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EP2075830
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EP About this file: EP2075830
| EP2075830 - Method for producing bonded wafer [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 18.02.2011 Database last updated on 31.08.2024 | Most recent event Tooltip | 18.02.2011 | Withdrawal of application | published on 23.03.2011 [2011/12] | Applicant(s) | For all designated states SUMCO CORPORATION 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP | [2009/27] | Inventor(s) | 01 /
Nishihata, Hideki c/o SUMCO CORPORATION 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP | 02 /
Ono, Isoroku c/o SUMCO CORPORATION 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP | 03 /
Endo, Akihiko c/o SUMCO CORPORATION 2-1, Shibaura 1-chome Minato-ku Tokyo 105-8634 / JP | [2009/27] | Representative(s) | Röthinger, Rainer Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstrasse 2 81541 München / DE | [N/P] |
| Former [2009/27] | Röthinger, Rainer Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2 81541 München / DE | Application number, filing date | 08016983.2 | 26.09.2008 | [2009/27] | Priority number, date | JP20070265133 | 11.10.2007 Original published format: JP 2007265133 | JP20080226648 | 04.09.2008 Original published format: JP 2008226648 | [2009/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2075830 | Date: | 01.07.2009 | Language: | EN | [2009/27] | Type: | A3 Search report | No.: | EP2075830 | Date: | 19.01.2011 | [2011/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 21.12.2010 | Classification | IPC: | H01L21/762 | [2009/27] | CPC: |
H01L21/20 (KR);
H01L21/76256 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2009/27] | Extension states | AL | Not yet paid | BA | Not yet paid | MK | Not yet paid | RS | Not yet paid | Title | German: | Verfahren zur Herstellung eines gebundenen Wafers | [2009/27] | English: | Method for producing bonded wafer | [2009/27] | French: | Procédé de production de plaquette fixée | [2009/27] | Examination procedure | 26.09.2008 | Examination requested [2009/27] | 09.02.2011 | Application withdrawn by applicant [2011/12] | Fees paid | Renewal fee | 16.09.2010 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [I]EP1710836 (SUMCO CORP [JP]) [I] 1-4 * paragraph [0037] - paragraph [0052]; figure 1 *; | [A]EP0964436 (SHINETSU HANDOTAI KK [JP]) [A] 2 * paragraph [0027]; figure 1d * | by applicant | JPH05291543 | JP2008016534 |