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Extract from the Register of European Patents

EP About this file: EP1956647

EP1956647 - Circuit arrangement with connecting device and corresponding production method [Right-click to bookmark this link]
Former [2008/33]Switch device with connecting device and corresponding production method
[2009/22]
StatusNo opposition filed within time limit
Status updated on  18.06.2010
Database last updated on 02.11.2024
Most recent event   Tooltip19.10.2012Lapse of the patent in a contracting state
New state(s): TR
published on 21.11.2012  [2012/47]
Applicant(s)For all designated states
SEMIKRON Elektronik GmbH & Co. KG
Patentabteilung Sigmundstrasse 200
90431 Nürnberg / DE
[2008/33]
Inventor(s)01 / Beckedahl, Peter
Ottostrasse 5
90522 Oberasbach / DE
02 / Braml, Heiko
Wüstenstein 14a
91346 Wiesenttal / DE
03 / Göbl, Christian
Heidenheimerstrasse 987
90441 Nürnberg / DE
04 / Heilbronner, Heinrich, Dr.
Birkenweg 6
90547 Stein / DE
 [2008/33]
Application number, filing date08000989.719.01.2008
[2008/33]
Priority number, dateDE2007100670610.02.2007         Original published format: DE102007006706
[2008/33]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP1956647
Date:13.08.2008
Language:DE
[2008/33]
Type: B1 Patent specification 
No.:EP1956647
Date:12.08.2009
Language:DE
[2009/33]
Search report(s)(Supplementary) European search report - dispatched on:EP08.05.2008
ClassificationIPC:H01L21/60
[2008/33]
CPC:
H01L23/296 (EP); H01L24/33 (EP); H01L24/37 (EP);
H01L24/38 (EP); H01L24/40 (EP); H01L24/41 (EP);
H01L24/50 (EP); H01L24/83 (EP); H01L24/84 (EP);
H01L24/86 (EP); H01L25/072 (EP); H01L2224/371 (EP);
H01L2224/37147 (EP); H01L2224/37599 (EP); H01L2224/40225 (EP);
H01L2224/83201 (EP); H01L2224/83209 (EP); H01L2224/83801 (EP);
H01L2224/8384 (EP); H01L2224/8484 (EP); H01L2224/8584 (EP);
H01L2924/01005 (EP); H01L2924/01013 (EP); H01L2924/01029 (EP);
H01L2924/01058 (EP); H01L2924/01068 (EP) (-)
C-Set:
H01L2224/37599, H01L2924/00014 (EP);
H01L2224/8384, H01L2924/00014 (EP);
H01L2224/8484, H01L2924/00014 (EP)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2008/33]
TitleGerman:Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu[2008/33]
English:Circuit arrangement with connecting device and corresponding production method[2009/22]
French:Circuit doté d'un dispositif de liaison et son procédé de fabrication[2009/22]
Former [2008/33]Switch device with connecting device and corresponding production method
Former [2008/33]Installation de commutation dotée d'un dispositif de liaison et son procédé de fabrication
Examination procedure30.05.2008Examination requested  [2008/33]
18.09.2008Despatch of a communication from the examining division (Time limit: M04)
15.01.2009Reply to a communication from the examining division
11.05.2009Communication of intention to grant the patent
27.05.2009Fee for grant paid
27.05.2009Fee for publishing/printing paid
Opposition(s)17.05.2010No opposition filed within time limit [2010/29]
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipCY12.08.2009
CZ12.08.2009
EE12.08.2009
HR12.08.2009
IE12.08.2009
LT12.08.2009
LV12.08.2009
MT12.08.2009
RO12.08.2009
SI12.08.2009
TR12.08.2009
BG12.11.2009
NO12.11.2009
GR13.11.2009
IS12.12.2009
LU19.01.2010
BE31.01.2010
MC31.01.2010
HU13.02.2010
[2012/47]
Former [2012/43]CY12.08.2009
CZ12.08.2009
EE12.08.2009
HR12.08.2009
IE12.08.2009
LT12.08.2009
LV12.08.2009
MT12.08.2009
RO12.08.2009
SI12.08.2009
BG12.11.2009
NO12.11.2009
GR13.11.2009
IS12.12.2009
LU19.01.2010
BE31.01.2010
MC31.01.2010
HU13.02.2010
Former [2012/42]CY12.08.2009
CZ12.08.2009
EE12.08.2009
HR12.08.2009
IE12.08.2009
LT12.08.2009
LV12.08.2009
MT12.08.2009
RO12.08.2009
SI12.08.2009
BG12.11.2009
NO12.11.2009
GR13.11.2009
IS12.12.2009
BE31.01.2010
MC31.01.2010
HU13.02.2010
Former [2012/37]CY12.08.2009
CZ12.08.2009
EE12.08.2009
HR12.08.2009
IE12.08.2009
LT12.08.2009
LV12.08.2009
MT12.08.2009
RO12.08.2009
SI12.08.2009
BG12.11.2009
NO12.11.2009
GR13.11.2009
IS12.12.2009
BE31.01.2010
MC31.01.2010
Former [2011/25]CZ12.08.2009
EE12.08.2009
HR12.08.2009
IE12.08.2009
LT12.08.2009
LV12.08.2009
MT12.08.2009
RO12.08.2009
SI12.08.2009
BG12.11.2009
NO12.11.2009
GR13.11.2009
IS12.12.2009
BE31.01.2010
MC31.01.2010
Former [2010/44]CZ12.08.2009
EE12.08.2009
HR12.08.2009
IE12.08.2009
LT12.08.2009
LV12.08.2009
RO12.08.2009
SI12.08.2009
BG12.11.2009
NO12.11.2009
IS12.12.2009
MC31.01.2010
Former [2010/28]CZ12.08.2009
EE12.08.2009
HR12.08.2009
IE12.08.2009
LT12.08.2009
LV12.08.2009
RO12.08.2009
SI12.08.2009
BG12.11.2009
NO12.11.2009
IS12.12.2009
Former [2010/19]HR12.08.2009
LT12.08.2009
LV12.08.2009
SI12.08.2009
BG12.11.2009
NO12.11.2009
IS12.12.2009
Documents cited:Search[Y]WO03030247  (SIEMENS AG [DE], et al) [Y] 6,7 * page 9, line 30 - page 13, line 20; figures 1,2 *;
 [XY]US2004227235  (HASHIMOTO NOBUAKI [JP]) [X] 1-5 * paragraph [0081] - paragraph [0099]; figure 1 * [Y] 6-10;
 [DY]DE102004019567  (SEMIKRON ELEKTRONIK GMBH [DE]) [DY] 8-10 * paragraph [0016] - paragraph [0022]; figure 4 *;
 [X]US2006103000  (KUROSAWA HIROFUMI [JP]) [X] 1-5* paragraph [0041] - paragraph [0064]; figures 1-8 *
by applicantDE3414065
 WO03030247
 US2004227235
 DE10355925
 DE102004019567
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.