EP2145716 - Welding method and welding structure of conductive terminals [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 12.06.2015 Database last updated on 06.11.2024 | Most recent event Tooltip | 12.06.2015 | Application deemed to be withdrawn | published on 15.07.2015 [2015/29] | Applicant(s) | For all designated states OMRON Automotive Electronics Co., Ltd. 6368, Nenjozaka, Okusa Komaki, Aichi 485-0802 / JP | [2010/37] |
Former [2010/03] | For all designated states OMRON CORPORATION 801, Minamifudodo-cho, Horikawahigashiiru, Shiokoji-dori, Shimogoyo-ku Kyoto-shi, Kyoto 600-8530 / JP | Inventor(s) | 01 /
Yasuda, Takeshi c/o Omron Corporation 801, Minamifudodo-cho Horikawahigashiiru Kyoto-shi Kyoto 600-8530 / JP | 02 /
Nishioka, Akihiko c/o Omron Corporation 801, Minamifudodo-cho Horikawahigashiiru Kyoto-shi Kyoto 600-8530 / JP | [2010/03] | Representative(s) | Kilian Kilian & Partner mbB Zielstattstraße 23a 81379 München / DE | [N/P] |
Former [2013/09] | Kilian Kilian & Partner Aidenbachstraße 54 81379 München / DE | ||
Former [2010/03] | Wilhelms · Kilian & Partner Patentanwälte Eduard-Schmid-Straße 2 81541 München / DE | Application number, filing date | 09165431.9 | 14.07.2009 | [2010/03] | Priority number, date | JP20080185514 | 17.07.2008 Original published format: JP 2008185514 | [2010/03] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP2145716 | Date: | 20.01.2010 | Language: | EN | [2010/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.11.2009 | Classification | IPC: | B23K11/00 | [2010/03] | CPC: |
B23K11/004 (EP,US);
B23K11/0026 (EP,US);
B23K2101/38 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR [2010/03] | Extension states | AL | Not yet paid | BA | Not yet paid | RS | Not yet paid | Title | German: | Schweißverfahren und Schweißstruktur für leitfähige Anschlüsse | [2010/03] | English: | Welding method and welding structure of conductive terminals | [2010/03] | French: | Procédé de soudage et structure de soudage de bornes conductrices | [2010/03] | Examination procedure | 19.07.2010 | Examination requested [2010/35] | 16.08.2010 | Amendment by applicant (claims and/or description) | 25.07.2012 | Communication of intention to grant the patent | 08.08.2012 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 03.09.2012 | Communication of intention to grant the patent | 04.02.2013 | Despatch of a communication from the examining division (Time limit: M02) | 12.04.2013 | Reply to a communication from the examining division | 03.02.2015 | Application deemed to be withdrawn, date of legal effect [2015/29] | 27.02.2015 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2015/29] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 25.07.2012 | Fees paid | Renewal fee | 28.07.2011 | Renewal fee patent year 03 | 31.07.2012 | Renewal fee patent year 04 | 31.07.2013 | Renewal fee patent year 05 | Penalty fee | Additional fee for renewal fee | 31.07.2014 | 06   M06   Not yet paid |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XDI]JPH05283139 (YAZAKI CORP) [XD] 1,7 * abstract * [I] 2-6; | [A]US3315199 (KOCH ROBERT E, et al) [A] 1-7 * the whole document *; | [A]EP1453190 (DENSO CORP [JP]) [A] 1-7 * the whole document *; | [AD]JPH02132783 (TOSHIBA CORP) [AD] 1-7 * abstract * | by applicant | JP2747506B | JP2666988B |