EP2048209 - ADHESIVE COMPOSITION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 03.02.2012 Database last updated on 29.10.2024 | Most recent event Tooltip | 03.02.2012 | Withdrawal of application | published on 07.03.2012 [2012/10] | Applicant(s) | For all designated states Hitachi Chemical Company, Ltd. 1-1, Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP | [N/P] |
Former [2009/16] | For all designated states Hitachi Chemical Company, Ltd. 1-1, Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP | Inventor(s) | 01 /
IZAWA, Hiroyuki c/o Hitachi Chemical Company Ltd. 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | 02 /
SHIRASAKA, Toshiaki c/o Hitachi Chemical Company Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | 03 /
KUDOU, Sunao c/o Hitachi Chemical Company Ltd. 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP | 04 /
TOMIZAWA, Keiko c/o Hitachi Chemical Company Ltd. 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | 05 /
KATOGI, Shigeki c/o Hitachi Chemical Company Ltd. 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | [2009/16] | Representative(s) | dompatent von Kreisler Selting Werner - Partnerschaft von Patent- und Rechtsanwälten mbB Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | [N/P] |
Former [2010/15] | von Kreisler Selting Werner Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | ||
Former [2009/16] | Jönsson, Hans-Peter Patentanwälte von Kreisler Selting Werner Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | Application number, filing date | 07767396.0 | 22.06.2007 | [2009/16] | WO2007JP62585 | Priority number, date | JP20060213235 | 04.08.2006 Original published format: JP 2006213235 | JP20060314620 | 21.11.2006 Original published format: JP 2006314620 | [2009/16] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2008015852 | Date: | 07.02.2008 | Language: | EN | [2008/06] | Type: | A1 Application with search report | No.: | EP2048209 | Date: | 15.04.2009 | Language: | EN | The application published by WIPO in one of the EPO official languages on 07.02.2008 takes the place of the publication of the European patent application. | [2009/16] | Search report(s) | International search report - published on: | JP | 07.02.2008 | (Supplementary) European search report - dispatched on: | EP | 20.12.2011 | Classification | IPC: | C09J4/00, C09J129/14, C09J133/00, C09J167/00, C09J171/10, C09J175/04, C09J179/08, H01B1/22, H01L21/60, H05K1/03, H05K3/32 | [2009/16] | CPC: |
C09J175/04 (EP,KR);
C09J129/14 (KR);
C08F290/06 (EP);
C08F290/061 (EP);
C08G18/4018 (EP);
C08G18/4238 (EP);
C08G18/4854 (EP);
C08G18/6674 (EP);
C08G18/672 (EP);
C09J133/00 (KR);
C09J167/00 (EP,KR);
C09J171/00 (EP);
C09J175/16 (EP);
C09J179/08 (EP);
C09J4/06 (EP);
H01L24/32 (EP);
H01L24/83 (EP);
H05K3/323 (EP);
C08G2650/56 (EP);
C08K5/14 (EP);
C08L2666/20 (EP);
C08L75/04 (EP);
H01L2224/2919 (EP);
H01L2224/32225 (EP);
H01L2224/83101 (EP);
H01L2224/8388 (EP);
H01L2924/01004 (EP);
H01L2924/01005 (EP);
H01L2924/01006 (EP);
H01L2924/01013 (EP);
H01L2924/01015 (EP);
H01L2924/01019 (EP);
H01L2924/01027 (EP);
H01L2924/01029 (EP);
H01L2924/01033 (EP);
H01L2924/01045 (EP);
H01L2924/01047 (EP);
H01L2924/01049 (EP);
H01L2924/0105 (EP);
H01L2924/01074 (EP);
H01L2924/01077 (EP);
H01L2924/01079 (EP);
H01L2924/014 (EP);
H01L2924/0665 (EP);
H01L2924/07802 (EP);
H01L2924/0781 (EP);
H01L2924/07811 (EP);
H01L2924/09701 (EP);
| C-Set: |
C08G18/672, C08G18/44 (EP);
C09J171/00, C08L2666/20 (EP);
H01L2224/2919, H01L2924/0665, H01L2924/00 (EP);
H01L2924/0665, H01L2924/00 (EP); | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR [2009/16] | Extension states | AL | 06.02.2009 | BA | 06.02.2009 | HR | 06.02.2009 | MK | 06.02.2009 | RS | 06.02.2009 | Title | German: | KLEBEMITTEL UND VERBINDUNGSKONSTRUKTION FÜR KREISGLIED | [2009/16] | English: | ADHESIVE COMPOSITION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER | [2009/16] | French: | COMPOSITION ADHÉSIVE ET STRUCTURE DE CONNEXION POUR ÉLÉMENT DE CIRCUIT | [2009/16] | Entry into regional phase | 06.02.2009 | Translation filed | 06.02.2009 | National basic fee paid | 06.02.2009 | Search fee paid | 06.02.2009 | Designation fee(s) paid | 06.02.2009 | Examination fee paid | Examination procedure | 06.02.2009 | Amendment by applicant (claims and/or description) | 06.02.2009 | Examination requested [2009/16] | 31.01.2012 | Application withdrawn by applicant [2012/10] | Fees paid | Renewal fee | 25.06.2009 | Renewal fee patent year 03 | 27.03.2010 | Renewal fee patent year 04 | 29.06.2011 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JP2004339499 (OSAKA GAS CO LTD) [X] 1-13 * the whole document *; | [X]JP2005187661 (OSAKA GAS CO LTD) [X] 1-13 * the whole document *; | [X]JP2005123025 (BRIDGESTONE CORP) [X] 1-13 * the whole document *; | [X]JP2005054140 (HITACHI CHEMICAL CO LTD) [X] 1-13 * the whole document *; | [X]EP1533354 (BRIDGESTONE CORP [JP]) [X] 1-13 * paragraph [0057]; example -; claims 1-18 *; | [X]EP1241238 (NGK INSULATORS LTD [JP]) [X] 1-13 * paragraph [0001] - paragraph [0016]; example -; claims 1-10 *; | [X]JPH1067977 (NIPPON STEEL CHEMICAL CO, et al) [X] 1-13 * the whole document *; | [X]JPH1067970 (NIPPON STEEL CHEMICAL CO, et al) [X] 1-13 * the whole document * | International search | [X]JP2005187661 (OSAKA GAS CO LTD); | [X]JP2004339499 (OSAKA GAS CO LTD); | [Y]JP2005123025 (BRIDGESTONE CORP); | [Y]JP2005054140 (HITACHI CHEMICAL CO LTD); | [Y]JP2003089775 (BRIDGESTONE CORP); | [Y]JP2002337274 (NGK INSULATORS LTD); | [A]JPH1067970 (NIPPON STEEL CHEMICAL CO, et al) | by applicant | JPH01113480 | JP2002203427 | JP3522634B | JP2002285128 | - J.P. FOUASSIER, Photoinitiation, Photopolymerization, and Photocuring, HANSER PUBLISHERS, (1995), page 17 |