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Extract from the Register of European Patents

EP About this file: EP2263259

EP2263259 - METHOD FOR FORMING A CAPACITOR WITH HIGH ASPECT RATIO OPENINGS [Right-click to bookmark this link]
Former [2010/51]HIGH ASPECT RATIO OPENINGS
[2017/02]
StatusNo opposition filed within time limit
Status updated on  23.02.2018
Database last updated on 07.10.2024
FormerThe patent has been granted
Status updated on  17.03.2017
FormerGrant of patent is intended
Status updated on  18.12.2016
Most recent event   Tooltip26.06.2020Lapse of the patent in a contracting state
New state(s): CY, MK		published on 29.07.2020  [2020/31]
Applicant(s)For all designated states
Micron Technology, Inc.
8000 South Federal Way
Boise, ID 83716-9632 / US
[2010/51]
Inventor(s)01 / KIEHLBAUCH, Mark, W.
2002 E Goodman Court
Boise ID 83712 / US
 [2010/51]
Representative(s)Beresford, Keith Denis Lewis, et al
Beresford Crump LLP
16 High Holborn
London WC1V 6BX / GB
[2017/16]
Former [2014/26]Beresford, Keith Denis Lewis, et al
Beresford & Co. 16 High Holborn London
WC1V 6BX / GB
Former [2014/25]Field, Howard John
BERESFORD & Co. 16 High Holborn
London WC1V 6BX / GB
Former [2010/51]Dlugosz, Anthony Charles, et al
Beresford & Co 16 High Holborn
London WC1V 6BX / GB
Application number, filing date09731041.118.03.2009
[2010/51]
WO2009US01693
Priority number, dateUS2008009957708.04.2008         Original published format: US 99577
[2010/51]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO2009126204
Date:15.10.2009
Language:EN
[2009/42]
Type: A2 Application without search report 
No.:EP2263259
Date:22.12.2010
Language:EN
The application published by WIPO in one of the EPO official languages on 15.10.2009 takes the place of the publication of the European patent application.
[2010/51]
Type: B1 Patent specification 
No.:EP2263259
Date:19.04.2017
Language:EN
[2017/16]
Search report(s)International search report - published on:KR30.12.2009
(Supplementary) European search report - dispatched on:EP04.05.2015
ClassificationIPC:H01L27/108, H01L21/8242, H01L27/04, H01L21/3065, H01G4/33, H01G4/012, H01L49/02
[2015/23]
CPC:
H01G4/33 (EP,US); H01G4/08 (US); H01G4/012 (EP,US);
H01L28/90 (EP,US); H10B12/033 (EP,US); H10B12/09 (EP,US);
H10B12/318 (EP,US); Y10T29/43 (EP,US) (-)
Former IPC [2010/51]H01L27/108, H01L21/8242, H01L27/04, H01L21/3065
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2017/16]
Former [2010/51]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:HERSTELLUNGSVERFAHREN FÜR EINEN KONDENSATOR MIT ÖFFNUNGEN MIT HOHEM ASPEKTVERHÄLTNIS[2017/02]
English:METHOD FOR FORMING A CAPACITOR WITH HIGH ASPECT RATIO OPENINGS[2017/02]
French:PROCÉDÉ POUR LA FABRICATION D'UN CONDENSATEUR AYANT DES OUVERTURES DE RAPPORT LARGEUR/LONGUEUR ELEVE[2017/02]
Former [2010/51]ÖFFNUNGEN MIT HOHEM ASPEKTVERHÄLTNIS
Former [2010/51]HIGH ASPECT RATIO OPENINGS
Former [2010/51]OUVERTURES DE RAPPORT LARGEUR/LONGUEUR ELEVE
Entry into regional phase30.09.2010National basic fee paid 
30.09.2010Search fee paid 
30.09.2010Designation fee(s) paid 
30.09.2010Examination fee paid 
Examination procedure30.09.2010Examination requested  [2010/51]
30.11.2015Amendment by applicant (claims and/or description)
19.12.2016Communication of intention to grant the patent
20.02.2017Fee for grant paid
20.02.2017Fee for publishing/printing paid
20.02.2017Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  19.12.2016
Opposition(s)22.01.2018No opposition filed within time limit [2018/13]
Fees paidRenewal fee
15.03.2011Renewal fee patent year 03
14.03.2012Renewal fee patent year 04
11.03.2013Renewal fee patent year 05
12.03.2014Renewal fee patent year 06
10.03.2015Renewal fee patent year 07
10.03.2016Renewal fee patent year 08
10.03.2017Renewal fee patent year 09
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU18.03.2009
AT19.04.2017
CY19.04.2017
CZ19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
IT19.04.2017
LT19.04.2017
LV19.04.2017
MC19.04.2017
MK19.04.2017
NL19.04.2017
PL19.04.2017
PT19.04.2017
RO19.04.2017
SE19.04.2017
SI19.04.2017
SK19.04.2017
TR19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
[2020/31]
Former [2020/27]HU18.03.2009
AT19.04.2017
CZ19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
IT19.04.2017
LT19.04.2017
LV19.04.2017
MC19.04.2017
NL19.04.2017
PL19.04.2017
PT19.04.2017
RO19.04.2017
SE19.04.2017
SI19.04.2017
SK19.04.2017
TR19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2020/15]AT19.04.2017
CZ19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
IT19.04.2017
LT19.04.2017
LV19.04.2017
MC19.04.2017
NL19.04.2017
PL19.04.2017
RO19.04.2017
SE19.04.2017
SI19.04.2017
SK19.04.2017
TR19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2018/52]AT19.04.2017
CZ19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
IT19.04.2017
LT19.04.2017
LV19.04.2017
MC19.04.2017
NL19.04.2017
PL19.04.2017
RO19.04.2017
SE19.04.2017
SI19.04.2017
SK19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2018/25]AT19.04.2017
CZ19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
IT19.04.2017
LT19.04.2017
LV19.04.2017
NL19.04.2017
PL19.04.2017
RO19.04.2017
SE19.04.2017
SI19.04.2017
SK19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2018/11]AT19.04.2017
CZ19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
IT19.04.2017
LT19.04.2017
LV19.04.2017
NL19.04.2017
PL19.04.2017
RO19.04.2017
SE19.04.2017
SK19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2018/10]AT19.04.2017
CZ19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
LT19.04.2017
LV19.04.2017
NL19.04.2017
PL19.04.2017
RO19.04.2017
SE19.04.2017
SK19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2018/09]AT19.04.2017
DK19.04.2017
EE19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
LT19.04.2017
LV19.04.2017
NL19.04.2017
PL19.04.2017
SE19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2017/50]AT19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
LT19.04.2017
LV19.04.2017
NL19.04.2017
PL19.04.2017
SE19.04.2017
BG19.07.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2017/49]AT19.04.2017
ES19.04.2017
FI19.04.2017
HR19.04.2017
LT19.04.2017
NL19.04.2017
NO19.07.2017
GR20.07.2017
IS19.08.2017
Former [2017/48]NL19.04.2017
Documents cited:Search[A]US2005287738  (CHO SUNG-IL [KR], et al);
 [A]US2006024904  (WILSON AARON R [US]);
 [A]US2006099768  (YOKOI NAOKI [JP]);
 WO2010019343  [ ] (MICRON TECHNOLOGY INC [US], et al);
 [T]EP2313925  (MICRON TECHNOLOGY INC [US])
International search[A]US2005287795  (TOREK KEVIN [US], et al);
 [A]US2007148984  (ABATCHEV MIRZAFER K [US], et al);
 [A]KR20070098341  (HYNIX SEMICONDUCTOR INC [KR]);
 [A]KR20080001157  (HYNIX SEMICONDUCTOR INC [KR])
by applicantUS2005287738
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.