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Extract from the Register of European Patents

EP About this file: EP2143537

EP2143537 - Method and device for breaking semiconductor discs or similar substrates [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  14.12.2012
Database last updated on 26.04.2025
Most recent event   Tooltip30.05.2014Lapse of the patent in a contracting state
New state(s): LU, SM		published on 02.07.2014  [2014/27]
Applicant(s)For all designated states
Asys Automatisierungssysteme GmbH
Benzstrasse 10
89160 Dornstadt / DE
[2010/42]
Former [2010/02]For all designated states
Dyntest Technologies GmbH
Bahnhofstrasse 110
83224 Grassau / DE
Inventor(s)01 / Lindner, Jörg
Ringstrasse 38
83224 Grassau / DE
 [2010/02]
Representative(s)Gleiss & Grosse
Patentanwälte Rechtsanwälte
Leitzstrasse 45
70469 Stuttgart / DE
[N/P]
Former [2012/06]Gleiss & Grosse
Patentanwälte Rechtsanwälte Leitzstrasse 45
70469 Stuttgart / DE
Former [2010/33]Gleiss & Grosse
Patentanwälte Rechtsanwälte Leitzstrasse 45
70469 Stuttgart / DE
Former [2010/02]Dosterschill, Peter
Patentanwalt, Fichtenstrasse 11 A
85570 Ottenhofen / DE
Application number, filing date09008877.407.07.2009
[2010/02]
Priority number, dateDE2008103161907.07.2008         Original published format: DE102008031619
[2010/02]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report 
No.:EP2143537
Date:13.01.2010
Language:DE
[2010/02]
Type: B1 Patent specification 
No.:EP2143537
Date:08.02.2012
Language:DE
[2012/06]
Search report(s)(Supplementary) European search report - dispatched on:EP28.10.2009
ClassificationIPC:B28D5/00, H01L21/00
[2010/02]
CPC:
B28D5/0017 (EP); B28D5/0064 (EP); H01L21/67092 (EP);
H01L21/67253 (EP)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2010/02]
TitleGerman:Verfahren und Vorrichtung zum Brechen von Halbleiterscheiben oder ähnlichen Substraten[2010/02]
English:Method and device for breaking semiconductor discs or similar substrates[2010/02]
French:Procédé et dispositif de rupture de plaques semi-conductrices ou de substrats analogues[2010/02]
Examination procedure03.07.2010Examination requested  [2010/33]
21.09.2011Communication of intention to grant the patent
16.12.2011Fee for grant paid
16.12.2011Fee for publishing/printing paid
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  21.09.2011
Opposition(s)09.11.2012No opposition filed within time limit [2013/03]
Fees paidRenewal fee
10.06.2011Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipCY08.02.2012
DK08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
MK08.02.2012
MT08.02.2012
SE08.02.2012
SI08.02.2012
SM08.02.2012
TR08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
LU07.07.2012
BE31.07.2012
MC31.07.2012
[2014/27]
Former [2014/21]CY08.02.2012
DK08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
MK08.02.2012
MT08.02.2012
SE08.02.2012
SI08.02.2012
TR08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
BE31.07.2012
MC31.07.2012
Former [2013/35]CY08.02.2012
DK08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
MK08.02.2012
MT08.02.2012
SE08.02.2012
SI08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
BE31.07.2012
MC31.07.2012
Former [2013/24]CY08.02.2012
DK08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
MK08.02.2012
SE08.02.2012
SI08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
BE31.07.2012
MC31.07.2012
Former [2013/12]CY08.02.2012
DK08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
MK08.02.2012
SE08.02.2012
SI08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
MC31.07.2012
Former [2013/11]CY08.02.2012
DK08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
SE08.02.2012
SI08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
MC31.07.2012
Former [2012/49]CY08.02.2012
DK08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
SE08.02.2012
SI08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
Former [2012/48]CY08.02.2012
EE08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
SE08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
Former [2012/47]CY08.02.2012
FI08.02.2012
HR08.02.2012
IE08.02.2012
LT08.02.2012
LV08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
Former [2012/41]CY08.02.2012
FI08.02.2012
HR08.02.2012
LT08.02.2012
LV08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
Former [2012/39]FI08.02.2012
HR08.02.2012
LT08.02.2012
LV08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
Former [2012/37]FI08.02.2012
HR08.02.2012
LT08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
PT08.06.2012
Former [2012/36]HR08.02.2012
LT08.02.2012
NO08.05.2012
GR09.05.2012
IS08.06.2012
Former [2012/34]LT08.02.2012
NO08.05.2012
IS08.06.2012
Documents cited:Search[A]JPS6134955  (TEIKOKU SEIKI KK) [A] * abstract *;
 [DA]WO9519247  (DYNATEX INTERNATIONAL INC [US]) [DA] 1,8 * abstract *
by applicantEP0740598
 WO2007112983
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