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Extract from the Register of European Patents

EP About this file: EP2065490

EP2065490 - GaN substrate manufacturing method, GaN substrate, and semiconductor device [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  04.02.2011
Database last updated on 31.08.2024
Most recent event   Tooltip04.02.2011Withdrawal of applicationpublished on 09.03.2011  [2011/10]
Applicant(s)For all designated states
Sumitomo Electric Industries, Ltd.
5-33 Kitahama 4-chome, Chuo-ku
Osaka-shi, Osaka 541-0041 / JP
[2009/23]
Inventor(s)01 / Irikura, Masato
c/o Itami Works of Sumitomo Electric Industries, Ltd. 1-1 Koyakita 1-chome
Itami-shi Hyogo 664-0016 / JP
02 / Nakahata, Seiji
c/o Itami Works of Sumitomo Electric Industries, Ltd. 1-1 Koyakita 1-chome
Itami-shi Hyogo 664-0016 / JP
 [2009/23]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstrasse 4
80802 München / DE
[N/P]
Former [2009/23]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Leopoldstrasse 4
80802 München / DE
Application number, filing date08020043.917.11.2008
[2009/23]
Priority number, dateJP2007030089920.11.2007         Original published format: JP 2007300899
[2009/23]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP2065490
Date:03.06.2009
Language:EN
[2009/23]
Search report(s)(Supplementary) European search report - dispatched on:EP09.04.2009
ClassificationIPC:C30B29/40, H01L29/06, H01L21/302
[2009/23]
CPC:
H01L29/045 (EP,US); H01L21/302 (KR); B82Y20/00 (EP,US);
C30B29/406 (EP,US); H01L21/304 (KR); H01L29/0657 (EP,US);
H01L29/2003 (EP,US); H01L29/66712 (EP,US); H01L29/7787 (EP,US);
H01L29/7802 (EP,US); H01L29/872 (EP,US); H01L33/16 (EP,US);
H01L33/20 (EP,US); H01L33/32 (EP,US); H01S5/22 (EP,US);
H01S5/34333 (EP,US) (-)
Designated contracting statesDE,   FR,   GB [2010/06]
Former [2009/23]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Herstellungsverfahren für ein GaN-Substrat, GaN-Substrat und Halbleitervorrichtung[2009/23]
English:GaN substrate manufacturing method, GaN substrate, and semiconductor device[2009/23]
French:Procédé de fabrication d'un substrat de GaN, substrat de GaN, et dispositif semi-conducteur[2009/23]
Examination procedure27.10.2009Amendment by applicant (claims and/or description)
28.10.2009Examination requested  [2009/50]
04.12.2009Loss of particular rights, legal effect: designated state(s)
12.01.2010Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR
04.10.2010Application withdrawn by applicant  [2011/10]
Fees paidPenalty fee
Additional fee for renewal fee
30.11.201003   M06   Not yet paid
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Documents cited:Search[X]US2007085163  (LEE CHANG H [KR], et al) [X] 1-8 * paragraphs [0008] , [0032]; figure 4; example 1; claim 9; table 1 *;
 [X]EP1475826  (SUMITOMO ELECTRIC INDUSTRIES [JP], et al) [X] 1-8 * paragraphs [0024] - [0034]; figures 5,6 *;
 [A]  - CAO Y G ET AL, "Observation of a quantum-confinement effect with GaN nanoparticles synthesized through a new gas reaction route", APPLIED PHYSICS A (MATERIALS SCIENCE PROCESSING), SPRINGER-VERLAG [DE], (200008), vol. A71, no. 2, ISSN 0947-8396, pages 229 - 231, XP002521498 [A] 1-8 * page 230 *

DOI:   http://dx.doi.org/10.1007/S003390000560
by applicantJP2000022212
 WO0022212
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.