Deutsch English Français

Contact

EP2098362

European procedure

Quick help

Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...

News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...

Extract from the Register of European Patents

EP About this file: EP2098362

EP2098362 - ENGRAVED PLATE AND BASE MATERIAL HAVING CONDUCTOR LAYER PATTERN USING THE ENGRAVED PLATE [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 09.10.2020 Database last updated on 29.10.2024
Former	Grant of patent is intended Status updated on 01.01.2020
Former	Examination is in progress Status updated on 24.11.2017
Most recent event Tooltip	09.10.2020	Application deemed to be withdrawn	published on 11.11.2020 [2020/46]
Applicant(s)	For all designated states Hitachi Chemical Company, Ltd. 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 / JP
	[2020/23]
Former [2009/37]	For all designated states Hitachi Chemical Company, Ltd. 1-1 Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP
Inventor(s)	01 / NAOYUKI, Susumu c/o Hitachi Chemical Co., Ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP
	02 / KANBARA, Hisashige c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP
	03 / TOSAKA, Minoru c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP
	04 / SUZUKI, Kyosuke c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP
	05 / OKAMURA, Toshirou 1622-81, Tamado, Chikusei-shi Ibaraki 308-0847 / JP
	06 / KIKUHARA, Yoshihito c/o Nikka Equipment & Engineering Co., Ltd. Shimodate Works, 1425, ogawa, Chikusei-shi Ibaraki 308-0857 / JP
	07 / NEGISHI, Masami c/o Hitachi Chemical Co., Ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP
	08 / FUJIEDA, Tadayasu c/o Hitachi Chemical Co., Ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP
	09 / TSUYAMA, Kouichi Hitachi Chemical Techno Service Co., Ltd. Shimodate Works, 1425, Ogawa, Chikusei-shi Ibaraki 308-0857 / JP
	[N/P]
Former [2009/37]	01 / NAOYUKI, Susumu c/o Hitachi Chemical Co., ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP
	02 / KANBARA, Hisashige c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP
	03 / TOSAKA, Minoru c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP
	04 / SUZUKI, Kyosuke c/o Hitachi Co., Ltd., 48, Wadai Tsukuba-shi Ibaraki 300-4247 / JP
	05 / OKAMURA, Toshirou 1622-81, Tamado, Chikusei-shi Ibaraki 308-0847 / JP
	06 / KIKUHARA, Yoshihito c/o Nikka Equipment & Engineering Co., Ltd., Shimodate Works, 1425, ogawa, Chikusei-shi Ibaraki 308-0857 / JP
	07 / NEGISHI, Masami c/o Hitachi Chemical Co., ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP
	08 / FUJIEDA, Tadayasu c/o Hitachi Chemical Co., ltd., 1150, Goshomiya Chikusei-shi Ibaraki 308-8524 / JP
	09 / TSUYAMA, Kouichi Hitachi Chemical Techno Service Co., Ltd. Shimodate Works, 1425, Ogawa, Chikusei-shi Ibaraki 308-0857 / JP
Representative(s)	Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE
	[N/P]
Former [2009/37]	HOFFMANN EITLE Patent- und Rechtsanwälte Arabellastrasse 4 81925 München / DE
Application number, filing date	07860426.1	27.12.2007
	[2009/37]
	WO2007JP75205
Priority number, date	JP20060352549	27.12.2006 Original published format: JP 2006352549
	JP20070099332	05.04.2007 Original published format: JP 2007099332
	JP20070152658	08.06.2007 Original published format: JP 2007152658
	JP20070158735	15.06.2007 Original published format: JP 2007158735
	JP20070183130	12.07.2007 Original published format: JP 2007183130
	[2009/37]
Filing language	JA
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	WO2008081904
	Date:	10.07.2008
	Language:	JA
	[2008/28]
	Type:	A1 Application with search report
	No.:	EP2098362
	Date:	09.09.2009
	Language:	EN
	[2009/37]
Search report(s)	International search report - published on:	JP	10.07.2008
	(Supplementary) European search report - dispatched on:	EP	19.06.2012
Classification	IPC:	H05K3/20, B41C1/00, B41N1/06, B41N1/12, C25D1/00, H05K9/00	[2019/51]
	CPC:	B41N1/06 (EP,KR,US); B41C1/00 (EP,KR,US); B32B3/14 (KR); B41N1/12 (EP,US); C25D1/00 (EP,US); C25D1/006 (EP,US); (+) H05K3/205 (EP,US); H05K9/00 (KR); H05K9/0096 (EP,US); H05K2201/09827 (EP,US); Y10T428/2457 (EP,US); Y10T428/24612 (EP,US); Y10T428/2462 (EP,US); Y10T428/30 (EP,US) (-)
	Former IPC [2012/29]	B32B3/14, B41C1/00, B41N1/06, B41N1/12, C25D1/00, C25D5/02, H05K9/00, B32B3/30, B32B9/00, B32B15/00
	Former IPC [2009/37]	B32B3/14, B41C1/00, B41N1/06, B41N1/12, C25D1/00, C25D5/02, H05K9/00
Designated contracting states	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR [2009/37]
Title	German:	GRAVURPLATTE UND BASISMATERIAL MIT LEITFÄHIGER SCHICHTSTRUKTUR UNTER VERWENDUNG DER GRAVURPLATTE	[2020/02]
	English:	ENGRAVED PLATE AND BASE MATERIAL HAVING CONDUCTOR LAYER PATTERN USING THE ENGRAVED PLATE	[2009/37]
	French:	PLAQUE GRAVÉE ET MATÉRIAU DE BASE AYANT UN MOTIF DE COUCHE CONDUCTRICE UTILISANT LA PLAQUE GRAVÉE	[2009/37]
	Former [2009/37]	GRAVIERTE PLATTE UND BASISMATERIAL MIT LEITSCHICHTSTRUKTUR UND DER GRAVIERTEN PLATTE
Entry into regional phase	31.03.2009	Translation filed
	31.03.2009	National basic fee paid
	31.03.2009	Search fee paid
	31.03.2009	Designation fee(s) paid
	31.03.2009	Examination fee paid
Examination procedure	31.03.2009	Examination requested [2009/37]
	09.01.2013	Amendment by applicant (claims and/or description)
	22.11.2017	Despatch of a communication from the examining division (Time limit: M04)
	27.03.2018	Reply to a communication from the examining division
	12.02.2019	Despatch of a communication from the examining division (Time limit: M06)
	21.08.2019	Reply to a communication from the examining division
	02.01.2020	Communication of intention to grant the patent
	03.06.2020	Application deemed to be withdrawn, date of legal effect [2020/46]
	24.06.2020	Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2020/46]
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 22.11.2017
Fees paid	Renewal fee
	23.12.2009	Renewal fee patent year 03
	22.12.2010	Renewal fee patent year 04
	09.12.2011	Renewal fee patent year 05
	19.12.2012	Renewal fee patent year 06
	19.12.2013	Renewal fee patent year 07
	22.12.2014	Renewal fee patent year 08
	21.12.2015	Renewal fee patent year 09
	20.12.2016	Renewal fee patent year 10
	14.12.2017	Renewal fee patent year 11
	13.12.2018	Renewal fee patent year 12
	09.12.2019	Renewal fee patent year 13
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[X]US2002119665 (CHAPMAN JEFFREY A [GB]) [X] 1-8,11-14,16-20 * figure 4 * * abstract * * Figures * * paragraph [0009] * * claims 1-11 * * paragraph [0006] - paragraph [0029] *;
		[X]JPH01226193 (YAZAKI CORP) [X] 1-4,9,10,12,13 * EPODOC abstract - "engraved and a flat plate" * * Figures (b), (a) * * Figures *;
		[X]JPH0637177 (KANSAI NIPPON ELECTRIC) [X] 1-4,6,7,9,10,12,13 * EPODOC abstract * * Figures *;
		[X]JPH11163372 (MITSUBISHI ELECTRIC CORP) [X] 1-4,7,9,10,12 * EPODOC abstract * * Figures *;
		[A]JPH0918119 (DAINIPPON PRINTING CO LTD) [A] 1-31 * EPODOC abstract * * Figures *;
		[A]CN1061629 (LU XINYUAN [CN]) [A] 1-31 * EPODOC abstract *;
		[A]JP2000031413 (NEC CORP) [A] 1-31 * EPODOC abstract * * Figures *
	International search	[Y]JPH0918119 (DAINIPPON PRINTING CO LTD);
		[Y]JP2004518563 ;
		[Y]JPH11309950 (THINK LABS KK);
		[Y]JPH11291438 (TOPPAN PRINTING CO LTD);
		[Y]JP2004249475 (RICOH MICROELECTRONICS CO LTD);
		[Y]JP2005057159 (SHINETSU POLYMER CO);
		[Y]JP2006032686 (HITACHI CHEMICAL CO LTD);
		[A]JP2005346043 (SEMICONDUCTOR ENERGY LAB);
		[A]JP2000077823 (MATSUSHITA ELECTRIC IND CO LTD);
		[A]JP2001071451 (RICOH MICROELECTRONICS CO LTD)
	by applicant	JP2006231668
		JP2001232747
		JPH11269
		JP2004186416
		JP2006352549
		JP2007099332
		JP2007152658
		JP2007158735
		JP2007183130
		- MAKI SHOTEN, Practical Plating for Field Enginee, JAPAN PLATING ASSOCIATION, (1986), pages 87 - 504

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

Legal notice
Terms of use
24.2.25; 35p