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EP1970952
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EP About this file: EP1970952
| EP1970952 - Semiconductor device and manufacturing method thereof [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 01.02.2019 Database last updated on 31.08.2024 | |
| Former | Examination is in progress Status updated on 28.10.2018 | Most recent event Tooltip | 01.02.2019 | Application deemed to be withdrawn | published on 06.03.2019 [2019/10] | Applicant(s) | For all designated states Semiconductor Energy Laboratory Co., Ltd. 398 Hase Atsugi-shi, Kanagawa-ken 243-0036 / JP | [N/P] |
| Former [2008/38] | For all designated states SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 398 Hase Atsugi-shi, Kanagawa-ken 243-0036 / JP | Inventor(s) | 01 /
Tsurume, Takuya Semiconductor Energy Lab. Co., Ltd. 398, Hase Atsugi-shi Kanagawa-ken 243-0036 / JP | 02 /
Sugiyama, Eiji Semiconductor Energy Lab. Co., Ltd. 398, Hase Atsugi-shi Kanagawa-ken 243-0036 / JP | 03 /
Dozen, Yoshitaka Semiconductor Energy Lab. Co., Ltd. 398, Hase Atsugi-shi Kanagawa-ken 243-0036 / JP | 04 /
Ohtani, Hisashi Semiconductor Energy Lab. Co., Ltd. 398, Hase Atsugi-shi Kanagawa-ken 243-0036 / JP | [2008/38] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [N/P] |
| Former [2008/38] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Leopoldstrasse 4 80802 München / DE | Application number, filing date | 08003900.1 | 03.03.2008 | [2008/38] | Priority number, date | JP20070064052 | 13.03.2007 Original published format: JP 2007064052 | [2008/38] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1970952 | Date: | 17.09.2008 | Language: | EN | [2008/38] | Type: | A3 Search report | No.: | EP1970952 | Date: | 06.05.2009 | [2009/19] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.04.2009 | Classification | IPC: | H01L21/77 | [2008/38] | CPC: |
H01L27/1266 (EP,KR,US);
H01L23/145 (EP,US);
H01L23/49855 (EP,US);
H01L27/1248 (EP,US);
H01L27/13 (EP,US);
H01Q1/2225 (EP,US);
H01Q1/2283 (EP,US);
H10B69/00 (EP,US);
H10K19/00 (EP,KR);
H01L2223/6677 (EP,US);
H01L2224/16225 (EP,US);
H01L29/78603 (EP,US);
H01L2924/07811 (EP,US);
H01L2924/12032 (EP,US);
H01L2924/12044 (EP,US);
H01L2924/13091 (EP,US)
(-)
| C-Set: |
H01L2924/07811, H01L2924/00 (EP,US);
H01L2924/12032, H01L2924/00 (US,EP);
H01L2924/13091, H01L2924/00 (US,EP)
| Designated contracting states | DE, FI, FR, GB, NL [2010/02] |
| Former [2008/38] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiterbauelement und Herstellungsverfahren dafür | [2008/38] | English: | Semiconductor device and manufacturing method thereof | [2008/38] | French: | Dispositif de semi-conducteurs et son procédé de fabrication | [2008/38] | Examination procedure | 20.10.2009 | Examination requested [2009/49] | 07.11.2009 | Loss of particular rights, legal effect: designated state(s) | 20.11.2009 | Despatch of a communication from the examining division (Time limit: M04) | 14.12.2009 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NO, PL, PT, RO, SE, SI, SK, TR | 18.03.2010 | Reply to a communication from the examining division | 08.05.2015 | Despatch of a communication from the examining division (Time limit: M04) | 26.08.2015 | Reply to a communication from the examining division | 02.10.2018 | Application deemed to be withdrawn, date of legal effect [2019/10] | 29.10.2018 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2019/10] | Divisional application(s) | EP11005367.5 / EP2372756 | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 20.11.2009 | Fees paid | Renewal fee | 15.03.2010 | Renewal fee patent year 03 | 15.03.2011 | Renewal fee patent year 04 | 14.03.2012 | Renewal fee patent year 05 | 11.03.2013 | Renewal fee patent year 06 | 12.03.2014 | Renewal fee patent year 07 | 10.03.2015 | Renewal fee patent year 08 | 10.03.2016 | Renewal fee patent year 09 | 10.03.2017 | Renewal fee patent year 10 | Penalty fee | Additional fee for renewal fee | 31.03.2018 | 11 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]JPH077246 (KOBE STEEL LTD); | [YA]JPH1092980 (TOSHIBA CORP); | [YA]WO0101740 (ALLIED SIGNAL INC [US]); | [YA]EP1092739 (AJINOMOTO KK [JP]); | [XAY]WO2004001848 (BJORSELL STEN [IE]); | [XAY]EP1589797 (MATSUSHITA ELECTRIC IND CO LTD [JP]); | [YA]US2007020932 (MARUYAMA JUNYA [JP], et al) | by applicant | JP2004078991 | JP2007064052 |