EP2131635 - Flex circuit having one or more active electrodes and method for manufacturing it using flex circuit technology [Right-click to bookmark this link] | |||
Former [2009/50] | Active electrode and method for manufacturing it using flex circuit technology | ||
[2010/52] | Status | The application is deemed to be withdrawn Status updated on 14.09.2012 Database last updated on 02.11.2024 | Most recent event Tooltip | 14.09.2012 | Application deemed to be withdrawn | published on 17.10.2012 [2012/42] | Applicant(s) | For all designated states Edwards Lifesciences Corporation One Edwards Way Irvine, CA 92614 / US | [2009/50] | Inventor(s) | 01 /
Curry, Kenneth M. 5088 Nighthawk Way Oceanside CA 92056 / US | [2009/50] | Representative(s) | Müller-Boré & Partner Patentanwälte PartG mbB Friedenheimer Brücke 21 80639 München / DE | [N/P] |
Former [2009/50] | Müller-Boré & Partner Patentanwälte Grafinger Strasse 2 81671 München / DE | Application number, filing date | 09011820.9 | 22.02.2007 | [2009/50] | Priority number, date | US20060777135P | 27.02.2006 Original published format: US 777135 P | [2009/50] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2131635 | Date: | 09.12.2009 | Language: | EN | [2009/50] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 10.11.2009 | Classification | IPC: | H05K1/11 | [2009/50] | CPC: |
H05K3/247 (EP,US);
A61B5/1486 (EP,US);
A61B2562/125 (EP,US);
A61N1/05 (EP,US);
G01N27/3271 (EP,US);
H01L2924/0002 (EP,US);
H05K1/118 (EP,US);
H05K2201/035 (EP,US);
H05K2201/09436 (EP,US);
H05K2203/0574 (EP,US);
H05K3/28 (EP,US);
H05K3/4664 (EP,US);
Y10T29/4916 (EP,US)
(-)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR [2009/50] | Title | German: | Flexible Leiterplatte umfassend eine oder mehrere aktive Elektroden und Verfahren um diese herzustellen mittels der flexiblen Leiterplatten Technologie | [2010/52] | English: | Flex circuit having one or more active electrodes and method for manufacturing it using flex circuit technology | [2010/52] | French: | Circuit flexible comprenant une ou plusieurs électrodes actives et procédé pour le fabriquer au moyen de la technologie des circuit imprimés souples | [2010/52] |
Former [2009/50] | Aktive Elektrode und Verfahren um diese herzustellen mittels der flexiblen Leiterplatten Technologie | ||
Former [2009/50] | Active electrode and method for manufacturing it using flex circuit technology | ||
Former [2009/50] | Electrode active et procédé pour la fabriquer au moyen de la technologie des circuit imprimés souples | Examination procedure | 31.03.2010 | Examination requested [2010/20] | 05.05.2010 | Despatch of a communication from the examining division (Time limit: M06) | 08.11.2010 | Reply to a communication from the examining division | 15.12.2011 | Communication of intention to grant the patent | 26.04.2012 | Application deemed to be withdrawn, date of legal effect [2012/42] | 04.06.2012 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2012/42] | Parent application(s) Tooltip | EP07751245.7 / EP1989930 | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP20070751245) is 01.07.2009 | Fees paid | Renewal fee | 24.09.2009 | Renewal fee patent year 03 | 24.02.2010 | Renewal fee patent year 04 | 23.02.2011 | Renewal fee patent year 05 | 24.02.2012 | Renewal fee patent year 06 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0351851 (MICROELECTRONICS & COMPUTER [US]) [A] 1-15* column 5, line 34 - line 53 *; | [A]US5914179 (INABA MASAICHI [JP]) [A] 1-15 * column 3, line 11 - line 51; figures 1a-1e *; | [A]WO02102224 (GIVEN IMAGING LTD [IL], et al) [A] 1-15 * the whole document *; | [A]US2004183213 (HSU CHI-HSING [TW], et al) [A] 1-15 * paragraphs [0020] , [0021]; figure 2 * |