EP1956647 - Circuit arrangement with connecting device and corresponding production method [Right-click to bookmark this link] | |||
Former [2008/33] | Switch device with connecting device and corresponding production method | ||
[2009/22] | Status | No opposition filed within time limit Status updated on 18.06.2010 Database last updated on 02.11.2024 | Most recent event Tooltip | 19.10.2012 | Lapse of the patent in a contracting state New state(s): TR | published on 21.11.2012 [2012/47] | Applicant(s) | For all designated states SEMIKRON Elektronik GmbH & Co. KG Patentabteilung Sigmundstrasse 200 90431 Nürnberg / DE | [2008/33] | Inventor(s) | 01 /
Beckedahl, Peter Ottostrasse 5 90522 Oberasbach / DE | 02 /
Braml, Heiko Wüstenstein 14a 91346 Wiesenttal / DE | 03 /
Göbl, Christian Heidenheimerstrasse 987 90441 Nürnberg / DE | 04 /
Heilbronner, Heinrich, Dr. Birkenweg 6 90547 Stein / DE | [2008/33] | Application number, filing date | 08000989.7 | 19.01.2008 | [2008/33] | Priority number, date | DE20071006706 | 10.02.2007 Original published format: DE102007006706 | [2008/33] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP1956647 | Date: | 13.08.2008 | Language: | DE | [2008/33] | Type: | B1 Patent specification | No.: | EP1956647 | Date: | 12.08.2009 | Language: | DE | [2009/33] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.05.2008 | Classification | IPC: | H01L21/60 | [2008/33] | CPC: |
H01L23/296 (EP);
H01L24/33 (EP);
H01L24/37 (EP);
H01L24/38 (EP);
H01L24/40 (EP);
H01L24/41 (EP);
H01L24/50 (EP);
H01L24/83 (EP);
H01L24/84 (EP);
H01L24/86 (EP);
H01L25/072 (EP);
H01L2224/371 (EP);
H01L2224/37147 (EP);
H01L2224/37599 (EP);
H01L2224/40225 (EP);
H01L2224/83201 (EP);
H01L2224/83209 (EP);
H01L2224/83801 (EP);
H01L2224/8384 (EP);
H01L2224/8484 (EP);
H01L2224/8584 (EP);
H01L2924/01005 (EP);
H01L2924/01013 (EP);
H01L2924/01029 (EP);
| C-Set: |
H01L2224/37599, H01L2924/00014 (EP);
H01L2224/8384, H01L2924/00014 (EP);
H01L2224/8484, H01L2924/00014 (EP)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2008/33] | Title | German: | Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu | [2008/33] | English: | Circuit arrangement with connecting device and corresponding production method | [2009/22] | French: | Circuit doté d'un dispositif de liaison et son procédé de fabrication | [2009/22] |
Former [2008/33] | Switch device with connecting device and corresponding production method | ||
Former [2008/33] | Installation de commutation dotée d'un dispositif de liaison et son procédé de fabrication | Examination procedure | 30.05.2008 | Examination requested [2008/33] | 18.09.2008 | Despatch of a communication from the examining division (Time limit: M04) | 15.01.2009 | Reply to a communication from the examining division | 11.05.2009 | Communication of intention to grant the patent | 27.05.2009 | Fee for grant paid | 27.05.2009 | Fee for publishing/printing paid | Opposition(s) | 17.05.2010 | No opposition filed within time limit [2010/29] |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | CY | 12.08.2009 | CZ | 12.08.2009 | EE | 12.08.2009 | HR | 12.08.2009 | IE | 12.08.2009 | LT | 12.08.2009 | LV | 12.08.2009 | MT | 12.08.2009 | RO | 12.08.2009 | SI | 12.08.2009 | TR | 12.08.2009 | BG | 12.11.2009 | NO | 12.11.2009 | GR | 13.11.2009 | IS | 12.12.2009 | LU | 19.01.2010 | BE | 31.01.2010 | MC | 31.01.2010 | HU | 13.02.2010 | [2012/47] |
Former [2012/43] | CY | 12.08.2009 | |
CZ | 12.08.2009 | ||
EE | 12.08.2009 | ||
HR | 12.08.2009 | ||
IE | 12.08.2009 | ||
LT | 12.08.2009 | ||
LV | 12.08.2009 | ||
MT | 12.08.2009 | ||
RO | 12.08.2009 | ||
SI | 12.08.2009 | ||
BG | 12.11.2009 | ||
NO | 12.11.2009 | ||
GR | 13.11.2009 | ||
IS | 12.12.2009 | ||
LU | 19.01.2010 | ||
BE | 31.01.2010 | ||
MC | 31.01.2010 | ||
HU | 13.02.2010 | ||
Former [2012/42] | CY | 12.08.2009 | |
CZ | 12.08.2009 | ||
EE | 12.08.2009 | ||
HR | 12.08.2009 | ||
IE | 12.08.2009 | ||
LT | 12.08.2009 | ||
LV | 12.08.2009 | ||
MT | 12.08.2009 | ||
RO | 12.08.2009 | ||
SI | 12.08.2009 | ||
BG | 12.11.2009 | ||
NO | 12.11.2009 | ||
GR | 13.11.2009 | ||
IS | 12.12.2009 | ||
BE | 31.01.2010 | ||
MC | 31.01.2010 | ||
HU | 13.02.2010 | ||
Former [2012/37] | CY | 12.08.2009 | |
CZ | 12.08.2009 | ||
EE | 12.08.2009 | ||
HR | 12.08.2009 | ||
IE | 12.08.2009 | ||
LT | 12.08.2009 | ||
LV | 12.08.2009 | ||
MT | 12.08.2009 | ||
RO | 12.08.2009 | ||
SI | 12.08.2009 | ||
BG | 12.11.2009 | ||
NO | 12.11.2009 | ||
GR | 13.11.2009 | ||
IS | 12.12.2009 | ||
BE | 31.01.2010 | ||
MC | 31.01.2010 | ||
Former [2011/25] | CZ | 12.08.2009 | |
EE | 12.08.2009 | ||
HR | 12.08.2009 | ||
IE | 12.08.2009 | ||
LT | 12.08.2009 | ||
LV | 12.08.2009 | ||
MT | 12.08.2009 | ||
RO | 12.08.2009 | ||
SI | 12.08.2009 | ||
BG | 12.11.2009 | ||
NO | 12.11.2009 | ||
GR | 13.11.2009 | ||
IS | 12.12.2009 | ||
BE | 31.01.2010 | ||
MC | 31.01.2010 | ||
Former [2010/44] | CZ | 12.08.2009 | |
EE | 12.08.2009 | ||
HR | 12.08.2009 | ||
IE | 12.08.2009 | ||
LT | 12.08.2009 | ||
LV | 12.08.2009 | ||
RO | 12.08.2009 | ||
SI | 12.08.2009 | ||
BG | 12.11.2009 | ||
NO | 12.11.2009 | ||
IS | 12.12.2009 | ||
MC | 31.01.2010 | ||
Former [2010/28] | CZ | 12.08.2009 | |
EE | 12.08.2009 | ||
HR | 12.08.2009 | ||
IE | 12.08.2009 | ||
LT | 12.08.2009 | ||
LV | 12.08.2009 | ||
RO | 12.08.2009 | ||
SI | 12.08.2009 | ||
BG | 12.11.2009 | ||
NO | 12.11.2009 | ||
IS | 12.12.2009 | ||
Former [2010/19] | HR | 12.08.2009 | |
LT | 12.08.2009 | ||
LV | 12.08.2009 | ||
SI | 12.08.2009 | ||
BG | 12.11.2009 | ||
NO | 12.11.2009 | ||
IS | 12.12.2009 | Documents cited: | Search | [Y]WO03030247 (SIEMENS AG [DE], et al) [Y] 6,7 * page 9, line 30 - page 13, line 20; figures 1,2 *; | [XY]US2004227235 (HASHIMOTO NOBUAKI [JP]) [X] 1-5 * paragraph [0081] - paragraph [0099]; figure 1 * [Y] 6-10; | [DY]DE102004019567 (SEMIKRON ELEKTRONIK GMBH [DE]) [DY] 8-10 * paragraph [0016] - paragraph [0022]; figure 4 *; | [X]US2006103000 (KUROSAWA HIROFUMI [JP]) [X] 1-5* paragraph [0041] - paragraph [0064]; figures 1-8 * | by applicant | DE3414065 | WO03030247 | US2004227235 | DE10355925 | DE102004019567 |