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Extract from the Register of European Patents

EP About this file: EP2008786

EP2008786 - RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  17.04.2015
Database last updated on 02.11.2024
Most recent event   Tooltip17.04.2015Application deemed to be withdrawnpublished on 20.05.2015  [2015/21]
Applicant(s)For all designated states
SUMITOMO HEAVY INDUSTRIES, LTD.
1-1, Osaki 2-chome Shinagawa-ku
Tokyo 141-6025 / JP
[2009/01]
Inventor(s)01 / HIRATA, Toru
SUMITOMO HEAVY INDUSTRIES, LTD. Yokosuka Works 19 Natsushimacho
Yokosuka-shi, Kanagawa 237-0061 / JP
 [2009/01]
Representative(s)Emde, Eric, et al
Wagner & Geyer Partnerschaft mbB
Patent- und Rechtsanwälte
Gewürzmühlstrasse 5
80538 München / DE
[N/P]
Former [2009/01]Emde, Eric, et al
Wagner & Geyer, Gewürzmühlstrasse 5
80538 München / DE
Application number, filing date07742087.520.04.2007
[2009/01]
WO2007JP58652
Priority number, dateJP2006011642020.04.2006         Original published format: JP 2006116420
[2009/01]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2007123210
Date:01.11.2007
Language:JA
[2007/44]
Type: A1 Application with search report 
No.:EP2008786
Date:31.12.2008
Language:EN
[2009/01]
Search report(s)International search report - published on:JP01.11.2007
(Supplementary) European search report - dispatched on:EP15.02.2010
ClassificationIPC:B29C33/38, B29C45/26, B29L11/00, B29L17/00
[2009/01]
CPC:
B29C45/263 (EP,US); B29C33/38 (KR); B29C33/3828 (EP,US);
B29C33/424 (EP,US); B29C45/26 (KR); B29C45/2632 (EP,US);
B29C2033/023 (EP,US); B29C2045/2636 (EP,US); B29L2011/00 (KR);
B29L2017/00 (KR); Y10S425/81 (EP,US) (-)
Designated contracting statesAT,   CH,   DE,   LI,   NL [2009/22]
Former [2009/01]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
Extension statesALNot yet paid
BANot yet paid
HRNot yet paid
MKNot yet paid
RSNot yet paid
TitleGerman:HARZFORMVORRICHTUNG UND HARZFORMVERFAHREN[2009/01]
English:RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD[2009/01]
French:DISPOSITIF DE MOULAGE DE RÉSINE ET MÉTHODE DE MOULAGE DE RÉSINE[2009/01]
Entry into regional phase15.10.2008Translation filed 
15.10.2008National basic fee paid 
15.10.2008Search fee paid 
15.10.2008Designation fee(s) paid 
15.10.2008Examination fee paid 
Examination procedure15.10.2008Examination requested  [2009/01]
21.11.2008Loss of particular rights, legal effect: designated state(s)
08.01.2009Despatch of communication of loss of particular rights: designated state(s) BE, BG, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, PL, PT, RO, SE, SI, SK, TR
29.04.2010Despatch of a communication from the examining division (Time limit: M04)
09.09.2010Reply to a communication from the examining division
02.08.2011Despatch of a communication from the examining division (Time limit: M04)
12.12.2011Reply to a communication from the examining division
01.11.2014Application deemed to be withdrawn, date of legal effect  [2015/21]
07.01.2015Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2015/21]
Divisional application(s)EP09011269.9  / EP2119549
The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  29.04.2010
Fees paidRenewal fee
29.04.2009Renewal fee patent year 03
30.03.2010Renewal fee patent year 04
27.04.2011Renewal fee patent year 05
26.03.2012Renewal fee patent year 06
29.04.2013Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
30.04.201408   M06   Not yet paid
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Documents cited:Search[XY]EP1640132  (TDK CORP [JP]) [X] 1,3,8-9 * paragraphs [0008] , [0009] , [0014] , [0015] * [Y] 4-7;
 [XY]JPH10149587  (HITACHI LTD, et al) [X] 1,3,8-9 * paragraph [0009] - paragraph [0016]; figures 2-4 * [Y] 4-7;
 [XY]JP2002361689  (RICOH KK) [X] 1-2,8-9 * paragraph [0034]; figure 1 * [Y] 4-7;
 [Y]WO9932269  (DU PONT [US]) [Y] 4-7 * figures 1,2; claim 1 *;
 [XP]WO2006043708  (RICOH KK [JP], et al) [XP] 1-2,8-9 * page 20, line 5 - page 21, line 9 *
International search[X]JPH10149587  (HITACHI LTD, et al);
 [Y]JP2002361689  (RICOH KK);
 [Y]JP2001526126  ;
 [Y]JP2006008759  (MITSUBISHI GAS CHEMICAL CO)
by applicantJP2000249538
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.