Palladiumlegierung und Plattierungsverfahren | [2008/14] | English: | Plating solution of palladium alloy and method for plating using the same | [2008/14] | French: | Solution de placage d'un alliage de palladium et procédé de placage l'utilisant | [2008/14] | Examination procedure | 20.05.2008 | Examination requested [2008/27] | 09.07.2008 | Despatch of a communication from the examining division (Time limit: M04) | 07.11.2008 | Reply to a communication from the examining division | 17.10.2011 | Despatch of a communication from the examining division (Time limit: M04) | 28.02.2012 | Application deemed to be withdrawn, date of legal effect [2012/34] | 04.04.2012 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2012/34] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 09.07.2008 | Fees paid | Renewal fee | 23.09.2009 | Renewal fee patent year 03 | 27.09.2010 | Renewal fee patent year 04 | Penalty fee | Additional fee for renewal fee | 30.09.2011 | 05 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2773561 (HUNTER JAMES B); | [X]GB833837 (UNIVERSAL OIL PROD CO); | [X]DE2506467 (SCHERING AG); | [X]US4673472 (MORRISSEY RONALD J [US], et al); | [X]WO9207975 (ALLMENDINGER THOMAS [CH], et al); | [XA]US5318688 (NAJJAR MITRI S [US], et al); | [X]US6183545 (OKUHAMA YOSHIAKI [JP], et al); | [X]US6238465 (JUDA WALTER [US], et al); | [X]US6372363 (KRUEGER CHARLES [US]); | by applicant | JP2000303199 | JP2005256129 |