EP2098362 - ENGRAVED PLATE AND BASE MATERIAL HAVING CONDUCTOR LAYER PATTERN USING THE ENGRAVED PLATE [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 09.10.2020 Database last updated on 29.10.2024 | |
Former | Grant of patent is intended Status updated on 01.01.2020 | ||
Former | Examination is in progress Status updated on 24.11.2017 | Most recent event Tooltip | 09.10.2020 | Application deemed to be withdrawn | published on 11.11.2020 [2020/46] | Applicant(s) | For all designated states Hitachi Chemical Company, Ltd. 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 / JP | [2020/23] |
Former [2009/37] | For all designated states Hitachi Chemical Company, Ltd. 1-1 Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP | Inventor(s) | 01 /
NAOYUKI, Susumu c/o Hitachi Chemical Co., Ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP | 02 /
KANBARA, Hisashige c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | 03 /
TOSAKA, Minoru c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | 04 /
SUZUKI, Kyosuke c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | 05 /
OKAMURA, Toshirou 1622-81, Tamado, Chikusei-shi Ibaraki 308-0847 / JP | 06 /
KIKUHARA, Yoshihito c/o Nikka Equipment & Engineering Co., Ltd. Shimodate Works, 1425, ogawa, Chikusei-shi Ibaraki 308-0857 / JP | 07 /
NEGISHI, Masami c/o Hitachi Chemical Co., Ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP | 08 /
FUJIEDA, Tadayasu c/o Hitachi Chemical Co., Ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP | 09 /
TSUYAMA, Kouichi Hitachi Chemical Techno Service Co., Ltd. Shimodate Works, 1425, Ogawa, Chikusei-shi Ibaraki 308-0857 / JP | [N/P] |
Former [2009/37] | 01 /
NAOYUKI, Susumu c/o Hitachi Chemical Co., ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP | ||
02 /
KANBARA, Hisashige c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | |||
03 /
TOSAKA, Minoru c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | |||
04 /
SUZUKI, Kyosuke c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP | |||
05 /
OKAMURA, Toshirou 1622-81, Tamado, Chikusei-shi Ibaraki 308-0847 / JP | |||
06 /
KIKUHARA, Yoshihito c/o Nikka Equipment & Engineering Co., Ltd., Shimodate Works, 1425, ogawa, Chikusei-shi Ibaraki 308-0857 / JP | |||
07 /
NEGISHI, Masami c/o Hitachi Chemical Co., ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP | |||
08 /
FUJIEDA, Tadayasu c/o Hitachi Chemical Co., ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP | |||
09 /
TSUYAMA, Kouichi Hitachi Chemical Techno Service Co., Ltd. Shimodate Works, 1425, Ogawa, Chikusei-shi Ibaraki 308-0857 / JP | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE | [N/P] |
Former [2009/37] | HOFFMANN EITLE Patent- und Rechtsanwälte Arabellastrasse 4 81925 München / DE | Application number, filing date | 07860426.1 | 27.12.2007 | [2009/37] | WO2007JP75205 | Priority number, date | JP20060352549 | 27.12.2006 Original published format: JP 2006352549 | JP20070099332 | 05.04.2007 Original published format: JP 2007099332 | JP20070152658 | 08.06.2007 Original published format: JP 2007152658 | JP20070158735 | 15.06.2007 Original published format: JP 2007158735 | JP20070183130 | 12.07.2007 Original published format: JP 2007183130 | [2009/37] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2008081904 | Date: | 10.07.2008 | Language: | JA | [2008/28] | Type: | A1 Application with search report | No.: | EP2098362 | Date: | 09.09.2009 | Language: | EN | [2009/37] | Search report(s) | International search report - published on: | JP | 10.07.2008 | (Supplementary) European search report - dispatched on: | EP | 19.06.2012 | Classification | IPC: | H05K3/20, B41C1/00, B41N1/06, B41N1/12, C25D1/00, H05K9/00 | [2019/51] | CPC: |
B41N1/06 (EP,KR,US);
B41C1/00 (EP,KR,US);
B32B3/14 (KR);
B41N1/12 (EP,US);
C25D1/00 (EP,US);
C25D1/006 (EP,US);
H05K3/205 (EP,US);
H05K9/00 (KR);
H05K9/0096 (EP,US);
H05K2201/09827 (EP,US);
Y10T428/2457 (EP,US);
Y10T428/24612 (EP,US);
|
Former IPC [2012/29] | B32B3/14, B41C1/00, B41N1/06, B41N1/12, C25D1/00, C25D5/02, H05K9/00, B32B3/30, B32B9/00, B32B15/00 | ||
Former IPC [2009/37] | B32B3/14, B41C1/00, B41N1/06, B41N1/12, C25D1/00, C25D5/02, H05K9/00 | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR [2009/37] | Title | German: | GRAVURPLATTE UND BASISMATERIAL MIT LEITFÄHIGER SCHICHTSTRUKTUR UNTER VERWENDUNG DER GRAVURPLATTE | [2020/02] | English: | ENGRAVED PLATE AND BASE MATERIAL HAVING CONDUCTOR LAYER PATTERN USING THE ENGRAVED PLATE | [2009/37] | French: | PLAQUE GRAVÉE ET MATÉRIAU DE BASE AYANT UN MOTIF DE COUCHE CONDUCTRICE UTILISANT LA PLAQUE GRAVÉE | [2009/37] |
Former [2009/37] | GRAVIERTE PLATTE UND BASISMATERIAL MIT LEITSCHICHTSTRUKTUR UND DER GRAVIERTEN PLATTE | Entry into regional phase | 31.03.2009 | Translation filed | 31.03.2009 | National basic fee paid | 31.03.2009 | Search fee paid | 31.03.2009 | Designation fee(s) paid | 31.03.2009 | Examination fee paid | Examination procedure | 31.03.2009 | Examination requested [2009/37] | 09.01.2013 | Amendment by applicant (claims and/or description) | 22.11.2017 | Despatch of a communication from the examining division (Time limit: M04) | 27.03.2018 | Reply to a communication from the examining division | 12.02.2019 | Despatch of a communication from the examining division (Time limit: M06) | 21.08.2019 | Reply to a communication from the examining division | 02.01.2020 | Communication of intention to grant the patent | 03.06.2020 | Application deemed to be withdrawn, date of legal effect [2020/46] | 24.06.2020 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2020/46] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 22.11.2017 | Fees paid | Renewal fee | 23.12.2009 | Renewal fee patent year 03 | 22.12.2010 | Renewal fee patent year 04 | 09.12.2011 | Renewal fee patent year 05 | 19.12.2012 | Renewal fee patent year 06 | 19.12.2013 | Renewal fee patent year 07 | 22.12.2014 | Renewal fee patent year 08 | 21.12.2015 | Renewal fee patent year 09 | 20.12.2016 | Renewal fee patent year 10 | 14.12.2017 | Renewal fee patent year 11 | 13.12.2018 | Renewal fee patent year 12 | 09.12.2019 | Renewal fee patent year 13 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2002119665 (CHAPMAN JEFFREY A [GB]) [X] 1-8,11-14,16-20 * figure 4 * * abstract * * Figures * * paragraph [0009] * * claims 1-11 * * paragraph [0006] - paragraph [0029] *; | [X]JPH01226193 (YAZAKI CORP) [X] 1-4,9,10,12,13 * EPODOC abstract - "engraved and a flat plate" * * Figures (b), (a) * * Figures *; | [X]JPH0637177 (KANSAI NIPPON ELECTRIC) [X] 1-4,6,7,9,10,12,13 * EPODOC abstract * * Figures *; | [X]JPH11163372 (MITSUBISHI ELECTRIC CORP) [X] 1-4,7,9,10,12 * EPODOC abstract * * Figures *; | [A]JPH0918119 (DAINIPPON PRINTING CO LTD) [A] 1-31 * EPODOC abstract * * Figures *; | [A]CN1061629 (LU XINYUAN [CN]) [A] 1-31 * EPODOC abstract *; | [A]JP2000031413 (NEC CORP) [A] 1-31 * EPODOC abstract * * Figures * | International search | [Y]JPH0918119 (DAINIPPON PRINTING CO LTD); | [Y]JP2004518563 ; | [Y]JPH11309950 (THINK LABS KK); | [Y]JPH11291438 (TOPPAN PRINTING CO LTD); | [Y]JP2004249475 (RICOH MICROELECTRONICS CO LTD); | [Y]JP2005057159 (SHINETSU POLYMER CO); | [Y]JP2006032686 (HITACHI CHEMICAL CO LTD); | [A]JP2005346043 (SEMICONDUCTOR ENERGY LAB); | [A]JP2000077823 (MATSUSHITA ELECTRIC IND CO LTD); | [A]JP2001071451 (RICOH MICROELECTRONICS CO LTD) | by applicant | JP2006231668 | JP2001232747 | JPH11269 | JP2004186416 | JP2006352549 | JP2007099332 | JP2007152658 | JP2007158735 | JP2007183130 | - MAKI SHOTEN, Practical Plating for Field Enginee, JAPAN PLATING ASSOCIATION, (1986), pages 87 - 504 |