EP2008786 - RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 17.04.2015 Database last updated on 02.11.2024 | Most recent event Tooltip | 17.04.2015 | Application deemed to be withdrawn | published on 20.05.2015 [2015/21] | Applicant(s) | For all designated states SUMITOMO HEAVY INDUSTRIES, LTD. 1-1, Osaki 2-chome Shinagawa-ku Tokyo 141-6025 / JP | [2009/01] | Inventor(s) | 01 /
HIRATA, Toru SUMITOMO HEAVY INDUSTRIES, LTD. Yokosuka Works 19 Natsushimacho Yokosuka-shi, Kanagawa 237-0061 / JP | [2009/01] | Representative(s) | Emde, Eric, et al Wagner & Geyer Partnerschaft mbB Patent- und Rechtsanwälte Gewürzmühlstrasse 5 80538 München / DE | [N/P] |
Former [2009/01] | Emde, Eric, et al Wagner & Geyer, Gewürzmühlstrasse 5 80538 München / DE | Application number, filing date | 07742087.5 | 20.04.2007 | [2009/01] | WO2007JP58652 | Priority number, date | JP20060116420 | 20.04.2006 Original published format: JP 2006116420 | [2009/01] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2007123210 | Date: | 01.11.2007 | Language: | JA | [2007/44] | Type: | A1 Application with search report | No.: | EP2008786 | Date: | 31.12.2008 | Language: | EN | [2009/01] | Search report(s) | International search report - published on: | JP | 01.11.2007 | (Supplementary) European search report - dispatched on: | EP | 15.02.2010 | Classification | IPC: | B29C33/38, B29C45/26, B29L11/00, B29L17/00 | [2009/01] | CPC: |
B29C45/263 (EP,US);
B29C33/38 (KR);
B29C33/3828 (EP,US);
B29C33/424 (EP,US);
B29C45/26 (KR);
B29C45/2632 (EP,US);
B29C2033/023 (EP,US);
B29C2045/2636 (EP,US);
B29L2011/00 (KR);
| Designated contracting states | AT, CH, DE, LI, NL [2009/22] |
Former [2009/01] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR | Extension states | AL | Not yet paid | BA | Not yet paid | HR | Not yet paid | MK | Not yet paid | RS | Not yet paid | Title | German: | HARZFORMVORRICHTUNG UND HARZFORMVERFAHREN | [2009/01] | English: | RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD | [2009/01] | French: | DISPOSITIF DE MOULAGE DE RÉSINE ET MÉTHODE DE MOULAGE DE RÉSINE | [2009/01] | Entry into regional phase | 15.10.2008 | Translation filed | 15.10.2008 | National basic fee paid | 15.10.2008 | Search fee paid | 15.10.2008 | Designation fee(s) paid | 15.10.2008 | Examination fee paid | Examination procedure | 15.10.2008 | Examination requested [2009/01] | 21.11.2008 | Loss of particular rights, legal effect: designated state(s) | 08.01.2009 | Despatch of communication of loss of particular rights: designated state(s) BE, BG, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, PL, PT, RO, SE, SI, SK, TR | 29.04.2010 | Despatch of a communication from the examining division (Time limit: M04) | 09.09.2010 | Reply to a communication from the examining division | 02.08.2011 | Despatch of a communication from the examining division (Time limit: M04) | 12.12.2011 | Reply to a communication from the examining division | 01.11.2014 | Application deemed to be withdrawn, date of legal effect [2015/21] | 07.01.2015 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2015/21] | Divisional application(s) | EP09011269.9 / EP2119549 | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 29.04.2010 | Fees paid | Renewal fee | 29.04.2009 | Renewal fee patent year 03 | 30.03.2010 | Renewal fee patent year 04 | 27.04.2011 | Renewal fee patent year 05 | 26.03.2012 | Renewal fee patent year 06 | 29.04.2013 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 30.04.2014 | 08   M06   Not yet paid |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]EP1640132 (TDK CORP [JP]) [X] 1,3,8-9 * paragraphs [0008] , [0009] , [0014] , [0015] * [Y] 4-7; | [XY]JPH10149587 (HITACHI LTD, et al) [X] 1,3,8-9 * paragraph [0009] - paragraph [0016]; figures 2-4 * [Y] 4-7; | [XY]JP2002361689 (RICOH KK) [X] 1-2,8-9 * paragraph [0034]; figure 1 * [Y] 4-7; | [Y]WO9932269 (DU PONT [US]) [Y] 4-7 * figures 1,2; claim 1 *; | [XP]WO2006043708 (RICOH KK [JP], et al) [XP] 1-2,8-9 * page 20, line 5 - page 21, line 9 * | International search | [X]JPH10149587 (HITACHI LTD, et al); | [Y]JP2002361689 (RICOH KK); | [Y]JP2001526126 ; | [Y]JP2006008759 (MITSUBISHI GAS CHEMICAL CO) | by applicant | JP2000249538 |