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Extract from the Register of European Patents

EP About this file: EP1989343

EP1989343 - ETCHING SOLUTION AND METHOD FOR STRUCTURING A UBM LAYER SYSTEM [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  21.01.2011
Database last updated on 18.10.2024
Most recent event   Tooltip21.01.2011Application deemed to be withdrawnpublished on 23.02.2011  [2011/08]
Applicant(s)For all designated states
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Hansastrasse 27c
80686 München / DE
[N/P]
Former [2009/51]For all designated states
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Hansastrasse 27c
80686 München / DE
Former [2008/46]For all designated states
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Hansastrasse 27c
80686 München / DE
Inventor(s)01 / DIETZ, Frank
Oelixdorferstrasse 69
25524 Itzehoe / DE
02 / KOHLMANN-VON PLATEN, Klaus
Geschwister-Scholl-Allee 245
25524 Itzehoe / DE
03 / QUENZER, Hans-Joachim
Schubertstrasse 10
25524 Itzehoe / DE
 [2009/04]
Former [2008/46]01 / DIETZ, Frank
Krausstrasse 15
24118 Kiel / DE
02 / KOHLMANN-VON PLATEN, Klaus
Geschwister-Scholl-Allee 245
25524 Itzehoe / DE
03 / QUENZER, Hans-Joachim
Schubertstrasse 10
25524 Itzehoe / DE
Application number, filing date07703498.116.02.2007
[2008/46]
WO2007EP01363
Priority number, dateDE2006100826122.02.2006         Original published format: DE102006008261
[2008/46]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report
No.:WO2007096095
Date:30.08.2007
Language:DE
[2007/35]
Type: A2 Application without search report 
No.:EP1989343
Date:12.11.2008
Language:DE
The application published by WIPO in one of the EPO official languages on 30.08.2007 takes the place of the publication of the European patent application.
[2008/46]
Search report(s)International search report - published on:EP07.02.2008
ClassificationIPC:C23F1/02, C23F1/16, C23F1/18, C23F1/44, H01L21/60
[2008/46]
CPC:
C23F1/02 (EP,US); C23F1/16 (EP,US); C23F1/18 (EP,US);
C23F1/44 (EP,US); H01L21/32134 (EP,US); H01L24/11 (EP,US);
H01L24/13 (EP,US); H01L2224/0401 (EP,US); H01L2224/05001 (EP,US);
H01L2224/05124 (EP,US); H01L2224/05155 (EP,US); H01L2224/0554 (EP,US);
H01L2224/05647 (EP,US); H01L2224/114 (EP,US); H01L2224/116 (EP,US);
H01L2224/13006 (EP,US); H01L2924/00013 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01011 (EP,US); H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US); H01L2924/01016 (EP,US); H01L2924/01019 (EP,US);
H01L2924/01023 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01082 (EP,US); H01L2924/014 (EP,US); H01L2924/19043 (EP,US) (-)
C-Set:
H01L2224/05124, H01L2924/00014 (US,EP);
H01L2224/05155, H01L2924/00014 (US,EP);
H01L2224/05647, H01L2924/00014 (US,EP);
H01L2924/00013, H01L2224/13099 (EP,US)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2008/46]
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
RSNot yet paid
TitleGerman:ÄTZLÖSUNG UND VERFAHREN ZUR STRUKTURIERUNG EINES UBM-SCHICHTSYSTEMS[2008/46]
English:ETCHING SOLUTION AND METHOD FOR STRUCTURING A UBM LAYER SYSTEM[2008/46]
French:SOLUTION D'ATTAQUE ET PROCÉDÉ DE STRUCTURATION D'UN SYSTÈME DE COUCHES DE MÉTALLISATION SOUS BOSSE[2008/46]
Entry into regional phase17.09.2008National basic fee paid 
17.09.2008Designation fee(s) paid 
17.09.2008Examination fee paid 
Examination procedure17.09.2008Amendment by applicant (claims and/or description)
17.09.2008Examination requested  [2008/46]
31.08.2010Application deemed to be withdrawn, date of legal effect  [2011/08]
06.10.2010Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2011/08]
Fees paidRenewal fee
17.09.2008Renewal fee patent year 03
Penalty fee
Additional fee for renewal fee
28.02.201004   M06   Not yet paid
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[XY]US5587103  (DENNIS TIMOTHY A [US]) [X] 1,5-7 * column 1, lines 24-28 * * column 2, lines 34-37,44-65 * * column 4, lines 14-67 * * column 6, lines 10-19,30-44 * * figures 2-4 * * claims 1,6-12 * [Y] 21,22,35-39;
 [PX]US2007029280  (LEE KYOUNG M [KR], et al) [PX] 1-4,6,7,44-46 * page 3, paragraphs 38,51 * * page 4, paragraphs 62,63,71; table 1 * * claims 1,2,6-9,13-16 *;
 [XY]US2005040139  (GONZALEZ FRANK [US], et al) [X] 1,6,7,14-19,45,46 * the whole document * [Y] 21,22,25-39,42,43;
 [Y]US5508229  (BAKER MARK H [US]) [Y] 21,22,25-39,42,43 * the whole document *;
 [X]US2002020833  (ZHANG FAN [US], et al) [X] 1-3,6,7,45,46 * page 3, paragraphs 27,28 - page 4 * * page 5, paragraph 39; table A * * example g; table 7 * * page 7, paragraphs 64-69; example D *;
 [X]US2004244823  (KIM SANG YONG [KR], et al) [X] 1,6,7,45,46 * the whole document *;
 [X]US3825454  (KIKUCHI A, et al) [X] 1,6,7,45,46 * the whole document *;
 [X]US4230522  (MARTIN JOHN E, et al) [X] 1,45,46 * the whole document *;
 [X]EP0905754  (SEZ SEMICONDUCT EQUIP ZUBEHOER [AT]) [X] 1,45,46 * page 4; example 2 *;
 [X]WO02059966  (HONEYWELL INT INC [US], et al) [X] 1,45,46 * page 18, lines 1-5; example 1 *;
 [X]US2428464  (LUM JOHN C, et al) [X] 1,2,6,7 * the whole document *;
 [X]US5258093  (MANIAR PAPU D [US]) [X] 1,6,7 * the whole document *;
 [A]US3314869  (DOBBIN WILLIAM J, et al) [A] 1-46;
 [A]EP1031644  (SHIPLEY CO LLC [US]) [A] 1-20,38-43;
 [A]US2004101624  (BAYES MARTIN W [US]) [A] 1-46;
 [A]US4746369  (SULLIVAN THOMAS E [US], et al) [A] 1-20
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.