| EP2020688 - Solar cell interconnection using thermo-compression bonding and correspondingly fabricated module [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.10.2014 Database last updated on 18.03.2026 | Most recent event Tooltip | 15.07.2016 | Lapse of the patent in a contracting state New state(s): TR | published on 17.08.2016 [2016/33] | Applicant(s) | For all designated states Sanyo Electric Co., Ltd. 5-5 Keihan-Hondori 2-chome Moriguchi-shi Osaka 570-8677 / JP | [2009/06] | Inventor(s) | 01 /
Saita, Atsushi c/o Sanyo Electric Co., Ltd. 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | 02 /
Yoshimine, Yukihiro c/o Sanyo Electric Co., Ltd. 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | 03 /
Okamoto, Shigeyuki c/o Sanyo Electric Co., Ltd. 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | 04 /
Tsunomura, Yasufumi c/o Sanyo Electric Co., Ltd. 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | 05 /
Taira, Shigeharu c/o Sanyo Electric Co., Ltd. 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | 06 /
Kanno, Hiroshi c/o Sanyo Electric Co., Ltd. 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | 07 /
Hashimoto, Haruhisa c/o Sanyo Electric Co., Ltd. 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | [2013/48] |
| Former [2009/06] | 01 /
Saita, Atsushi c/o Sanyo Electric Co., Ltd., 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | ||
| 02 /
Yoshimine, Yukihiro c/o Sanyo Electric Co., Ltd., 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | |||
| 03 /
Okamoto, Shigeyuki c/o Sanyo Electric Co., Ltd., 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | |||
| 04 /
Tsunomura, Yasufumi c/o Sanyo Electric Co., Ltd., 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | |||
| 05 /
Taira, Shigeharu c/o Sanyo Electric Co., Ltd., 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | |||
| 06 /
Kanno, Hiroshi c/o Sanyo Electric Co., Ltd., 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | |||
| 07 /
Hashimoto, Haruhisa c/o Sanyo Electric Co., Ltd., 5-5, Keihan-Hondori 2-chome Moriguchi-shi, Osaka 570-8677 / JP | Representative(s) | Calderbank, Thomas Roger, et al Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE / GB | [N/P] |
| Former [2013/48] | Calderbank, Thomas Roger, et al Mewburn Ellis LLP 33 Gutter Lane London EC2V 8AS / GB | ||
| Former [2009/06] | Calderbank, Thomas Roger, et al Mewburn Ellis LLP 33 Gutter Lane London EC2V 8AS / GB | Application number, filing date | 08252624.5 | 01.08.2008 | [2009/06] | Priority number, date | JP20070202265 | 02.08.2007 Original published format: JP 2007202265 | JP20070341070 | 28.12.2007 Original published format: JP 2007341070 | [2009/06] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP2020688 | Date: | 04.02.2009 | Language: | EN | [2009/06] | Type: | A3 Search report | No.: | EP2020688 | Date: | 26.10.2011 | Language: | EN | [2011/43] | Type: | B1 Patent specification | No.: | EP2020688 | Date: | 27.11.2013 | Language: | EN | [2013/48] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.09.2011 | Classification | IPC: | H01L31/0224, H01L31/18, H01L31/0747 | [2013/08] | CPC: |
H10F77/211 (EP,US);
H10F10/166 (EP,US);
H10F19/904 (EP,US);
H10F71/137 (EP,US);
Y02E10/50 (EP,US);
Y02P70/50 (EP,US);
Y10T156/10 (EP,US)
(-)
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| Former IPC [2009/06] | H01L31/0224, H01L31/18 | Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, NO, PL, PT, RO, SE, SI, SK, TR [2009/06] | Title | German: | Verbindungsverfahren für Solarzellen mittels Thermokompressions-Verbindung und entsprechende Solarmodule | [2009/06] | English: | Solar cell interconnection using thermo-compression bonding and correspondingly fabricated module | [2009/06] | French: | Connection entre cellules solaires dans un module utilisant le bonding par thermo-compression et un tel module | [2009/06] | Examination procedure | 25.04.2012 | Amendment by applicant (claims and/or description) | 25.04.2012 | Examination requested [2012/28] | 17.09.2012 | Despatch of a communication from the examining division (Time limit: M04) | 19.12.2012 | Reply to a communication from the examining division | 04.02.2013 | Communication of intention to grant the patent | 30.05.2013 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 11.07.2013 | Communication of intention to grant the patent | 11.10.2013 | Fee for grant paid | 11.10.2013 | Fee for publishing/printing paid | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 17.09.2012 | Opposition(s) | 28.08.2014 | No opposition filed within time limit [2014/45] | Fees paid | Renewal fee | 20.08.2010 | Renewal fee patent year 03 | 22.08.2011 | Renewal fee patent year 04 | 20.08.2012 | Renewal fee patent year 05 | 20.08.2013 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 01.08.2008 | AT | 27.11.2013 | BE | 27.11.2013 | BG | 27.11.2013 | CY | 27.11.2013 | CZ | 27.11.2013 | DK | 27.11.2013 | EE | 27.11.2013 | FI | 27.11.2013 | HR | 27.11.2013 | LT | 27.11.2013 | LV | 27.11.2013 | MC | 27.11.2013 | MT | 27.11.2013 | NL | 27.11.2013 | PL | 27.11.2013 | RO | 27.11.2013 | SE | 27.11.2013 | SI | 27.11.2013 | SK | 27.11.2013 | TR | 27.11.2013 | NO | 27.02.2014 | GR | 28.02.2014 | IS | 27.03.2014 | PT | 27.03.2014 | GB | 01.08.2014 | IE | 01.08.2014 | LU | 01.08.2014 | [2016/33] |
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| NO | 27.02.2014 | Documents cited: | Search | [Y] JPH1121660 (HITACHI CABLE et al.) | [Y] US5084107 (DEGUCHI MIKIO et al.) | [Y] EP0995784 (NIPPON ZEON CO et al.) [Y] 1-7 * paragraph [0001] - paragraph [0016]; figure -; claim - * | [Y] US2002139415 (SHIMIZU KOICHI et al.) [Y] 1-7 * column 1 - column 8; figures 3a,3b * | [Y] JP2000261012 (MITSUBISHI ELECTRIC CORP et al.) [Y] 1,2,5,6 * paragraph [0070] - paragraph [0081]; figure 1 * | [A] US2004200522 (FUKAWA YUKO et al.) [A] 1,2,5,6 * paragraph [0025] - paragraph [0088]; figure - * | by applicant | JP2007202265 | JP2005101519 |