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Extract from the Register of European Patents

EP About this file: EP2103712

EP2103712 - Ni-P layer system and process for its preparation [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  20.12.2019
Database last updated on 26.04.2025
FormerThe patent has been granted
Status updated on  11.01.2019
FormerGrant of patent is intended
Status updated on  07.11.2018
FormerExamination is in progress
Status updated on  28.04.2017
Most recent event   Tooltip16.07.2021Lapse of the patent in a contracting state
New state(s): HU		published on 18.08.2021  [2021/33]
Applicant(s)For all designated states
MKS IP Association
Erasmusstraße 20
10553 Berlin / DE
[N/P]
Former [2019/07]For all designated states
Atotech Deutschland GmbH
Erasmusstraße 20
10553 Berlin / DE
Former [2012/21]For all designated states
Atotech Deutschland GmbH
Erasmusstrasse 20
10553 Berlin / DE
Former [2009/39]For all designated states
ATOTECH Deutschland GmbH
Erasmusstraße 20
10553 Berlin / DE
Inventor(s)01 / Barthelmes, Jürgen
Scharnhorststrasse 16
10115 Berlin / DE
02 / Rüther, Robert
Havelkorso 102
16515 Oranienburg / DE
03 / Kurtz, Olaf
Witzlebenstrasse 12
14057 Berlin / DE
04 / Danker, Michael
Tannenweg 77
13587 Berlin / DE
 [2019/07]
Former [2014/20]01 / Barthelmes, Jürgen
Scharnhorststrasse 16
10115 Berlin / DE
02 / Rüther, Robert
Havellorso 102
16515 Oranienburg / DE
03 / Kurtz, Olaf
Witzlebenstrasse 12
14057 Berlin / DE
04 / Danker, Michael
Tannenweg 77
13587 Berlin / DE
Former [2014/16]01 / Barthelmes, Jürgen
Scharnhorstrasse 16
10115 Berlin / DE
02 / Rüther, Robert
Havellorso 102
16515 Oranienburg / DE
03 / Kurtz, Olaf
Witzlebenstrasse 12
14057 Berlin / DE
04 / Danker, Michael
Tannenweg 77
13587 Berlin / DE
Former [2011/32]01 / Barthelmes, Jürgen
Pfarrstrasse 94
10317 Berlin / DE
02 / Rüther, Robert
Havellorso 102
16515 Oranienburg / DE
03 / Kurtz, Olaf
Witzlebenstrasse 12
14057 Berlin / DE
04 / Danker, Michael
Tannenweg 77
13587 Berlin / DE
Former [2009/39]01 / Barthelmes, Jürgen
Pfarrstrasse 94
10317 Berlin / DE
02 / Rüther, Robert
Havellorso 102
16515 Oranienburg / DE
03 / Kurtz, Olaf
Kantstrasse 92
10627 Berlin / DE
04 / Danker, Michael
Tannenweg 77
13587 Berlin / DE
Representative(s)(deleted)
[2019/07]
Former [2014/38]Adam, Holger, et al
Kraus & Weisert
Patentanwälte PartGmbB
Thomas-Wimmer-Ring 15
80539 München / DE
Former [2009/39]Albrecht, Thomas, et al
Kraus & Weisert Patent- und Rechtsanwälte Thomas-Wimmer-Ring 15
80539 München / DE
Application number, filing date08005350.720.03.2008
[2009/39]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2103712
Date:23.09.2009
Language:EN
[2009/39]
Type: B1 Patent specification 
No.:EP2103712
Date:13.02.2019
Language:EN
[2019/07]
Search report(s)(Supplementary) European search report - dispatched on:EP10.09.2008
ClassificationIPC:C25D3/48, C25D3/56, C25F3/16, C23C28/02, C23C18/44, C25D5/14
[2018/47]
CPC:
C23C18/44 (EP,US); C25D5/14 (EP,KR,US); C23C28/021 (EP,US);
C23C28/023 (EP,US); C25D5/34 (KR); C25D5/48 (KR);
C25D5/623 (EP,KR,US); C25D5/627 (EP,KR,US); C25D7/00 (KR);
C25F3/16 (EP,KR,US); C25D3/48 (EP,KR,US); C25D3/562 (EP,KR,US) (-)
Former IPC [2009/39]C23C18/44, C25D5/14
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2019/07]
Former [2009/39]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Ni-P-Schichtsystem und Zubereitungsverfahren[2009/39]
English:Ni-P layer system and process for its preparation[2009/39]
French:Système de couche Ni-P et son processus de préparation[2009/39]
Examination procedure07.01.2009Amendment by applicant (claims and/or description)
09.09.2009Examination requested  [2009/43]
13.03.2014Observations by third parties
23.07.2014Despatch of a communication from the examining division (Time limit: M04)
22.10.2014Reply to a communication from the examining division
20.04.2017Despatch of a communication from the examining division (Time limit: M04)
07.08.2017Reply to a communication from the examining division
08.11.2018Communication of intention to grant the patent
18.12.2018Fee for grant paid
18.12.2018Fee for publishing/printing paid
18.12.2018Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  23.07.2014
Opposition(s)14.11.2019No opposition filed within time limit [2020/04]
Fees paidRenewal fee
26.03.2010Renewal fee patent year 03
24.03.2011Renewal fee patent year 04
23.03.2012Renewal fee patent year 05
26.03.2013Renewal fee patent year 06
21.03.2014Renewal fee patent year 07
24.03.2015Renewal fee patent year 08
25.03.2016Renewal fee patent year 09
24.03.2017Renewal fee patent year 10
23.03.2018Renewal fee patent year 11
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU20.03.2008
CY13.02.2019
CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SI13.02.2019
SK13.02.2019
TR13.02.2019
IE20.03.2019
LU20.03.2019
MT20.03.2019
BE31.03.2019
CH31.03.2019
LI31.03.2019
BG13.05.2019
GB13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
[2021/33]
Former [2021/26]CY13.02.2019
CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SI13.02.2019
SK13.02.2019
TR13.02.2019
IE20.03.2019
LU20.03.2019
MT20.03.2019
BE31.03.2019
CH31.03.2019
LI31.03.2019
BG13.05.2019
GB13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2020/29]CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SI13.02.2019
SK13.02.2019
TR13.02.2019
IE20.03.2019
LU20.03.2019
MT20.03.2019
BE31.03.2019
CH31.03.2019
LI31.03.2019
BG13.05.2019
GB13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2020/24]CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SI13.02.2019
SK13.02.2019
TR13.02.2019
IE20.03.2019
LU20.03.2019
BE31.03.2019
CH31.03.2019
LI31.03.2019
BG13.05.2019
GB13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2020/17]CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SI13.02.2019
SK13.02.2019
TR13.02.2019
IE20.03.2019
LU20.03.2019
BE31.03.2019
CH31.03.2019
LI31.03.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2020/11]CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SI13.02.2019
SK13.02.2019
IE20.03.2019
LU20.03.2019
BE31.03.2019
CH31.03.2019
LI31.03.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2020/09]CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SK13.02.2019
IE20.03.2019
LU20.03.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2020/01]CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
MC13.02.2019
NL13.02.2019
PL13.02.2019
RO13.02.2019
SE13.02.2019
SK13.02.2019
LU20.03.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2019/49]CZ13.02.2019
DK13.02.2019
EE13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
NL13.02.2019
RO13.02.2019
SE13.02.2019
SK13.02.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2019/48]DK13.02.2019
ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
NL13.02.2019
SE13.02.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2019/47]ES13.02.2019
FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
NL13.02.2019
SE13.02.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2019/39]FI13.02.2019
HR13.02.2019
LT13.02.2019
LV13.02.2019
NL13.02.2019
SE13.02.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
IS13.06.2019
PT13.06.2019
Former [2019/38]FI13.02.2019
LT13.02.2019
NL13.02.2019
SE13.02.2019
BG13.05.2019
NO13.05.2019
GR14.05.2019
PT13.06.2019
Former [2019/37]FI13.02.2019
LT13.02.2019
NL13.02.2019
SE13.02.2019
NO13.05.2019
GR14.05.2019
PT13.06.2019
Former [2019/34]FI13.02.2019
LT13.02.2019
NL13.02.2019
SE13.02.2019
NO13.05.2019
PT13.06.2019
Former [2019/33]FI13.02.2019
LT13.02.2019
NO13.05.2019
PT13.06.2019
Documents cited:Search[XA]EP0410472  (YAZAKI CORP [JP]) [X] 1-8,13-16 * the whole document * [A] 9-12;
 [XA]US2005048309  (HAKETA NAOKI [JP]) [X] 1-8,13-18 * the whole document *[A] 9-12;
 [XA]US2007052105  (LAU DANNY [HK], et al) [X] 1-8,13-16 * the whole document * [A] 9-12
by applicant   - W. GOTZ; T. HEINISCH; K. LEYENDECKER, GALVANOTECHNIK, (2003), vol. 9, pages 2130 - 2140
    - SCHLESINGER; PAUNOVIC, Modern Electroplating, JOHN WILEY & SONS, INC., (2000), page 147
 EP20070013447
otherWO9207975
    - ONO I. ET AL., "PRETREATMENT OF COPPER AND COPPER ALLOYS SUBSTRATE FOR ELECTROPLATING OF THIN PERMALLOY FILM", JOURNAL OF THE METAL FINISHING SOCIETY OF JAPAN, (1973), vol. 24, no. 8, pages 461 - 465, XP055183684

DOI:   http://dx.doi.org/10.4139/sfj1950.24.461
    - DAVIS R.L., "WHAT IS ELECTROPOLISHING?", TECHPLATE WEBSITE, (20050518), pages 1 - 17, URL: HTTP://TECHPLATE.COM/ELECTROPOLISH.HTM, (20130114), XP003033199
    - GHEBREGZIABHER K.T., "CHEMICAL MONITORING AND WASTE MINIMISATION AUDIT IN THE ELECTROPLATING INDUSTRY", MASTER THESIS UNIVERSITY OF KWAZULU-NATAL, PIETERMARITZBURG, (200406), pages I - XIV, 1-5, XP003033200
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.